EPF10K100ARC240-1N

The EPF10K100ARC240-1N is a member of the FLEX 10K embedded programmable logic family, delivered in a 240-pin BFQFP package with an exposed pad for surface-mount assembly. It combines a dense logic array, embedded memory, and a broad set of system-level features suitable for commercial embedded designs and communications equipment.

This device operates from a 3.0 V to 3.6 V supply (3.3 V nominal), supports in-system reconfigurability and boundary-scan, and targets applications that require mid-range gate density, on-chip RAM, and flexible I/O at commercial temperature ranges.

Key Features

• Programmable Core 4,992 logic elements and a gate capacity of 158,000 provide integration headroom for mid-density programmable logic implementations.
• Embedded Memory 24,576 total RAM bits (approximately 0.025 Mbits) organized across the FLEX 10K architecture for on-chip data buffering and state storage.
• Logic Array Blocks (LABs) 624 LABs for structured logic partitioning and predictable resource allocation.
• I/O and Connectivity 189 user I/O pins with programmable output control and options typical of the FLEX 10K family for flexible interfacing in commercial systems.
• Package and Mounting 240-BFQFP exposed pad package (supplier device package: 240-RQFP, 32×32) designed for surface-mount placement and thermal management via the exposed pad.
• Power and Temperature 3.0 V to 3.6 V supply range and commercial operating temperature rated from 0 °C to 70 °C.
• System-Level Features (FLEX 10K family) Family-level capabilities include in-circuit reconfigurability (ICR), built-in JTAG boundary-scan test, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and a low-skew clock distribution network.
• Compliance RoHS compliant for environmental compliance in commercial product assemblies.

Typical Applications

• Embedded Systems Implement control logic, glue logic, and on-board sequencers where mid-range logic density and embedded memory reduce external components.
• Communications Equipment Support protocol handling, packet buffering, and bus interfacing with flexible I/O and on-chip RAM for intermediate data storage.
• Consumer Electronics Enable feature-rich user interfaces, peripheral bridging, and real-time control functions within commercial temperature specifications.
• Test & Measurement Provide configurable instrumentation logic and data path control leveraging the device’s reconfigurability and logic resources.

Unique Advantages

• Balanced integration: 4,992 logic elements combined with 24,576 bits of embedded RAM let designers consolidate logic and small memory functions on-chip, reducing BOM and board complexity.
• Family-grade system features: In-circuit reconfigurability and JTAG boundary-scan simplify development cycles, firmware updates, and manufacturing test.
• Flexible interfacing: 189 user I/Os in a compact 240-pin package enable dense peripheral connectivity without requiring larger packages.
• Commercial-ready packaging: 240-BFQFP with exposed pad supports surface-mount assembly and board-level thermal considerations for commercial products.
• Regulatory readiness: RoHS compliance supports environmental and supply-chain requirements for commercial product lines.

Why Choose EPF10K100ARC240-1N?

The EPF10K100ARC240-1N positions itself as a capable mid-density FPGA for commercial embedded applications that need a balance of logic capacity, embedded memory, and flexible I/O in a compact surface-mount package. Its inclusion in the FLEX 10K family brings family-level architectural features—such as in-circuit reconfigurability, dedicated arithmetic/cascade resources, and JTAG boundary-scan—that accelerate development and simplify board-level integration.

This device is well suited to design teams building communication subsystems, consumer products, and test equipment that require scalable logic resources, on-chip memory, and commercial temperature operation with RoHS compliance.

Request a quote or submit a pricing inquiry to evaluate the EPF10K100ARC240-1N for your next design project.