EPC2LI20NGA

IC FPGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,818 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device PackageN/AGradeIndustrialOperating Temperature-40°C – 85°C
Package / CaseN/ANumber of I/ON/AVoltageN/A
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/CellsN/A
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM BitsN/A

Overview of EPC2LI20NGA – Field Programmable Gate Array (FPGA) IC

The EPC2LI20NGA is a Field Programmable Gate Array (FPGA) IC from Intel designed for surface-mount, industrial applications. The product references the Cyclone device family architecture described in the available datasheet, which is based on a 1.5‑V, 0.13‑µm, all‑layer copper SRAM process and targets data-path and I/O‑intensive designs.

Engineered for embedded and industrial systems, this FPGA supports a range of high‑speed interfaces, configurable clocking resources, and on‑chip memory capabilities as described for the Cyclone family. It is RoHS compliant and specified for operation from −40 °C to 85 °C.

Key Features

  • Surface-Mount Package Designed for surface-mount assembly to support modern PCBA workflows and automated production.
  • Industrial Temperature Grade Rated for operation from −40 °C to 85 °C, suitable for industrial environment deployments.
  • RoHS Compliant Conforms to RoHS requirements for lead‑free assembly and regulatory compliance.
  • Cyclone Family Architecture Based on the Cyclone device family described in the datasheet, which uses a 1.5‑V, 0.13‑µm SRAM process and provides flexible logic densities up to 20,060 logic elements (LEs).
  • Embedded Memory Cyclone family devices include substantial on‑chip RAM resources (up to approximately 294,912 bits of RAM reported in the family datasheet) for data buffering and state storage.
  • Clocking and PLLs The Cyclone family architecture provides up to two PLLs per device for clock multiplication and phase shifting to support complex timing requirements.
  • High‑Speed I/O Support Family-level support includes multiple I/O standards and high‑speed options such as LVDS (with data rates referenced in the Cyclone datasheet), enabling robust interface design.
  • Memory Interface Support The Cyclone family includes features for external memory interfaces, including DDR SDRAM and other common memory types, to support high‑bandwidth applications.

Typical Applications

  • Data-Path Processing Ideal for implementations requiring configurable logic and on‑chip memory to process streaming or packetized data.
  • High-Speed Interfaces Suited for designs that need LVDS or other high‑speed signaling and flexible I/O standards for board‑to‑board or chip‑to‑chip communication.
  • Memory Subsystem Controllers Useful in applications that require custom memory controllers or bridging to external DDR SDRAM and related memories.
  • Embedded Industrial Systems Applicable to industrial control, instrumentation, and sensor aggregation systems that benefit from reprogrammable logic and an extended operating temperature range.

Unique Advantages

  • Flexible Integration: Surface-mount packaging and family-level support for multiple I/O standards simplify board‑level integration across diverse applications.
  • Configurable Performance: The Cyclone architecture’s scalable logic element densities let designers balance logic capacity and cost for their target application.
  • On-Chip Resources: Significant embedded RAM and PLL resources reduce the need for external components, lowering BOM and simplifying timing management.
  • Industrial Reliability: Rated for −40 °C to 85 °C operation to meet the demands of industrial environments where extended temperature tolerance is required.
  • Standards and Ecosystem: The Cyclone family documentation references support for common interfaces and tools, providing a clear development path for designers.

Why Choose EPC2LI20NGA?

EPC2LI20NGA brings Intel’s FPGA technology into surface-mount, industrial-grade applications. By leveraging the Cyclone family architecture and its on‑chip memory, PLLs, and flexible I/O support, this FPGA is positioned for designs that require configurable logic, interface adaptability, and reliable operation across an extended temperature range.

This device is suited to engineering teams building data-path, interface, and industrial control solutions who need a programmable, RoHS‑compliant FPGA platform with documented family-level features and toolchain support referenced in the Cyclone datasheet.

Request a quote or submit an inquiry to receive pricing and availability information for EPC2LI20NGA and to discuss how it fits your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up