EPF10K100ARI240-3N

The EPF10K100ARI240-3N is a FLEX-10KA family field programmable gate array (FPGA) manufactured by Intel. It combines a logic array and embedded memory array to enable System-on-a-Programmable-Chip (SOPC) integration for industrial-grade embedded designs.

With 4,992 logic elements, 24,576 bits of embedded RAM, 189 user I/O pins and a 240-pin BFQFP exposed pad package, this device targets applications that require on-chip megafunctions, flexible I/O and in-circuit reconfigurability while operating over a wide industrial temperature and supply range.

Key Features

• Core Logic 4,992 logic elements (LEs) and a logic array suitable for general programmable logic functions.
• Embedded Memory 24,576 bits of total on-chip RAM provided by embedded array blocks for implementing efficient memory and specialized megafunctions.
• System Capacity Device-level resources correspond to the FLEX 10K family capacity with up to 158,000 gates of system logic.
• I/O and Voltage 189 user I/O pins with MultiVolt I/O support; device supply specified at 3.0 V to 3.6 V and includes features from the FLEX 10KA family such as 5.0-V tolerant input pins where supported.
• Reconfiguration and Test In-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; built-in JTAG boundary-scan test (BST) circuitry.
• Clocking and Interconnect Built-in low-skew clock distribution trees, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and FastTrack continuous routing for predictable interconnect delays.
• Package and Mounting 240-BFQFP exposed pad package (supplier device package: 240-RQFP 32×32) designed for surface-mount assembly.
• Industrial Temperature and Compliance Rated for operation from −40 °C to 85 °C and RoHS compliant.
• Design Tool Support Supported by FLEX 10K series development systems offering automatic place-and-route and megafunction support.

Typical Applications

• SOPC and Custom Megafunctions Implement on-chip memory blocks and specialized logic functions for integrated system designs.
• PCI and Peripheral Interfaces Use in designs that leverage FLEX 10KA family support for PCI Local Bus features and 3.3-V PCI compliance options.
• In-System Reconfigurable Logic Prototyping and adaptive designs that require in-circuit reconfigurability and JTAG-based updates and testing.
• I/O-Intensive Embedded Systems Control, glue logic, and interface aggregation where up to 189 user I/O pins and programmable I/O options are needed.

Unique Advantages

• Highly integrated logic and memory: 4,992 logic elements and 24,576 bits of embedded RAM reduce external component count for compact system designs.
• Flexible reconfiguration and testability: In-circuit reconfigurability and built-in JTAG boundary-scan simplify field updates and manufacturing test.
• Predictable performance: Dedicated carry and cascade chains plus low-skew clock distribution and FastTrack interconnect provide deterministic implementation of arithmetic and timing-critical functions.
• Industrial-grade operating range: Specified for −40 °C to 85 °C to meet industrial environmental requirements.
• Package options for board-level thermal management: 240-BFQFP exposed pad package supports surface-mount assembly and improved board thermal conduction.
• Established development support: Compatibility with FLEX 10K development systems for automatic place-and-route and megafunction libraries accelerates design cycles.

Why Choose EPF10K100ARI240-3N?

The EPF10K100ARI240-3N delivers a balanced combination of programmable logic density, embedded memory and rich I/O in a surface-mount exposed-pad package designed for industrial applications. Its FLEX-10KA architecture supports on-chip megafunctions and in-circuit reconfigurability, making it suitable for designers building integrated, reconfigurable systems that require robust testability and deployment flexibility.

This device is ideal for engineering teams that need a field-programmable solution with defined logic and memory resources, broad I/O capability, and established development tool support to shorten time-to-market and simplify board-level integration.

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