EPC2LI20NGA
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,818 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | N/A | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | N/A | Number of I/O | N/A | Voltage | N/A | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | N/A | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | N/A |
Overview of EPC2LI20NGA – Field Programmable Gate Array (FPGA) IC
The EPC2LI20NGA is a Field Programmable Gate Array (FPGA) IC from Intel designed for surface-mount, industrial applications. The product references the Cyclone device family architecture described in the available datasheet, which is based on a 1.5‑V, 0.13‑µm, all‑layer copper SRAM process and targets data-path and I/O‑intensive designs.
Engineered for embedded and industrial systems, this FPGA supports a range of high‑speed interfaces, configurable clocking resources, and on‑chip memory capabilities as described for the Cyclone family. It is RoHS compliant and specified for operation from −40 °C to 85 °C.
Key Features
- Surface-Mount Package Designed for surface-mount assembly to support modern PCBA workflows and automated production.
- Industrial Temperature Grade Rated for operation from −40 °C to 85 °C, suitable for industrial environment deployments.
- RoHS Compliant Conforms to RoHS requirements for lead‑free assembly and regulatory compliance.
- Cyclone Family Architecture Based on the Cyclone device family described in the datasheet, which uses a 1.5‑V, 0.13‑µm SRAM process and provides flexible logic densities up to 20,060 logic elements (LEs).
- Embedded Memory Cyclone family devices include substantial on‑chip RAM resources (up to approximately 294,912 bits of RAM reported in the family datasheet) for data buffering and state storage.
- Clocking and PLLs The Cyclone family architecture provides up to two PLLs per device for clock multiplication and phase shifting to support complex timing requirements.
- High‑Speed I/O Support Family-level support includes multiple I/O standards and high‑speed options such as LVDS (with data rates referenced in the Cyclone datasheet), enabling robust interface design.
- Memory Interface Support The Cyclone family includes features for external memory interfaces, including DDR SDRAM and other common memory types, to support high‑bandwidth applications.
Typical Applications
- Data-Path Processing Ideal for implementations requiring configurable logic and on‑chip memory to process streaming or packetized data.
- High-Speed Interfaces Suited for designs that need LVDS or other high‑speed signaling and flexible I/O standards for board‑to‑board or chip‑to‑chip communication.
- Memory Subsystem Controllers Useful in applications that require custom memory controllers or bridging to external DDR SDRAM and related memories.
- Embedded Industrial Systems Applicable to industrial control, instrumentation, and sensor aggregation systems that benefit from reprogrammable logic and an extended operating temperature range.
Unique Advantages
- Flexible Integration: Surface-mount packaging and family-level support for multiple I/O standards simplify board‑level integration across diverse applications.
- Configurable Performance: The Cyclone architecture’s scalable logic element densities let designers balance logic capacity and cost for their target application.
- On-Chip Resources: Significant embedded RAM and PLL resources reduce the need for external components, lowering BOM and simplifying timing management.
- Industrial Reliability: Rated for −40 °C to 85 °C operation to meet the demands of industrial environments where extended temperature tolerance is required.
- Standards and Ecosystem: The Cyclone family documentation references support for common interfaces and tools, providing a clear development path for designers.
Why Choose EPC2LI20NGA?
EPC2LI20NGA brings Intel’s FPGA technology into surface-mount, industrial-grade applications. By leveraging the Cyclone family architecture and its on‑chip memory, PLLs, and flexible I/O support, this FPGA is positioned for designs that require configurable logic, interface adaptability, and reliable operation across an extended temperature range.
This device is suited to engineering teams building data-path, interface, and industrial control solutions who need a programmable, RoHS‑compliant FPGA platform with documented family-level features and toolchain support referenced in the Cyclone datasheet.
Request a quote or submit an inquiry to receive pricing and availability information for EPC2LI20NGA and to discuss how it fits your next design.

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