EPC2XXA

The EPC2XXA is a surface-mount, commercial-grade field programmable gate array (FPGA) IC from Intel. Product documentation references the Cyclone FPGA family architecture, which is built on a 1.5‑V, 0.13‑µm, all‑layer copper SRAM process and designed for cost‑effective data‑path and interface applications.

Typical Cyclone family capabilities described in the datasheet include a broad range of logic densities, on‑chip embedded memory, integrated clocking (PLLs) and support for multiple I/O standards and memory interfaces—features that help designers implement high‑performance interfaces and customized logic in compact, RoHS‑compliant surface‑mount packages.

Key Features

• Core architecture — Based on a 1.5‑V, 0.13‑µm SRAM process; family densities span from 2,910 to 20,060 logic elements, enabling designs from entry-level to higher‑density implementations.
• Embedded memory — Up to 294,912 bits of on‑chip RAM (approximately 0.295 Mbits), suitable for local buffering and small data storage needs.
• Clocking and timing — Devices in the referenced family provide up to two phase‑locked loops (PLLs) for clock multiplication and phase shifting, and up to eight global clock lines for flexible timing architectures.
• High‑speed I/O support — Family documentation cites support for LVDS at data rates up to 640 Mbps, low‑speed LVDS, and 311‑Mbps RSDS; the family also supports common I/O standards including LVTTL, LVCMOS, SSTL‑2 and SSTL‑3.
• Memory and bus interfaces — The family includes dedicated support for DDR SDRAM, FCRAM and SDR SDRAM interfaces and lists compatibility with 66‑ and 33‑MHz, 64‑ and 32‑bit PCI standards for peripheral interfacing.
• Package and mounting — Available in quad flat pack (QFP) and FineLine BGA packages; EPC2XXA is specified for surface‑mount assembly.
• Regulatory and grade — Commercial grade device; RoHS compliant.

Typical Applications

• Data‑path processing — Implement custom data pipelines, parallel processing blocks or protocol conversion logic where flexible logic density and embedded RAM are required.
• Memory interface controllers — Build DDR/SDR memory controllers and glue logic for external DRAM and FCRAM using the family’s documented memory interface support.
• High‑speed serial links — Support LVDS‑based I/O and RSDS signaling for video, sensor or high‑speed link applications that require multi‑standard I/O.
• ASSP/ASIC interfacing and glue logic — Use the FPGA to bridge ASSP/ASIC devices, implement custom timing and bus conversions, and prototype ASIC functionality.

Unique Advantages

• Flexible density options — A broad range of logic element counts lets teams scale from small to larger designs without changing architecture intent.
• Integrated clocking resources — On‑chip PLLs and multiple global clock lines simplify clock distribution and enable phase and frequency adjustments without external components.
• Multi‑standard I/O support — Support for LVDS, LVTTL, LVCMOS and SSTL families provides design flexibility when interfacing with diverse external devices.
• Memory interface capability — Native support for DDR and SDR memory families reduces system complexity for applications requiring external DRAM.
• Migration and design portability — The referenced Cyclone family documentation describes vertical migration and pin‑cross‑reference tooling to ease scaling across densities and packages.
• RoHS compliant, surface‑mount package — Suits modern PCB assembly and regulatory preferences for commercial designs.

Why Choose EPC2XXA?

EPC2XXA combines the proven Cyclone FPGA family architecture with commercial‑grade qualification and surface‑mount packaging to address a wide range of interface, memory and data‑path applications. The family‑level features—ranging from flexible logic densities and embedded RAM to integrated PLLs and multi‑standard I/O—provide a practical balance of integration and system‑level flexibility.

This part is aimed at designers and procurement teams building cost‑sensitive commercial products that require scalable FPGA resources, supported migration paths across device densities and documented toolflow assistance for pin mapping and migration.

Request a quote or submit an inquiry to obtain pricing and availability for EPC2XXA. Our team can provide ordering information and additional documentation to support your design evaluation and procurement process.