EPF10K100ABC356-2N
| Part Description |
FLEX-10KA® Field Programmable Gate Array (FPGA) IC 274 24576 4992 356-LBGA |
|---|---|
| Quantity | 846 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 356-BGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 356-LBGA | Number of I/O | 274 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 158000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 24576 |
Overview of EPF10K100ABC356-2N – FLEX-10KA Field Programmable Gate Array, 356-LBGA
The EPF10K100ABC356-2N is a FLEX 10KA family field programmable gate array (FPGA) device that combines an embedded array for megafunctions with a general-purpose logic array. It targets commercial embedded designs that require reconfigurable logic, embedded memory, and high I/O density in a compact surface-mount package.
As a member of the FLEX 10K family, the device supports system-level features such as in-circuit reconfigurability and JTAG boundary-scan, making it suitable for applications that need configurable logic and on-board memory integration while maintaining commercial-grade operating conditions.
Key Features
- Core architecture Embedded programmable logic with separate embedded array for implementing megafunctions and a logic array for general logic functions, consistent with the FLEX 10K family architecture.
- Logic capacity Approximately 158,000 gates, with 4,992 logic elements and 624 logic array blocks (LABs) to support mid-density logic implementations.
- Embedded memory 24,576 total RAM bits (approximately 0.0246 Mbits) providing on-chip storage for buffers, FIFOs, and small look-up tables.
- I/O and package 274 user I/O pins in a 356-LBGA surface-mount package (356-BGA, 35×35), enabling dense board-level integration and high pin count in a compact footprint.
- Power and supply Operates from a 3.0 V to 3.6 V supply range, suitable for 3.3 V commercial systems.
- System-level features In-circuit reconfigurability (ICR) via external configuration device or JTAG, built-in JTAG boundary-scan (IEEE Std. 1149.1-1990), and on-chip clock features such as low-skew distribution and ClockLock/ClockBoost options described for the FLEX 10K family.
- Package & mounting Surface-mount 356-LBGA with FineLine BGA package options and package pin-compatibility across FLEX 10K devices in the same package.
- Operating range & grade Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded control Implement custom control logic, state machines, and timing-critical processing for commercial embedded products.
- Interface bridging Bridge or glue-logic between different digital peripherals using the device’s high I/O count and reconfigurable logic.
- Prototyping and development Rapidly prototype custom logic functions and memory-backed megafunctions using in-circuit reconfigurability and JTAG access.
- Specialized logic and memory functions Implement small on-chip buffers, FIFOs, and lookup tables using the embedded RAM and logic element resources.
Unique Advantages
- Scalable FLEX 10K architecture Leverages the FLEX 10K family design elements—embedded arrays plus general logic—to simplify implementation of combined logic and memory megafunctions.
- High I/O density in a compact package 274 I/O in a 356-LBGA (35×35) enables rich peripheral interfacing without a large PCB footprint.
- On-board memory for faster integration 24,576 bits of total RAM reduce external memory needs for small buffers and control data structures.
- Design and test friendliness JTAG boundary-scan and support for in-circuit reconfiguration streamline development, testing, and field updates.
- Commercial-grade suitability Specified for 0 °C to 70 °C operation and a 3.0–3.6 V supply range to match common commercial system environments.
- RoHS compliance Environmentally compliant for modern manufacturing processes.
Why Choose EPF10K100ABC356-2N?
The EPF10K100ABC356-2N delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact 356-LBGA package, making it a practical choice for commercial embedded designs that require reconfigurable logic and on-chip storage. Its inclusion in the FLEX 10K family brings system-oriented features such as in-circuit reconfigurability, JTAG boundary-scan, and on-chip clock management to help simplify integration and validation.
This device is well suited for engineers and procurement teams building commercial products that need scalable logic capacity, pin-compatible package options within the FLEX 10K family, and standard operating conditions. The combination of resources and package density offers a straightforward path for designs that demand configurable logic and moderate embedded memory in a surface-mount form factor.
Request a quote for EPF10K100ABC356-2N to evaluate pricing and availability for your next design.

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