EPF10K100BFC256-1
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 6144 576 256-BGA |
|---|---|
| Quantity | 800 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 191 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 72 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 31000 | ECCN | 3A991 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6144 |
Overview of EPF10K100BFC256-1 – FLEX-10K Field Programmable Gate Array, 256-BGA
The EPF10K100BFC256-1 is a FLEX-10K® Field Programmable Gate Array (FPGA) IC provided in a 256-ball FBGA package. It offers a compact, surface-mount programmable logic device targeted for commercial-grade designs that require on-chip memory, moderate logic capacity, and a high I/O count.
With 576 logic elements, approximately 6,144 bits of embedded RAM, and 191 available I/O, this device is designed to deliver flexible digital integration in a single 256-FBGA (17×17) package while operating from a 4.75 V to 5.25 V supply and within a 0 °C to 70 °C temperature range.
Key Features
- Logic Capacity Approximately 576 logic elements and 31,000 equivalent gates provide programmable combinational and sequential resources for custom digital functions.
- Embedded Memory Approximately 6,144 bits of on-chip RAM support small lookup tables, FIFOs, or state-storage requirements.
- I/O Resources 191 user I/O pins enable broad external interfacing and connectivity in a single device.
- Package & Mounting 256-FBGA (17×17) ball grid array, surface-mount package for high-density board integration.
- Power Single-supply operation from 4.75 V to 5.25 V simplifies power-domain planning for legacy 5 V systems.
- Operating Range & Grade Commercial-grade device specified for operation from 0 °C to 70 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Compact high-pin-count package: The 256-FBGA (17×17) package concentrates I/O and logic in a small footprint for space-constrained PCBs.
- Balanced integration of logic and memory: 576 logic elements paired with on-chip RAM allow implementation of control logic and modest data buffering without external memory.
- Extensive I/O availability: 191 I/O pins provide flexibility for interfacing multiple peripherals or broad system interconnects from a single device.
- Standard 5 V supply compatibility: Operation across 4.75 V to 5.25 V supports systems that rely on legacy 5 V domains.
- Commercial temperature suitability: Rated for 0 °C to 70 °C to match typical commercial electronic product deployment.
- Regulatory-friendly supply: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose EPF10K100BFC256-1?
The EPF10K100BFC256-1 positions itself as a practical, commercial-grade FPGA solution for designs that require a modest amount of programmable logic, embedded RAM, and a high number of I/O signals in a compact 256-FBGA package. Its 4.75 V to 5.25 V supply range and RoHS compliance make it suitable for mainstream commercial applications where 5 V compatibility and environmental compliance are important.
Choose this device when you need a single-chip programmable solution with a clear balance of logic elements, on-chip memory, and extensive I/O, packaged for high-density board integration. The combination of listed specifications supports streamlined BOMs and predictable integration into commercial product designs.
Request a quote or submit an inquiry to receive pricing and availability for EPF10K100BFC256-1.

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