EP4SGX70HF35C4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 7564880 72600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,553 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2904 | Number of Logic Elements/Cells | 72600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7564880 |
Overview of EP4SGX70HF35C4N – Stratix® IV GX FPGA, 72,600 logic elements, 488 I/O, 1152-FBGA
The EP4SGX70HF35C4N is a Stratix® IV GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers a high logic element count, abundant embedded memory, and a large I/O complement for complex digital designs.
Targeted at applications that require substantial programmable logic and on-chip memory, the device is documented in a comprehensive device handbook that includes electrical characteristics, switching specifications, transceiver performance, PLL and DSP block specifications, and configuration/JTAG information.
Key Features
- Core logic — 72,600 logic elements provide the programmable fabric for implementing complex digital functions and custom datapaths.
- Embedded memory — Approximately 7.56 Mbits of on-chip RAM to support buffering, FIFOs, and implemented algorithms.
- I/O and interfaces — 488 general-purpose I/O pins to support broad peripheral and interface connectivity.
- Transceiver and high-speed documentation — Device handbook includes sections on transceiver performance specifications and datapath latency, facilitating system-level integration and validation.
- Package and mounting — Supplied in a 1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA case) for dense board-level integration.
- Power — Core supply operating range from 870 mV to 930 mV to match system power-rail design requirements.
- Operating environment — Commercial temperature grade with an operating range of 0°C to 85°C.
- Compliance — RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Communications infrastructure — Use the device’s documented transceiver and high-logic density to implement packet processing, protocol offload, and interface bridging.
- High-performance signal processing — Leverage the large logic count and embedded memory for video, imaging, and DSP-based algorithms.
- Compute acceleration and prototyping — Deploy as a programmable accelerator or development platform where significant on-chip logic and RAM are required.
- Custom interface and I/O aggregation — 488 I/O pins enable complex multi-interface gateways and protocol converters.
Unique Advantages
- High logic density: 72,600 logic elements enable implementation of large state machines, wide datapaths, and deep pipelined designs.
- Substantial embedded memory: Approximately 7.56 Mbits of on-chip RAM reduces external memory dependence for buffering and fast local storage.
- Large I/O count: 488 I/O provides flexibility for system integration and multiple peripheral interfaces.
- Comprehensive technical documentation: Device handbook coverage of DC/switching characteristics, PLLs, DSP blocks, transceivers, and configuration eases design validation and system integration.
- Board-level integration: 1152-FBGA (35×35) surface-mount package supports dense PCB layouts and standardized assembly processes.
- Commercial temperature and RoHS compliance: Suitable for commercial applications within 0°C to 85°C and aligns with RoHS manufacturing requirements.
Why Choose EP4SGX70HF35C4N?
The EP4SGX70HF35C4N positions itself as a high-capacity Stratix IV GX FPGA that balances significant programmable logic, embedded memory, and a large I/O complement in a compact 1152-ball FCBGA package. Its documented transceiver, PLL, DSP, and memory block specifications make it suitable for system designs that need detailed electrical and performance guidance during integration.
This device is well suited to development teams and product designers building communications, signal-processing, and compute-acceleration solutions who require a documented, high-density FPGA with clearly defined power and thermal operating parameters and RoHS compliance.
Request a quote or submit an inquiry to check availability and pricing for EP4SGX70HF35C4N and to discuss how this Stratix IV GX FPGA can fit your next design.

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