EPF10K100AFC484-3

The EPF10K100AFC484-3 is a FLEX-10KA family field programmable gate array (FPGA) from Intel designed for mid- to high-density programmable logic integration. It combines a logic array and embedded memory resources to support system-level integration and custom logic functions for commercial embedded designs.

With 4,992 logic elements, 24,576 bits of on-chip RAM, and 369 user I/O pins in a 484-ball BGA package, this device is targeted at applications requiring substantial programmable logic, embedded memory, and flexible I/O in a surface-mount commercial-grade package.

Key Features

• Core density — 4,992 logic elements and 624 logic array blocks (LABs) provide the programmable fabric for implementing complex logic and glue functions.
• On-chip memory — Approximately 24,576 bits of embedded RAM for data buffering, small lookup tables, and local storage close to logic resources.
• I/O capability — 369 user I/O pins to support multiple parallel interfaces and mixed-signal front-end connectivity on a single device.
• Gate count — 158,000 gates of capacity to accommodate substantial system logic integration within the FLEX-10KA family architecture.
• Supply and power — Operates from a 3.0 V to 3.6 V supply, suitable for standard 3.3 V system logic domains.
• Package and mounting — 484-ball BGA package (supplier device package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact board integration.
• Commercial temperature grade — Rated for 0 °C to 70 °C operation, aligned with commercial embedded and consumer electronics applications.
• Built-in test and reconfiguration — Family datasheet documents JTAG boundary-scan support and in-circuit reconfigurability options for development and manufacturing test.
• Regulatory — RoHS compliant.

Typical Applications

• Embedded systems and SOPC integration — Use the FLEX-10KA architecture to combine logic, memory, and custom functions for system-on-a-programmable-chip designs.
• Prototyping and development — Rich logic element count and ample I/O allow iteration of custom interfaces and feature sets during product development.
• Custom interface and glue logic — Deploy as protocol bridging, parallel/serial interface aggregation, or custom timing logic where many I/Os and on-chip RAM simplify board-level design.
• Memory-accelerated logic — Embedded RAM supports buffering, small data tables, and local storage to reduce external memory dependence for certain functions.

Unique Advantages

• Balanced logic and memory resources: 4,992 logic elements paired with ~24.6 kbits of embedded RAM enable tightly coupled logic-plus-memory implementations.
• High I/O count for complex interfaces: 369 user I/O pins support multi-channel connectivity and broad peripheral integration without immediate external multiplexing.
• Compact BGA package: 484-ball FBGA (23 × 23) enables dense board layouts and surface-mount assembly for space-constrained designs.
• Commercial-grade operating range: 0 °C to 70 °C rating aligns with consumer and general-purpose embedded applications.
• Test and reconfiguration support: Family-level JTAG boundary-scan and in-circuit reconfigurability features ease manufacturing test and field updates.
• RoHS compliant: Conforms to lead-free environmental requirements for modern electronic assemblies.

Why Choose EPF10K100AFC484-3?

The EPF10K100AFC484-3 delivers a practical balance of programmable logic capacity, embedded memory, and high I/O density in a commercial-grade, surface-mount BGA package. It is a suitable choice for engineers building embedded systems, custom interface logic, and prototype platforms that benefit from in-system configurability and on-chip memory.

Its FLEX-10KA family capabilities—documented support for JTAG boundary-scan and in-circuit reconfiguration—combine with a well-sized logic fabric and extensive I/O to provide a scalable, board-level building block for mid-range programmable designs backed by Intel’s device family ecosystem.

Request a quote or submit a purchase inquiry for EPF10K100AFC484-3 today to evaluate its fit for your next embedded or interface-driven design.