EP4SGX70HF35I3G

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 7564880 72600 1152-BBGA, FCBGA

Quantity 112 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2904Number of Logic Elements/Cells72600
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits7564880

Overview of EP4SGX70HF35I3G – Stratix IV GX FPGA, 1152-BBGA (35×35), Industrial

The EP4SGX70HF35I3G is a Stratix IV GX field-programmable gate array (FPGA) IC designed for applications that require high logic density, extensive I/O, and embedded memory. It provides a large programmable fabric for implementing complex digital logic, signal processing, and high-bandwidth interfaces.

Key on-chip resources include 72,600 logic elements, approximately 7.56 Mbits of embedded memory, and 488 I/O pins. The device is supplied in a 1152-BBGA (35×35) FCBGA package, operates over an industrial temperature range of −40 °C to 100 °C, and uses a core voltage supply between 870 mV and 930 mV.

Key Features

  • Core Logic Density  72,600 logic elements for implementing large-scale combinational and sequential logic designs.
  • Embedded Memory  Approximately 7.56 Mbits of on-chip RAM to support buffers, FIFOs, and working storage for data-intensive functions.
  • I/O Resources  488 general-purpose I/O pins to support broad connectivity and multiple external interfaces.
  • High-Speed Transceiver and Protocol Support  Stratix IV GX device family features include high-speed transceiver capabilities and support for a wide range of protocols as described in the device handbook.
  • DSP and Clocking  The Stratix IV family provides digital signal processing blocks and flexible clock networks, including PLLs, to accommodate complex timing and signal-processing tasks.
  • Power and Voltage  Core supply range specified at 870 mV to 930 mV to match system-level power requirements.
  • Package & Mounting  1152-BBGA (1152-FBGA, 35×35) FCBGA package, surface-mount mounting type for compact board integration.
  • Industrial Grade & Temperature Range  Designed for industrial applications with an operating temperature range of −40 °C to 100 °C.
  • Diagnostics and Signal Integrity  Device family documentation highlights diagnostic features and signal-integrity capabilities to assist system validation and high-speed design.

Typical Applications

  • Telecommunications & Networking  Use the device’s high logic density, embedded memory, and transceiver-oriented family features to implement packet processing, switching, and protocol bridging.
  • High-performance Signal Processing  Leverage the Stratix IV family’s DSP blocks, abundant logic elements, and on-chip RAM for filtering, FFTs, and real-time data manipulation.
  • External Memory Controllers & Interfaces  Large I/O count and robust clocking provide a platform for implementing external memory interfaces and wide parallel buses.
  • Industrial Control & Instrumentation  Industrial temperature rating and extensive I/O make the device suitable for factory automation, motor control logic, and instrumentation systems.
  • Video & Imaging Systems  High aggregate data bandwidth characteristics of the Stratix IV family support image processing pipelines and multi-channel video interfaces.

Unique Advantages

  • High integration density: 72,600 logic elements and substantial embedded memory reduce the need for external logic and memory components.
  • Flexible I/O and interfacing: 488 I/O pins provide the headroom required to connect multiple peripherals and external memories without complex board-level multiplexing.
  • Industrial robustness: Specified for −40 °C to 100 °C operation, enabling deployment in demanding environmental conditions.
  • Power-defined core operation: Core voltage range of 870 mV to 930 mV supports predictable power planning for system designers.
  • Family-level system features: Access to Stratix IV GX family capabilities—such as high-speed transceiver support, DSP blocks, PLLs, and diagnostic features—helps accelerate development of high-bandwidth and signal-processing systems.

Why Choose EP4SGX70HF35I3G?

The EP4SGX70HF35I3G positions itself as a high-density Stratix IV GX FPGA option when designers need a balance of logic capacity, embedded memory, and extensive I/O in an industrial-grade package. Its resource mix and family-level features support complex data-paths, protocol handling, and real-time signal processing while enabling compact board layouts courtesy of the 1152-BBGA FCBGA package.

This device is well suited to engineering teams building telecommunications, networking, industrial control, and high-performance signal-processing systems that require scalable logic resources and documented family features from the Stratix IV device handbook.

Request a quote or submit a sales inquiry for EP4SGX70HF35I3G to discuss availability and pricing for your next design.

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