EPF10K100ABC600-3

The EPF10K100ABC600-3 is a FLEX-10KA family embedded programmable logic device from Intel, offering a high-density FPGA option with on-chip embedded memory and a large I/O count. It combines a dedicated logic array and embedded array blocks to support integration of megafunctions and general-purpose logic in a single device.

Engineered for SOPC-style integration and complex glue logic, this device is suitable for designs that need substantial logic capacity, embedded RAM, and flexible I/O in a 600-ball BGA package.

Key Features

• Logic Capacity — 4,992 logic elements supporting a complex mix of custom logic functions; the device is specified with approximately 158,000 gates of logic and RAM capacity.
• Embedded Memory — 24,576 total RAM bits (approximately 0.025 Mbits) of on-chip RAM available for FIFOs, buffers, and megafunctions.
• I/O and Interconnect — 406 user I/O pins to support broad external interfacing; the FLEX 10KA family also provides flexible interconnect structures and dedicated carry/cascade chains as described in the family datasheet.
• System Integration Features — Series-level capabilities include in-circuit reconfigurability (via external configuration device or JTAG), JTAG boundary-scan support, and architecture elements intended for SOPC integration and megafunction implementation.
• Package and Mounting — 600-ball BGA (45 × 45 mm) surface-mount package for high-density board implementations.
• Power and Voltage — Device operates from a 3.0 V to 3.6 V supply range.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Compliance — RoHS compliant.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) designs — Integrate custom logic and on-chip memory for consolidated system functions using embedded array blocks and general logic resources.
• Memory-intensive megafunctions — Use the device’s 24,576 bits of RAM for FIFOs, small buffers, and other on-chip memory needs.
• High-I/O interface controllers — 406 user I/O pins provide connectivity for multi-channel interfaces, peripheral control, and external bus bridging.
• FPGA-based prototyping and glue logic — Dense logic and flexible routing enable rapid prototyping and complex glue logic between subsystems.

Unique Advantages

• High integration density: 4,992 logic elements and approximately 158,000 gates of logic/RAM capacity reduce the need for multiple discrete devices.
• On-chip embedded memory: 24,576 bits of RAM simplify designs that require local buffering or small data stores without external memory.
• Large I/O footprint: 406 user I/O pins enable broad external connectivity and flexible board partitioning.
• Surface-mount BGA packaging: 600-ball (45 × 45 mm) BGA provides a compact footprint for high-density PCB layouts.
• System-level features from the FLEX 10KA family: Family characteristics such as in-circuit reconfigurability and JTAG boundary-scan support help streamline development and test.
• RoHS compliant and commercial grade: Meets RoHS requirements and is specified for commercial temperature operation (0 °C to 70 °C), appropriate for consumer and general-purpose embedded applications.

Why Choose EPF10K100ABC600-3?

The EPF10K100ABC600-3 positions itself as a practical, high-density programmable logic option for designers who need substantial logic resources, embedded RAM, and a large number of I/Os in a single package. Its FLEX-10KA family features support SOPC-style integration and in-circuit reconfigurability, enabling consolidated system designs and flexible development flows.

This device is well suited for teams building prototyping platforms, interface controllers, and compact embedded systems that benefit from a combination of logic density, on-chip memory, and comprehensive family-level tool support.

Request a quote or submit a pricing and availability inquiry to get started with the EPF10K100ABC600-3 for your design.