EPF10K100ABC356-2N

IC FPGA 274 I/O 356BGA
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 274 24576 4992 356-LBGA

Quantity 846 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O274Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates158000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K100ABC356-2N – FLEX-10KA Field Programmable Gate Array, 356-LBGA

The EPF10K100ABC356-2N is a FLEX 10KA family field programmable gate array (FPGA) device that combines an embedded array for megafunctions with a general-purpose logic array. It targets commercial embedded designs that require reconfigurable logic, embedded memory, and high I/O density in a compact surface-mount package.

As a member of the FLEX 10K family, the device supports system-level features such as in-circuit reconfigurability and JTAG boundary-scan, making it suitable for applications that need configurable logic and on-board memory integration while maintaining commercial-grade operating conditions.

Key Features

  • Core architecture  Embedded programmable logic with separate embedded array for implementing megafunctions and a logic array for general logic functions, consistent with the FLEX 10K family architecture.
  • Logic capacity  Approximately 158,000 gates, with 4,992 logic elements and 624 logic array blocks (LABs) to support mid-density logic implementations.
  • Embedded memory  24,576 total RAM bits (approximately 0.0246 Mbits) providing on-chip storage for buffers, FIFOs, and small look-up tables.
  • I/O and package  274 user I/O pins in a 356-LBGA surface-mount package (356-BGA, 35×35), enabling dense board-level integration and high pin count in a compact footprint.
  • Power and supply  Operates from a 3.0 V to 3.6 V supply range, suitable for 3.3 V commercial systems.
  • System-level features  In-circuit reconfigurability (ICR) via external configuration device or JTAG, built-in JTAG boundary-scan (IEEE Std. 1149.1-1990), and on-chip clock features such as low-skew distribution and ClockLock/ClockBoost options described for the FLEX 10K family.
  • Package & mounting  Surface-mount 356-LBGA with FineLine BGA package options and package pin-compatibility across FLEX 10K devices in the same package.
  • Operating range & grade  Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded control  Implement custom control logic, state machines, and timing-critical processing for commercial embedded products.
  • Interface bridging  Bridge or glue-logic between different digital peripherals using the device’s high I/O count and reconfigurable logic.
  • Prototyping and development  Rapidly prototype custom logic functions and memory-backed megafunctions using in-circuit reconfigurability and JTAG access.
  • Specialized logic and memory functions  Implement small on-chip buffers, FIFOs, and lookup tables using the embedded RAM and logic element resources.

Unique Advantages

  • Scalable FLEX 10K architecture  Leverages the FLEX 10K family design elements—embedded arrays plus general logic—to simplify implementation of combined logic and memory megafunctions.
  • High I/O density in a compact package  274 I/O in a 356-LBGA (35×35) enables rich peripheral interfacing without a large PCB footprint.
  • On-board memory for faster integration  24,576 bits of total RAM reduce external memory needs for small buffers and control data structures.
  • Design and test friendliness  JTAG boundary-scan and support for in-circuit reconfiguration streamline development, testing, and field updates.
  • Commercial-grade suitability  Specified for 0 °C to 70 °C operation and a 3.0–3.6 V supply range to match common commercial system environments.
  • RoHS compliance  Environmentally compliant for modern manufacturing processes.

Why Choose EPF10K100ABC356-2N?

The EPF10K100ABC356-2N delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact 356-LBGA package, making it a practical choice for commercial embedded designs that require reconfigurable logic and on-chip storage. Its inclusion in the FLEX 10K family brings system-oriented features such as in-circuit reconfigurability, JTAG boundary-scan, and on-chip clock management to help simplify integration and validation.

This device is well suited for engineers and procurement teams building commercial products that need scalable logic capacity, pin-compatible package options within the FLEX 10K family, and standard operating conditions. The combination of resources and package density offers a straightforward path for designs that demand configurable logic and moderate embedded memory in a surface-mount form factor.

Request a quote for EPF10K100ABC356-2N to evaluate pricing and availability for your next design.

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