EP4SGX70HF35I3G
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 7564880 72600 1152-BBGA, FCBGA |
|---|---|
| Quantity | 112 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 488 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2904 | Number of Logic Elements/Cells | 72600 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 7564880 |
Overview of EP4SGX70HF35I3G – Stratix IV GX FPGA, 1152-BBGA (35×35), Industrial
The EP4SGX70HF35I3G is a Stratix IV GX field-programmable gate array (FPGA) IC designed for applications that require high logic density, extensive I/O, and embedded memory. It provides a large programmable fabric for implementing complex digital logic, signal processing, and high-bandwidth interfaces.
Key on-chip resources include 72,600 logic elements, approximately 7.56 Mbits of embedded memory, and 488 I/O pins. The device is supplied in a 1152-BBGA (35×35) FCBGA package, operates over an industrial temperature range of −40 °C to 100 °C, and uses a core voltage supply between 870 mV and 930 mV.
Key Features
- Core Logic Density 72,600 logic elements for implementing large-scale combinational and sequential logic designs.
- Embedded Memory Approximately 7.56 Mbits of on-chip RAM to support buffers, FIFOs, and working storage for data-intensive functions.
- I/O Resources 488 general-purpose I/O pins to support broad connectivity and multiple external interfaces.
- High-Speed Transceiver and Protocol Support Stratix IV GX device family features include high-speed transceiver capabilities and support for a wide range of protocols as described in the device handbook.
- DSP and Clocking The Stratix IV family provides digital signal processing blocks and flexible clock networks, including PLLs, to accommodate complex timing and signal-processing tasks.
- Power and Voltage Core supply range specified at 870 mV to 930 mV to match system-level power requirements.
- Package & Mounting 1152-BBGA (1152-FBGA, 35×35) FCBGA package, surface-mount mounting type for compact board integration.
- Industrial Grade & Temperature Range Designed for industrial applications with an operating temperature range of −40 °C to 100 °C.
- Diagnostics and Signal Integrity Device family documentation highlights diagnostic features and signal-integrity capabilities to assist system validation and high-speed design.
Typical Applications
- Telecommunications & Networking Use the device’s high logic density, embedded memory, and transceiver-oriented family features to implement packet processing, switching, and protocol bridging.
- High-performance Signal Processing Leverage the Stratix IV family’s DSP blocks, abundant logic elements, and on-chip RAM for filtering, FFTs, and real-time data manipulation.
- External Memory Controllers & Interfaces Large I/O count and robust clocking provide a platform for implementing external memory interfaces and wide parallel buses.
- Industrial Control & Instrumentation Industrial temperature rating and extensive I/O make the device suitable for factory automation, motor control logic, and instrumentation systems.
- Video & Imaging Systems High aggregate data bandwidth characteristics of the Stratix IV family support image processing pipelines and multi-channel video interfaces.
Unique Advantages
- High integration density: 72,600 logic elements and substantial embedded memory reduce the need for external logic and memory components.
- Flexible I/O and interfacing: 488 I/O pins provide the headroom required to connect multiple peripherals and external memories without complex board-level multiplexing.
- Industrial robustness: Specified for −40 °C to 100 °C operation, enabling deployment in demanding environmental conditions.
- Power-defined core operation: Core voltage range of 870 mV to 930 mV supports predictable power planning for system designers.
- Family-level system features: Access to Stratix IV GX family capabilities—such as high-speed transceiver support, DSP blocks, PLLs, and diagnostic features—helps accelerate development of high-bandwidth and signal-processing systems.
Why Choose EP4SGX70HF35I3G?
The EP4SGX70HF35I3G positions itself as a high-density Stratix IV GX FPGA option when designers need a balance of logic capacity, embedded memory, and extensive I/O in an industrial-grade package. Its resource mix and family-level features support complex data-paths, protocol handling, and real-time signal processing while enabling compact board layouts courtesy of the 1152-BBGA FCBGA package.
This device is well suited to engineering teams building telecommunications, networking, industrial control, and high-performance signal-processing systems that require scalable logic resources and documented family features from the Stratix IV device handbook.
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