EPC2LC20EM

The EPC2LC20EM is a commercial-grade Field Programmable Gate Array (FPGA) IC from Intel. The supplied datasheet references the Cyclone FPGA family architecture, a 1.5-V, 0.13-μm SRAM-based process that targets cost-sensitive data-path and interface applications.

This device is suited for designs that require flexible programmable logic, configurable I/O standards, and on-chip clocking resources while operating within a commercial temperature range. It is RoHS compliant and supplied in surface-mount package options.

Key Features

• Core architecture (Cyclone family) — Based on a 1.5‑V, 0.13‑μm SRAM process; the Cyclone family provides a scalable FPGA fabric optimized for data-path applications.
• Logic density — Family-level densities range up to 20,060 logic elements, enabling mid-range to higher-density programmable logic implementations.
• Embedded memory — Cyclone devices include approximately 0.295 Mbits of embedded RAM (family-level reference), supporting on-chip data buffering and state storage for packet, signal, and control processing.
• I/O standards and high-speed interfaces — The family supports multiple I/O standards (LVTTL, LVCMOS, SSTL-2, SSTL-3) and high-speed serial/parallel I/O options, including LVDS up to 640 Mbps and RSDS support for panel and high-speed link applications.
• Memory and peripheral interfaces — Family-level support for DDR SDRAM, FCRAM, and SDR SDRAM interfaces and for 66‑ and 33‑MHz PCI configurations for system and peripheral integration.
• Clocking resources — Up to two PLLs per device and up to eight global clock lines (family-level), enabling clock multiplication, phase shifting, and flexible clock distribution.
• Configuration and testing — Supports configuration via low-cost serial configuration devices and includes JTAG boundary-scan for device testing and verification (family-level features).
• Packaging and mounting — Available in quad flat pack (QFP) and FineLine BGA package styles at the family level; this part is supplied for surface-mount assembly.
• Commercial temperature grade — Rated for 0 °C to 70 °C operation, suitable for commercial electronics environments.
• Regulatory — RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Data-path processing — Programmable logic fabric and on-chip RAM enable packet processing, protocol conversions, and mid-level data manipulation tasks.
• Memory interface controllers — Family-level support for DDR SDRAM and other external memory types makes the device suitable for memory controller implementation and buffering.
• High-speed I/O bridging — Support for LVDS and multiple I/O standards allows use in high-speed interface bridging, display link, or sensor data aggregation roles.
• Peripheral and bus interfacing — Support for 66‑ and 33‑MHz PCI and standard I/O levels enables integration with ASSPs, ASICs, and legacy peripheral interfaces.

Unique Advantages

• Scalable Cyclone architecture: Family-level density and I/O options allow migration between device sizes while retaining common architecture and tool support.
• Flexible I/O standards: Multiple supported I/O voltages and high-speed signaling options reduce external translator requirements and simplify board design.
• Integrated clocking: On-chip PLLs and global clock resources provide flexible timing strategies without extensive external clock management.
• On-chip memory for buffering: Approximately 0.295 Mbits of embedded RAM at the family level enables local buffering and state storage, reducing external memory dependency for many functions.
• Surface-mount packaging: Availability in common surface-mount QFP and FineLine BGA package styles supports compact PCB layouts and automated assembly.
• RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose EPC2LC20EM?

EPC2LC20EM brings the Cyclone family’s balance of programmable logic density, embedded memory, and flexible I/O to commercial electronic designs that need cost-efficient, configurable hardware. Its family-level features—on-chip PLLs, multiple I/O standards, and support for external memory interfaces—make it a practical choice for mid-range data-path, interface bridging, and control applications.

This Intel-sourced FPGA is suitable for engineering teams that require a configurable, surface-mount FPGA solution within a commercial temperature range and RoHS-compliant supply chain. Its family-level scalability and toolchain compatibility provide long-term design migration and support options.

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