EPF10K100ABC356-3N

The EPF10K100ABC356-3N is a FLEX 10KA family embedded programmable logic device offering a balance of on-chip logic, embedded memory, and high I/O density. Its architecture combines a logic array with embedded memory arrays to support megafunctions and system-level integration.

Targeted at commercial designs that need reconfigurable logic, significant I/O, and on-chip RAM, this device delivers reconfigurability, multi-volt I/O support, and standard boundary-scan for development and in-system configuration.

Key Features

• Core Logic — Approximately 4,992 logic elements enabling mid-density programmable logic implementations; supports dedicated carry and cascade chains for arithmetic and high-fan-in functions.
• On-chip Memory — 24,576 bits of embedded RAM for buffering, FIFOs, and megafunctions without reducing logic capacity.
• Gate Count — Up to 158,000 maximum system gates for combining logic and RAM resources in complex designs.
• I/O and Voltage Support — 274 user I/O pins with MultiVolt I/O interface support; device operates from 3.0 V to 3.6 V and FLEX 10KA devices include 5.0-V tolerant input pin capability as described in the family datasheet.
• Configuration and Test — In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan circuitry compliant with IEEE Std. 1149.1-1990.
• Interconnect and Timing — FastTrack® continuous routing structure for predictable interconnect delays and built-in low-skew clock distribution trees; ClockLock™ and ClockBoost™ options referenced in the family data.
• Package and Mounting — 356-LBGA package (356-BGA, 35×35 mm) optimized for board space efficiency; surface-mount mounting type.
• Operating Range and Compliance — Commercial grade with an operating temperature range of 0 °C to 70 °C and RoHS-compliant status.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) designs — Use embedded arrays and logic to implement integrated megafunctions and system-level glue logic.
• PCI-based peripherals — FLEX 10K/10KA family support for PCI Local Bus Specification (Revision 2.2) and selectable pull-up/clamping options for 3.3-V PCI compliance make the device suitable for PCI endpoint logic and interface bridging.
• High-I/O protocol bridging — The high pin count and MultiVolt I/O allow protocol translation and high-density peripheral interfacing.
• On-board buffering and specialized logic — Embedded RAM and dedicated arithmetic/cascade chains enable efficient implementation of FIFOs, buffers, and custom processing blocks.

Unique Advantages

• Balanced logic and memory — Combines ~4,992 logic elements with 24,576 bits of embedded RAM to implement complex functions without external SRAM for many use cases.
• High I/O density — 274 user I/Os provide flexibility for multi-interface designs and high-pin-count peripherals.
• Reconfigurability in-system — Supports in-circuit reconfiguration and JTAG-based programming for rapid development cycles and field updates.
• Predictable timing infrastructure — FastTrack routing, dedicated carry/cascade chains, and low-skew clock trees simplify timing closure for arithmetic and high-speed logic paths.
• Compact packaging — 356-LBGA (35×35) package maximizes board space efficiency while delivering the device’s I/O and logic resources.
• Standards-oriented development — Built-in IEEE 1149.1 boundary-scan test and family-level support for PCI reduce system-level integration effort.

Why Choose EPF10K100ABC356-3N?

The EPF10K100ABC356-3N positions itself as a mid-to-high-density FLEX 10KA device that brings together a substantial logic element count, embedded RAM, and a large number of I/Os in a compact 356-LBGA package. Its support for MultiVolt I/O, in-circuit reconfiguration, and industry-standard JTAG testability aligns it to designs that require flexible, field-configurable logic with predictable interconnect and clocking options.

This device is well-suited for commercial embedded designs that benefit from integrated megafunctions and a vendor-supported development ecosystem. It provides scalability and integration advantages for engineering teams looking to consolidate functions, simplify board-level design, and accelerate system-level development.

Request a quote or submit an RFQ to receive pricing and availability for EPF10K100ABC356-3N and to discuss lead times and procurement options.