EPF10K100BFC256-1

LOADABLE PLD, 11NS PBGA256
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 6144 576 256-BGA

Quantity 800 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O191Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs72Number of Logic Elements/Cells576
Number of Gates31000ECCN3A991HTS Code8542.39.0001
QualificationN/ATotal RAM Bits6144

Overview of EPF10K100BFC256-1 – FLEX-10K Field Programmable Gate Array, 256-BGA

The EPF10K100BFC256-1 is a FLEX-10K® Field Programmable Gate Array (FPGA) IC provided in a 256-ball FBGA package. It offers a compact, surface-mount programmable logic device targeted for commercial-grade designs that require on-chip memory, moderate logic capacity, and a high I/O count.

With 576 logic elements, approximately 6,144 bits of embedded RAM, and 191 available I/O, this device is designed to deliver flexible digital integration in a single 256-FBGA (17×17) package while operating from a 4.75 V to 5.25 V supply and within a 0 °C to 70 °C temperature range.

Key Features

  • Logic Capacity  Approximately 576 logic elements and 31,000 equivalent gates provide programmable combinational and sequential resources for custom digital functions.
  • Embedded Memory  Approximately 6,144 bits of on-chip RAM support small lookup tables, FIFOs, or state-storage requirements.
  • I/O Resources  191 user I/O pins enable broad external interfacing and connectivity in a single device.
  • Package & Mounting  256-FBGA (17×17) ball grid array, surface-mount package for high-density board integration.
  • Power  Single-supply operation from 4.75 V to 5.25 V simplifies power-domain planning for legacy 5 V systems.
  • Operating Range & Grade  Commercial-grade device specified for operation from 0 °C to 70 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Compact high-pin-count package: The 256-FBGA (17×17) package concentrates I/O and logic in a small footprint for space-constrained PCBs.
  • Balanced integration of logic and memory: 576 logic elements paired with on-chip RAM allow implementation of control logic and modest data buffering without external memory.
  • Extensive I/O availability: 191 I/O pins provide flexibility for interfacing multiple peripherals or broad system interconnects from a single device.
  • Standard 5 V supply compatibility: Operation across 4.75 V to 5.25 V supports systems that rely on legacy 5 V domains.
  • Commercial temperature suitability: Rated for 0 °C to 70 °C to match typical commercial electronic product deployment.
  • Regulatory-friendly supply: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose EPF10K100BFC256-1?

The EPF10K100BFC256-1 positions itself as a practical, commercial-grade FPGA solution for designs that require a modest amount of programmable logic, embedded RAM, and a high number of I/O signals in a compact 256-FBGA package. Its 4.75 V to 5.25 V supply range and RoHS compliance make it suitable for mainstream commercial applications where 5 V compatibility and environmental compliance are important.

Choose this device when you need a single-chip programmable solution with a clear balance of logic elements, on-chip memory, and extensive I/O, packaged for high-density board integration. The combination of listed specifications supports streamlined BOMs and predictable integration into commercial product designs.

Request a quote or submit an inquiry to receive pricing and availability for EPF10K100BFC256-1.

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