EPF10K100ARC240-3

The EPF10K100ARC240-3 is a FLEX-10KA series field-programmable gate array (FPGA) IC from Intel, designed as an embedded programmable logic device for system-level integration. It provides a combination of logic elements, embedded RAM and a large I/O count suitable for commercial embedded systems that require reconfigurable logic and memory-intensive megafunctions.

This device targets applications that need on-chip memory, dense logic resources and flexible I/O, while operating from a 3.0 V to 3.6 V supply and within a commercial temperature range.

Key Features

• Core Logic  Approximately 4,992 logic elements providing substantial programmable logic capacity; series architecture supports system-on-a-programmable-chip (SOPC) integration.
• Embedded Memory  24,576 bits of on-chip RAM for implementing memory-intensive megafunctions and data buffering.
• Logic Density / Gates  Device-level gate count listed as 158,000 (maximum system gates), enabling implementation of complex logic and mixed functions.
• I/O Capacity  189 user I/O pins to support broad peripheral interfacing and external connectivity requirements.
• Power Supply  Operates from a 3.0 V to 3.6 V supply, matching common 3.3 V system domains.
• Package & Mounting  240-pin BFQFP with exposed pad in a surface-mount package (supplier device package: 240-RQFP, 32×32) for board-level thermal grounding and compact placement.
• Operating Conditions  Commercial temperature grade: 0 °C to 70 °C.
• Standards & Test  Built-in JTAG boundary-scan circuitry is available for in-system test and configuration (series feature).

Typical Applications

• SOPC Integration  On-chip logic and embedded RAM enable system-on-a-programmable-chip designs that combine custom logic, controllers and memory blocks.
• Interface Bridging & Peripheral Support  High I/O count supports protocol bridging and peripheral interfacing in commercial communication and control equipment.
• Memory-Intensive Logic  Embedded RAM is useful for buffering, FIFOs and specialized memory megafunctions within custom hardware accelerators.
• In-Circuit Reconfigurable Designs  Supports in-circuit reconfigurability and JTAG-based configuration for iterative development, prototype validation and field updates (series feature).

Unique Advantages

• Balanced Logic and Memory:  Combines roughly 4,992 logic elements with 24,576 bits of embedded RAM to implement both control logic and local data storage on a single device.
• Substantial I/O Count:  189 I/O pins provide flexibility to interface multiple peripherals, sensors and external memories without additional bridge devices.
• Commercial-Grade Availability:  Designed for commercial applications with a 0 °C to 70 °C operating range and RoHS compliance for regulatory alignment.
• Package for Thermal and Board Integration:  240-pin BFQFP with exposed pad supports surface-mount assembly and improved thermal conduction to the PCB.
• Reconfigurability and Test Support:  Series-level features such as JTAG boundary-scan and in-circuit reconfigurability streamline development, testing and field updates.

Why Choose EPF10K100ARC240-3?

The EPF10K100ARC240-3 positions itself as a versatile, commercial-grade FPGA option for designs that require a solid mix of logic capacity, embedded RAM and a high I/O count in a surface-mount 240-pin package. Its FLEX-10KA family heritage brings series-level features geared toward SOPC integration, reconfigurability and board-level testability.

Choose this device for commercial embedded applications and prototyping efforts where on-chip memory, flexible I/O and a reconfigurable logic fabric reduce BOM complexity and accelerate time-to-market while operating within standard 3.3 V system environments.

Request a quote or submit a procurement inquiry for EPF10K100ARC240-3 to evaluate fit for your next embedded design or system integration project.