EPF10K100AFC484-1

IC FPGA 369 I/O 484FBGA
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 369 24576 4992 484-BBGA

Quantity 1,552 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O369Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates158000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K100AFC484-1 – FLEX-10KA Field Programmable Gate Array (FPGA), 484-BBGA

The EPF10K100AFC484-1 is a FLEX 10KA family field-programmable gate array (FPGA) offering embedded programmable logic and on-chip memory for System-on-a-Programmable-Chip (SOPC) integration. It combines a dedicated logic array and embedded array blocks to implement general-purpose logic and megafunctions such as efficient memory and specialized logic functions.

With 4,992 logic elements, approximately 24,576 bits of embedded RAM, and 369 user I/O pins in a 484-FBGA (23×23) surface-mount package, this commercial-grade device targets high-density, reconfigurable designs that require flexible I/O, embedded memory and system-level features like JTAG boundary-scan and PCI support.

Key Features

  • Logic Capacity  Contains 4,992 logic elements and a typical gates count consistent with the FLEX 10K100A class for implementing substantial custom logic.
  • Embedded Memory  Approximately 24,576 bits of total on-chip RAM provided by embedded array blocks (EABs) to support megafunctions and data buffering without reducing logic capacity.
  • I/O and Interface Flexibility  369 user I/O pins with MultiVolt I/O support and programmable slew-rate control; FLEX 10KA devices include 5.0-V tolerant input pin capability and selectable pull-up clamping diode options for PCI compliance as specified in the series documentation.
  • System Integration  Designed for SOPC integration with an embedded array for megafunctions and support for in-circuit reconfigurability via external configuration devices, intelligent controllers, or the JTAG port.
  • Clock and Routing  Built-in low-skew clock distribution trees, options such as ClockLock and ClockBoost (series feature), dedicated carry and cascade chains, and support for up to six global clocks to implement high-performance arithmetic and high-fan-in logic.
  • Package and Mounting  484-FBGA (23×23) surface-mount package (484-BBGA listed) for board-space efficient designs.
  • Power and Supply  Operates from a 3.0 V to 3.6 V supply range as specified for the device family.
  • Operating Conditions  Commercial grade operation across 0 °C to 70 °C.
  • Standards and Testability  Built-in IEEE 1149.1 JTAG boundary-scan test circuitry and 100% functional testing reported for the family.
  • Compliance  RoHS compliant.

Typical Applications

  • System Integration / SOPC  Use as the programmable core in System-on-a-Programmable-Chip designs to combine custom logic with embedded memory megafunctions.
  • PCI-Connected Systems  Suitable for designs requiring PCI Local Bus interface support and selectable I/O clamping for 3.3-V PCI compliance as provided by the FLEX 10KA series.
  • High-Density Logic and Memory Functions  Implement custom processors, accelerators, or buffering using the device’s logic elements and embedded RAM resources.
  • Development and Prototyping  In-circuit reconfigurability via external configuration or JTAG makes the device appropriate for iterative hardware development and prototyping workflows.

Unique Advantages

  • High integration density:  4,992 logic elements and series-class gate counts provide substantial capacity for combined logic and memory functions, reducing the need for external components.
  • Embedded RAM for megafunctions:  Approximately 24,576 bits of embedded memory supports on-chip buffers and specialized functions without impacting logic capacity.
  • Flexible I/O and PCI support:  369 I/Os with MultiVolt I/O, 5.0-V tolerant inputs (series feature), and selectable pull-up clamping for PCI make interface design more straightforward.
  • Design-for-test and reconfigurability:  Integrated IEEE 1149.1 JTAG boundary-scan and support for in-circuit reconfiguration simplify board-level test and field updates.
  • Clocking and arithmetic support:  Dedicated carry and cascade chains plus multiple global clock signals facilitate efficient implementation of adders, counters and high-speed logic.
  • Commercial-grade readiness:  Surface-mount 484-FBGA package, 3.0–3.6 V supply range and 0 °C to 70 °C operating range match common commercial embedded system requirements.

Why Choose EPF10K100AFC484-1?

The EPF10K100AFC484-1 delivers a balanced blend of logic density, embedded memory and flexible I/O in a compact 484-FBGA package, making it a strong fit for commercial embedded systems that demand reconfigurability and system-level integration. Its series-provided features — including SOPC support, JTAG boundary-scan, and PCI-compatible I/O options — enable consolidated designs that reduce BOM and simplify interfacing.

Choose this device when you need a commercially graded FPGA with substantial on-chip RAM and a large number of user I/Os for applications such as system integration, interface bridging, prototyping and medium-to-high density custom logic implementations. The device’s packaging, voltage range and compliance characteristics support efficient board-level deployment and design reuse.

Request a quote or submit an inquiry to purchase the EPF10K100AFC484-1 and discuss availability and lead time for your design requirements.

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