EP4SGX70HF35I3N

The EP4SGX70HF35I3N is a Stratix® IV GX field-programmable gate array (FPGA) from Intel, delivered in a 1152-BBGA FCBGA package. It integrates substantial programmable logic, on-chip memory, and a high I/O count to support complex, board-level digital designs.

Designed for industrial environments, this device provides 72,600 logic elements, approximately 7.56 Mbits of embedded memory, and 488 I/Os. It operates from 870 mV to 930 mV supply and across a wide temperature range of -40 °C to 100 °C for robust operation in demanding conditions.

Key Features

• Programmable Logic — 72,600 logic elements for implementing custom digital functions, state machines, and complex datapaths.
• Embedded Memory — Approximately 7.56 Mbits of on-chip RAM to support buffering, FIFO structures, and local data storage without external memory.
• I/O Density — 488 general-purpose I/O pins to connect sensors, interfaces, and board-level peripherals with minimal external logic.
• Package — 1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35) for compact, high-pin-count board designs.
• Power — Low-voltage core operation with a supply range of 870 mV to 930 mV for core power domains.
• Industrial Temperature Range — Rated for -40 °C to 100 °C operation to meet industrial application requirements.
• Mounting and Compliance — Surface-mount device construction and RoHS-compliant material status.

Typical Applications

• Industrial Control Systems — Implements real-time control logic and I/O aggregation in factory automation and machine control where industrial temperature ratings are required.
• High-Density I/O Systems — Serves as a central programmable hub for systems that require many parallel interfaces or board-level signal routing.
• Memory-Intensive Logic — Uses the on-chip RAM for buffering, packet handling, or local data manipulation in embedded signal processing tasks.

Unique Advantages

• High Logic Capacity: 72,600 logic elements enable implementation of sizable custom functions and complex control algorithms without immediate need for additional FPGAs.
• Substantial On-Chip Memory: Approximately 7.56 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path requirements.
• Large I/O Count: 488 I/Os simplify board design by accommodating multiple interfaces and peripherals directly on the device.
• Industrial Reliability: Rated for -40 °C to 100 °C and supplied in a robust FCBGA package for long-term operation in industrial environments.
• Compact, High-Pin Package: 1152-FBGA (35×35) package supports high pin density in a compact form factor for space-constrained PCBs.
• Standards-Friendly Materials: RoHS-compliant construction supports restricted-substance requirements in manufacturing.

Why Choose EP4SGX70HF35I3N?

The EP4SGX70HF35I3N balances high programmable logic capacity, significant embedded memory, and a large I/O count in a single industrial-grade FPGA package. Its voltage and temperature operating ranges, combined with the 1152-BBGA footprint, make it suitable for compact, high-performance board-level designs that require reliable operation in challenging environments.

This device is appropriate for engineering teams developing industrial control, I/O-dense systems, or memory-heavy processing blocks who need a single, integrated FPGA solution backed by Intel's Stratix IV GX family architecture. Its combination of resources helps simplify BOM and board complexity while providing the scalability to support evolving design requirements.

Request a quote or submit an inquiry to receive pricing and availability for the EP4SGX70HF35I3N.