EPF10K100ABC356-3

The EPF10K100ABC356-3 is a FLEX 10KA family field-programmable gate array intended for commercial embedded and system-level designs. It combines an embedded array for implementing megafunctions with a general-purpose logic array to enable System-on-a-Programmable-Chip (SOPC) integration.

With 4,992 logic elements, 624 logic array blocks (LABs), approximately 24,576 bits of on-chip RAM, and 274 user I/Os in a 356-ball LGA package, this device targets high-density logic integration, reconfigurable peripheral functions, and applications that require flexible I/O and on-board memory resources while operating from a 3.0 V–3.6 V supply.

Key Features

• Core Architecture  Embedded programmable logic with a dedicated logic array and embedded array blocks for megafunctions, enabling SOPC-style integration.
• Logic Density  4,992 logic elements and 624 LABs providing a foundation for medium-to-high complexity logic implementations; listed device gate capacity corresponds to the FLEX 10K family scale.
• On-chip Memory  24,576 total RAM bits of embedded memory (approximately 0.0246 Mbits) for buffering, registers, and memory-mapped megafunctions without reducing core logic capacity.
• I/O and Interfacing  274 user I/O pins to support broad peripheral interfacing and system connectivity in the 356-LBGA package.
• Package & Mounting  356-LBGA (356-BGA 35×35) surface-mount package that maximizes board area efficiency while supporting high pin count designs.
• Power & Temperature  Operates from a 3.0 V to 3.6 V supply and rated for commercial operating temperatures from 0 °C to 70 °C.
• System Features  Family-level capabilities include in-circuit reconfigurability, built-in JTAG boundary-scan, FastTrack interconnect, dedicated carry and cascade chains, and clock-management features (ClockLock/ClockBoost) for reduced skew and advanced timing control.
• Compliance  RoHS compliant and provided in a commercial-grade device classification.

Typical Applications

• Embedded System Integration  Use as a programmable logic hub for SOPC implementations, consolidating peripheral logic and custom functions on a single device.
• PCI and Bus Interface Modules  Suitable for implementing local bus peripherals and custom interface logic where flexible I/O and reconfigurable logic are required.
• Memory and Buffering Functions  On-chip RAM and embedded array blocks support buffering, FIFOs, and small memory-mapped functions for data staging and protocol handling.
• Prototyping and In-Circuit Reconfigurable Designs  In-circuit reconfigurability and JTAG boundary-scan make the device useful for iterative design cycles, prototyping, and firmware-upgradable hardware functions.

Unique Advantages

• Integrated SOPC Capability: Combines embedded arrays and general logic to simplify system-level integration and reduce external component count.
• Balanced Logic and Memory: Nearly 5k logic elements paired with 24,576 bits of embedded RAM supports mixed logic-plus-buffer implementations without external memory in many use cases.
• High I/O Count in Compact Package: 274 user I/Os in a 356-LBGA package provide dense connectivity while conserving PCB area.
• Reconfigurable Development Flow: Built-in JTAG and support for in-circuit reconfiguration allow flexible field updates and iterative development.
• Vendor Toolchain Support: The FLEX 10K family is supported by Altera development systems for design entry, place-and-route, and megafunction integration, helping accelerate time-to-prototype.
• Regulatory and Assembly Friendly: RoHS-compliant surface-mount package suitable for modern assembly processes and environmental requirements.

Why Choose EPF10K100ABC356-3?

The EPF10K100ABC356-3 positions itself as a flexible, medium‑to‑high density programmable logic device for commercial embedded and system applications that need a mix of configurable logic, embedded memory, and abundant I/O in a compact BGA footprint. Its family-level architecture supports megafunctions, dedicated arithmetic/cascade chains, clock management features, and in-circuit reconfigurability to accelerate complex designs and enable field updates.

This part is well suited to teams building commercial embedded systems, interface peripherals, and reconfigurable subsystems that benefit from vendor-supported design tools and a compact, high‑I/O package. Its combination of logic elements, RAM, and system features delivers scalability for evolving hardware requirements while simplifying board-level integration.

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