EP4SGX70HF35C4G

The EP4SGX70HF35C4G is a Stratix IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package. It implements the Stratix IV GX device architecture and is targeted at commercial-grade designs that require large programmable logic capacity, abundant on-chip memory, and extensive I/O.

With 72,600 logic elements and approximately 7.56 Mbits of embedded memory, this device supports complex logic integration, DSP and protocol-focused subsystems, and designs that require high aggregate I/O bandwidth and flexible system integration.

Key Features

• Core Logic — 72,600 logic elements to implement large-scale custom logic, protocol engines, and control systems.
• Embedded Memory — Approximately 7.56 Mbits of on-chip RAM to reduce external memory dependence for buffering, FIFOs, and local storage.
• I/O Density — 488 user I/O pins suitable for wide external interface support and parallel data paths.
• Stratix IV GX Architecture — Device-family features documented in the Stratix IV Device Handbook, including FPGA fabric, DSP blocks, PLLs, clock networks, and high-speed transceiver functionality.
• Package & Mounting — 1152-FBGA (35×35) / 1152-BBGA, FCBGA surface-mount package for board-level integration and high pin-count routing.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling defined power-rail integration in system designs.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS-compliant for environmental and manufacturing compliance.

Typical Applications

• High-bandwidth Communications: Use the Stratix IV GX architecture and high I/O count to implement protocol engines, packet processing, and interface bridging where aggregate data bandwidth is required.
• Digital Signal Processing: Leverage the device family’s DSP-oriented resources and abundant logic elements for signal filtering, transforms, and real-time data manipulation.
• External Memory Interfaces: Implement memory controllers and high-throughput buffering using on-chip RAM in conjunction with wide I/O to manage external memory subsystems.
• System Integration and Prototyping: Integrate multiple subsystems (control logic, interfaces, and timing engines) on a single FPGA to reduce BOM and simplify board-level partitioning.

Unique Advantages

• High Logic Capacity: 72,600 logic elements provide the headroom to implement complex algorithms and multi-function systems in a single device.
• Significant On-chip RAM: Approximately 7.56 Mbits of embedded memory reduces reliance on external RAM for intermediate buffering and accelerates data-path designs.
• Extensive I/O: 488 I/O pins enable broad connectivity for parallel interfaces, sensors, and external peripherals.
• Commercial-grade Reliability: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial applications and environments.
• Compact High-pin-count Package: 1152-FBGA (35×35) surface-mount package supports dense PCB routing while maintaining a high pin count for system interfaces.
• Standards-compliant Manufacturing: RoHS compliance supports modern assembly and environmental requirements.

Why Choose EP4SGX70HF35C4G?

The EP4SGX70HF35C4G combines a large programmable fabric with substantial embedded memory and high I/O density in a compact FCBGA package, making it well suited for commercial designs that require consolidated logic, DSP capability, and broad external connectivity. Its documented Stratix IV GX device-family features—such as DSP blocks, PLLs, clock networks, and high-speed transceiver functionality—help designers implement protocol-rich, high-throughput systems.

For engineering teams and procurement focused on performance and integration at the board level, this FPGA offers a balance of logic capacity, on-chip memory, and pin count while meeting commercial operating and RoHS compliance expectations.

Request a quote or submit an inquiry for pricing and availability of EP4SGX70HF35C4G to evaluate its fit for your next project.