EP4SGX70HF35C4N

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 7564880 72600 1152-BBGA, FCBGA

Quantity 1,553 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2904Number of Logic Elements/Cells72600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7564880

Overview of EP4SGX70HF35C4N – Stratix® IV GX FPGA, 72,600 logic elements, 488 I/O, 1152-FBGA

The EP4SGX70HF35C4N is a Stratix® IV GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers a high logic element count, abundant embedded memory, and a large I/O complement for complex digital designs.

Targeted at applications that require substantial programmable logic and on-chip memory, the device is documented in a comprehensive device handbook that includes electrical characteristics, switching specifications, transceiver performance, PLL and DSP block specifications, and configuration/JTAG information.

Key Features

  • Core logic — 72,600 logic elements provide the programmable fabric for implementing complex digital functions and custom datapaths.
  • Embedded memory — Approximately 7.56 Mbits of on-chip RAM to support buffering, FIFOs, and implemented algorithms.
  • I/O and interfaces — 488 general-purpose I/O pins to support broad peripheral and interface connectivity.
  • Transceiver and high-speed documentation — Device handbook includes sections on transceiver performance specifications and datapath latency, facilitating system-level integration and validation.
  • Package and mounting — Supplied in a 1152-FBGA (35×35) surface-mount package (1152-BBGA, FCBGA case) for dense board-level integration.
  • Power — Core supply operating range from 870 mV to 930 mV to match system power-rail design requirements.
  • Operating environment — Commercial temperature grade with an operating range of 0°C to 85°C.
  • Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Communications infrastructure — Use the device’s documented transceiver and high-logic density to implement packet processing, protocol offload, and interface bridging.
  • High-performance signal processing — Leverage the large logic count and embedded memory for video, imaging, and DSP-based algorithms.
  • Compute acceleration and prototyping — Deploy as a programmable accelerator or development platform where significant on-chip logic and RAM are required.
  • Custom interface and I/O aggregation — 488 I/O pins enable complex multi-interface gateways and protocol converters.

Unique Advantages

  • High logic density: 72,600 logic elements enable implementation of large state machines, wide datapaths, and deep pipelined designs.
  • Substantial embedded memory: Approximately 7.56 Mbits of on-chip RAM reduces external memory dependence for buffering and fast local storage.
  • Large I/O count: 488 I/O provides flexibility for system integration and multiple peripheral interfaces.
  • Comprehensive technical documentation: Device handbook coverage of DC/switching characteristics, PLLs, DSP blocks, transceivers, and configuration eases design validation and system integration.
  • Board-level integration: 1152-FBGA (35×35) surface-mount package supports dense PCB layouts and standardized assembly processes.
  • Commercial temperature and RoHS compliance: Suitable for commercial applications within 0°C to 85°C and aligns with RoHS manufacturing requirements.

Why Choose EP4SGX70HF35C4N?

The EP4SGX70HF35C4N positions itself as a high-capacity Stratix IV GX FPGA that balances significant programmable logic, embedded memory, and a large I/O complement in a compact 1152-ball FCBGA package. Its documented transceiver, PLL, DSP, and memory block specifications make it suitable for system designs that need detailed electrical and performance guidance during integration.

This device is well suited to development teams and product designers building communications, signal-processing, and compute-acceleration solutions who require a documented, high-density FPGA with clearly defined power and thermal operating parameters and RoHS compliance.

Request a quote or submit an inquiry to check availability and pricing for EP4SGX70HF35C4N and to discuss how this Stratix IV GX FPGA can fit your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up