EP4SGX70HF35I3

The EP4SGX70HF35I3 is a Stratix® IV GX field programmable gate array (FPGA) provided in a 1152-ball fine-pitch BGA package. It delivers a high logic element count and substantial on-chip memory for designs that require dense programmable logic and plentiful embedded RAM.

With 72,600 logic elements, approximately 7.56 Mbits of embedded memory, 488 I/O pins, and an industrial operating temperature range, this device is suited to applications that demand high integration, significant on-chip resources, and wide environmental tolerance.

Key Features

• Core Logic  72,600 logic elements provide substantial programmable logic capacity for complex digital functions and custom IP integration.
• Embedded Memory  Approximately 7.56 Mbits of on-chip RAM to support large buffering, state machines, and data-path storage without external memory.
• I/O Capacity  488 user I/Os to support multi-channel interfaces, parallel buses, and connectivity to peripherals or daughter cards.
• Power Supply  Supported core voltage range from 870 mV to 930 mV for the device’s internal power domains.
• Package & Mounting  1152-BBGA (FCBGA) supplier package (1152-FBGA, 35×35) in a surface-mount format for compact, high-density board designs.
• Temperature & Grade  Industrial grade device specified for an operating temperature range of −40 °C to 100 °C to meet harsher environmental requirements.
• Regulatory Compliance  RoHS compliant, supporting lead-free assembly and environmental compliance goals.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded RAM for complex signal processing, packet handling, or custom compute pipelines.
• Multi-interface bridging  Leverage 488 I/Os to implement protocol conversion, bus bridging, or aggregation of multiple peripheral interfaces.
• Industrial control systems  Industrial grade temperature range and robust packaging make the device suitable for control, automation, and instrumentation designs operating across wide temperatures.

Unique Advantages

• High logic density: 72,600 logic elements enable implementation of large-scale custom logic and multiple concurrent functions on a single device.
• Substantial on-chip RAM: Approximately 7.56 Mbits of embedded memory reduces dependence on external memory for buffering and state storage, simplifying board design.
• Extensive I/O resources: 488 I/Os provide flexibility for parallel interfaces, multi-lane connections, and peripheral-rich system designs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in environments with wide temperature swings.
• Compact BGA packaging: 1152-ball FCBGA enables dense PCB layouts while maintaining high pin count for complex systems.
• RoHS compliance: Meets lead-free assembly requirements for regulatory and environmental programs.

Why Choose EP4SGX70HF35I3?

The EP4SGX70HF35I3 positions itself as a high-capacity Stratix IV GX FPGA option that balances large programmable logic resources, considerable embedded RAM, and extensive I/O in a single, compact FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and control applications where board space and on-chip resources are priorities.

This device is well suited to designers who need significant on-chip logic and memory to consolidate functions, reduce external components, and implement complex interface and processing tasks within a single FPGA footprint.

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