EPF10K100AFC484-2

IC FPGA 369 I/O 484FBGA
Part Description

FLEX-10KA® Field Programmable Gate Array (FPGA) IC 369 24576 4992 484-BBGA

Quantity 383 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O369Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates158000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EPF10K100AFC484-2 – FLEX-10KA Field Programmable Gate Array (FPGA), 4,992 Logic Elements

The EPF10K100AFC484-2 is a FLEX 10KA family field programmable gate array (FPGA) in a 484-ball BGA package. It combines an embedded array for megafunction implementation with a general-purpose logic array to enable system-on-a-programmable-chip (SOPC) integration.

Designed for commercial-grade applications, this device delivers 4,992 logic elements, approximately 24,576 bits of embedded RAM, and 369 user I/O pins, making it suitable for high‑I/O, mid-density FPGA use cases that require in-system reconfigurability and flexible I/O interfacing.

Key Features

  • Logic Capacity 4,992 logic elements and 624 logic array blocks (LABs) for implementing combinational and sequential logic.
  • Embedded Memory 24,576 total RAM bits of embedded on-chip memory for megafunctions and local buffering.
  • Gate Count 158,000 gates (reported device figure) to support medium-complexity logic designs and mixed function integration.
  • I/O and Interface 369 user I/O pins to support dense external connectivity and board-level interfacing.
  • Power and Voltage Operates from a 3.0 V to 3.6 V supply range, matching common 3.3 V system domains.
  • Package and Mounting 484-ball BGA (484-FBGA 23×23 footprint) in a surface-mount package for compact board designs.
  • Temperature and Grade Commercial grade device rated for 0 °C to 70 °C operating temperature.
  • Family-Level Capabilities FLEX 10KA family features cited in the series datasheet include in-circuit reconfigurability, JTAG boundary-scan, MultiVolt I/O support, and options such as ClockLock and ClockBoost for clock management.

Typical Applications

  • System Integration / SOPC Use the embedded array and logic fabric to integrate custom peripherals, glue logic, and on-chip memory for compact system designs.
  • Interface and I/O Handling High I/O count makes the device suitable for signal aggregation, bus bridging, and protocol interfacing on 3.3 V systems.
  • Memory and Buffering Megafunctions On-chip RAM supports local buffering, FIFOs, or small memory blocks required by embedded peripherals and data paths.
  • PCI-capable Systems FLEX 10K family documentation includes support for PCI Local Bus Specification compliance, enabling use in PCI-based designs where applicable.

Unique Advantages

  • Balanced Logic and Memory: 4,992 logic elements paired with 24,576 bits of embedded RAM provide a balanced mix for mid-density custom logic and storage.
  • High I/O Density: 369 user I/O pins reduce the need for external interface expander components and simplify board-level routing for I/O-heavy designs.
  • Compact BGA Footprint: 484-ball FBGA (23×23) package supports compact PCB layouts while retaining a large number of I/Os and internal resources.
  • In-System Reconfigurability: Family-level support for in-circuit reconfigurability and JTAG boundary-scan enables flexible development, debugging, and field updates.
  • 3.3 V System Compatibility: Operates across a 3.0 V–3.6 V supply range to match common 3.3 V logic domains in commercial systems.

Why Choose EPF10K100AFC484-2?

The EPF10K100AFC484-2 provides a practical mid-density FPGA option within the FLEX 10KA family, combining several thousand logic elements, modest embedded RAM, and a high I/O count in a space-efficient BGA package. It is positioned for commercial applications that require SOPC-style integration, flexible I/O, and in-field configurability.

Because it is part of the FLEX 10KA family, designers can leverage family-level features such as JTAG boundary-scan, in-circuit reconfigurability, and the megafunction-capable embedded arrays to streamline development and reduce external BOM complexity.

Request a quote or submit an inquiry to check pricing, availability, and lead times for the EPF10K100AFC484-2.

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