EP4SGX70HF35I4G

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 7564880 72600 1152-BBGA, FCBGA

Quantity 1,245 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2904Number of Logic Elements/Cells72600
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits7564880

Overview of EP4SGX70HF35I4G – Stratix® IV GX FPGA, 72,600 Logic Elements, 488 I/Os, 1152-FBGA

The EP4SGX70HF35I4G is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric with substantial embedded memory and a broad I/O count for system-level integration.

Designed for applications that require large logic capacity, extensive I/O, and robust operating conditions, this device addresses high-throughput communications, signal processing and industrial designs by combining logic resources, on-chip RAM and the Stratix IV family architecture features documented in the device handbook.

Key Features

  • Core Logic  Approximately 72,600 logic elements for implementing complex programmable logic and custom hardware functions.
  • Configurable Logic Blocks  2,904 CLBs for structured logic partitioning and design mapping (device CLB count as specified).
  • Embedded Memory  Approximately 7.56 Mbits of embedded memory (7,564,880 total RAM bits) to support buffering, packet processing and on-chip data storage.
  • I/O Capability  488 user I/Os to interface with external peripherals, memory, and transceivers; device family supports high-speed differential I/O features.
  • High-Speed Transceiver and I/O Features  Part of the Stratix IV GX device family that includes high-speed transceiver and differential I/O technologies and protocol support (see device handbook for family-level details).
  • DSP and Clocking  Support for dedicated digital signal processing blocks and extensive clock network/PLL resources as described for the Stratix IV family.
  • Package and Mounting  1152-FBGA (35×35) package, surface-mount mounting type for high-density board designs.
  • Power  Core voltage supply range of 870 mV to 930 mV for the device.
  • Operating Conditions  Industrial grade device with an operating temperature range of −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed communications and networking  Implements protocol logic, packet processing and interface bridging using the device’s logic density, embedded memory and family-level high-speed I/O features.
  • Signal processing and DSP systems  Leverages the Stratix IV family’s DSP block support and on-chip RAM for real-time filtering, transforms and data aggregation.
  • Memory interface and controller designs  Uses the device’s embedded memory and I/O resources to implement external memory controllers and high-throughput buffering.
  • Industrial systems  Suitable for industrial applications that require extended temperature range and an industrial-grade device profile.

Unique Advantages

  • High logic and memory capacity:  Approximately 72,600 logic elements and ~7.56 Mbits of embedded RAM to accommodate complex, memory-intensive designs on a single device.
  • Extensive I/O resources:  488 user I/Os support broad connectivity and system integration, reducing the need for external bridging components.
  • Stratix IV GX family capabilities:  Device benefits from family-level features such as high-speed transceiver support, advanced I/O options and a wide range of protocol support described in the device handbook.
  • Industrial-grade operating range:  −40 °C to 100 °C temperature rating for deployment in temperature-challenging environments.
  • Compact, high-density package:  1152-FBGA (35×35) package enables high pin-count and dense board layouts for space-constrained designs.
  • Low-voltage core operation:  870 mV–930 mV core supply supports integration into modern low-voltage power architectures.

Why Choose EP4SGX70HF35I4G?

The EP4SGX70HF35I4G positions itself as a high-capacity Stratix IV GX FPGA option for designs that require substantial logic resources, sizable on-chip memory and a large number of I/Os in an industrial-grade package. Its combination of logic elements, embedded RAM and family-level high-speed I/O capabilities make it suitable for demanding communications, signal processing and industrial control applications.

For teams designing systems that need scalability, robust temperature performance and deep integration of logic and memory on a single device, this Intel Stratix IV GX device provides a well-documented platform with architecture and feature information available in the Stratix IV device handbook.

If you would like pricing, availability or to request a formal quote for EP4SGX70HF35I4G, submit an inquiry or request a quote and our team will respond with details and next steps.

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