EPF10K200EBC600-1

IC FPGA 470 I/O 600BGA
Part Description

FLEX-10KE® Field Programmable Gate Array (FPGA) IC 470 98304 9984 600-BGA

Quantity 686 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package600-BGA (45x45)GradeCommercialOperating Temperature0°C – 70°C
Package / Case600-BGANumber of I/O470Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200EBC600-1 – FLEX-10KE® Field Programmable Gate Array, 600-BGA

The EPF10K200EBC600-1 is a FLEX 10K family field programmable gate array (FPGA) in a 600-ball BGA package. It combines an embedded-array architecture with a general logic array to support memory-intensive functions and complex custom logic in a single, reconfigurable device.

With 9,984 logic elements, approximately 98 Kbits of on-chip RAM, and up to 470 user I/Os, this commercial-grade FPGA targets embedded systems and board-level designs that require high I/O density, significant on-chip storage, and flexible system integration options consistent with the FLEX 10K family.

Key Features

  • Core Architecture  Built on the FLEX 10K embedded programmable logic family; provides an embedded array for megafunctions and a logic array for general-purpose logic implementation.
  • Logic Capacity  9,984 logic elements and 513,000 equivalent gates to implement medium-density logic designs.
  • On‑Chip Memory  Total RAM bits: 98,304, enabling compact implementation of buffers, small data structures, and local storage without external memory.
  • I/O Density  470 user I/O pins to support high-channel-count interfaces, parallel buses, or dense sensor and actuator arrays.
  • Package & Mounting  600-ball BGA (45 × 45 mm) in a surface-mount package for PCB area efficiency and high-density board layouts.
  • Power & Operating Range  Voltage supply range: 2.3 V to 2.7 V. Operating temperature: 0 °C to 70 °C. Grade: Commercial.
  • Family-Level System Features  Inherits FLEX 10K family capabilities such as embedded-array megafunction support, JTAG boundary-scan, dedicated carry and cascade chains, and low-skew clock distribution (as described for the FLEX 10K family).
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded Systems  Implement system control, custom state machines, or on-chip buffering where moderate logic count and embedded RAM reduce external component count.
  • Communications & Networking  Use the high I/O count for parallel interfaces, protocol bridging, and channel aggregation in board-level telecom and networking modules.
  • Prototyping and Development  Evaluate and iterate custom logic and megafunctions on a reconfigurable platform that supports FLEX 10K family design flows.
  • High-Channel I/O Systems  Drive dense sensor arrays, LED matrices, or multi-channel data acquisition front ends that benefit from many user I/Os and embedded memory.

Unique Advantages

  • Balanced logic and memory capacity: 9,984 logic elements paired with 98,304 RAM bits provide a practical balance for designs that mix control logic and local data storage.
  • High I/O availability: 470 user I/Os reduce the need for external I/O expanders and simplify routing for multi-signal applications.
  • Compact, manufacturable package: 600‑ball BGA (45×45 mm) surface-mount package enables dense PCB layouts and is suitable for automated assembly.
  • Commercial temperature grade: Specified for 0 °C to 70 °C, matching typical board-level commercial product requirements.
  • FLEX 10K family capabilities: Access to family-level features such as embedded-array megafunctions, JTAG boundary-scan, dedicated arithmetic/cascade chains, and low-skew clock trees for easier system design.
  • Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EPF10K200EBC600-1?

The EPF10K200EBC600-1 delivers a practical combination of logic density, embedded memory, and expansive I/O in a surface-mount 600-BGA package, making it well suited for commercial embedded designs that need on-chip storage and high pin counts without adding external components. Its placement within the FLEX 10K family provides access to family-level architectural features that help integrate megafunctions and implement complex logic efficiently.

This device is appropriate for engineering teams building board-level products, prototypes, and systems that benefit from reconfigurable logic, scalable design reuse, and the FLEX 10K family’s system-oriented features. The part’s commercial grade and specified supply and temperature ranges support predictable integration into standard production environments.

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