EPF10K200EBC600-2
| Part Description |
FLEX-10KE® Field Programmable Gate Array (FPGA) IC 470 98304 9984 600-BGA |
|---|---|
| Quantity | 907 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 600-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 600-BGA | Number of I/O | 470 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | 513000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200EBC600-2 – FLEX-10KE® Field Programmable Gate Array (FPGA) IC 470 I/O, ~98,304-bit RAM, 9,984 Logic Elements, 600-BGA
The EPF10K200EBC600-2 is a FLEX-10KE family field programmable gate array designed for embedded and system-level programmable logic. It combines a high logic-element count with substantial on-chip memory and a large I/O complement to address complex glue logic, custom peripherals, and SOPC-style integration.
Targeted at commercial-grade embedded designs, the device offers surface-mount packaging and industry-oriented features from the FLEX 10K series that support in-circuit reconfigurability, JTAG boundary-scan, and fast, predictable interconnect for deterministic logic placement.
Key Features
- Core Capacity — Approximately 9,984 logic elements enabling sizable custom logic implementations for medium-to-high complexity designs.
- Embedded Memory — Approximately 98,304 bits of on-chip RAM to store tables, FIFOs, or state data without external memory.
- I/O Density — 470 user I/O pins to support wide parallel interfaces, multiple peripherals, or bus bridging in a single device.
- Gate Count — 513,000 gates reported for mapping overall design resource requirements.
- Package & Mounting — 600-ball BGA (45 × 45 mm) surface-mount package for high pin count and compact board integration.
- Supply & Operating Range — Voltage supply: 2.3 V to 2.7 V; Operating temperature: 0 °C to 70 °C; Commercial grade for standard embedded environments.
- Series-Level System Features — FLEX 10K family capabilities such as in-circuit reconfigurability, JTAG boundary-scan (IEEE 1149.1), embedded array blocks for megafunctions, dedicated carry and cascade chains, and low-skew clock distribution trees.
- Regulatory & Assembly — RoHS-compliant construction suitable for environmentally restricted designs; fine-pitch BGA maximizes board area efficiency.
Typical Applications
- Embedded Control & Glue Logic — Use the device to implement custom control state machines, interface bridging, and system glue where high I/O and dense logic are required.
- Memory-Intensive Functions — On-chip RAM supports FIFOs, lookup tables, and other buffering or buffering-heavy data paths without adding external memory components.
- Peripheral Interface Aggregation — Large I/O count enables aggregation and protocol adaptation for multiple peripherals or parallel buses on a single FPGA.
- Prototyping & Custom IP — Suited for FPGA-based prototypes and production designs that require reconfigurable logic and series-level features such as JTAG and in-circuit reconfiguration.
Unique Advantages
- High Logic Density: Nearly 10k logic elements provide the headroom to implement substantial custom logic and control functions on-chip.
- Significant Embedded Memory: Approximately 98,304 bits of RAM reduce external memory dependence and simplify board-level BOM and routing.
- Extensive I/O Capability: 470 user I/Os permit broad connectivity for multiple peripherals, sensors, or bus interfaces without external multiplexing.
- Series-Proven System Features: FLEX 10K family capabilities such as JTAG boundary-scan and in-circuit reconfigurability streamline development, testing, and field updates.
- Compact, High-Density Package: 600-BGA (45 × 45) balances pin count with board footprint for space-constrained designs.
- RoHS Compliant: Environmentally compliant manufacturing reduces regulatory overhead for many commercial products.
Why Choose EPF10K200EBC600-2?
The EPF10K200EBC600-2 positions itself as a versatile commercial-grade FPGA for designs that need a combination of substantial logic capacity, abundant on-chip RAM, and high I/O density in a compact BGA package. Its placement in the FLEX-10K family brings series-level system features—such as JTAG and in-circuit reconfigurability—that support development efficiency and field maintainability.
This device is well suited to embedded systems engineers and procurement teams seeking a reprogrammable platform that reduces external component count while providing a robust set of integration and test features for mid-range complexity designs.
Request a quote or submit a purchase inquiry to check availability and pricing for the EPF10K200EBC600-2.

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