EPF10K200EBC600-2

The EPF10K200EBC600-2 is a FLEX-10KE family field programmable gate array designed for embedded and system-level programmable logic. It combines a high logic-element count with substantial on-chip memory and a large I/O complement to address complex glue logic, custom peripherals, and SOPC-style integration.

Targeted at commercial-grade embedded designs, the device offers surface-mount packaging and industry-oriented features from the FLEX 10K series that support in-circuit reconfigurability, JTAG boundary-scan, and fast, predictable interconnect for deterministic logic placement.

Key Features

• Core Capacity — Approximately 9,984 logic elements enabling sizable custom logic implementations for medium-to-high complexity designs.
• Embedded Memory — Approximately 98,304 bits of on-chip RAM to store tables, FIFOs, or state data without external memory.
• I/O Density — 470 user I/O pins to support wide parallel interfaces, multiple peripherals, or bus bridging in a single device.
• Gate Count — 513,000 gates reported for mapping overall design resource requirements.
• Package & Mounting — 600-ball BGA (45 × 45 mm) surface-mount package for high pin count and compact board integration.
• Supply & Operating Range — Voltage supply: 2.3 V to 2.7 V; Operating temperature: 0 °C to 70 °C; Commercial grade for standard embedded environments.
• Series-Level System Features — FLEX 10K family capabilities such as in-circuit reconfigurability, JTAG boundary-scan (IEEE 1149.1), embedded array blocks for megafunctions, dedicated carry and cascade chains, and low-skew clock distribution trees.
• Regulatory & Assembly — RoHS-compliant construction suitable for environmentally restricted designs; fine-pitch BGA maximizes board area efficiency.

Typical Applications

• Embedded Control & Glue Logic — Use the device to implement custom control state machines, interface bridging, and system glue where high I/O and dense logic are required.
• Memory-Intensive Functions — On-chip RAM supports FIFOs, lookup tables, and other buffering or buffering-heavy data paths without adding external memory components.
• Peripheral Interface Aggregation — Large I/O count enables aggregation and protocol adaptation for multiple peripherals or parallel buses on a single FPGA.
• Prototyping & Custom IP — Suited for FPGA-based prototypes and production designs that require reconfigurable logic and series-level features such as JTAG and in-circuit reconfiguration.

Unique Advantages

• High Logic Density: Nearly 10k logic elements provide the headroom to implement substantial custom logic and control functions on-chip.
• Significant Embedded Memory: Approximately 98,304 bits of RAM reduce external memory dependence and simplify board-level BOM and routing.
• Extensive I/O Capability: 470 user I/Os permit broad connectivity for multiple peripherals, sensors, or bus interfaces without external multiplexing.
• Series-Proven System Features: FLEX 10K family capabilities such as JTAG boundary-scan and in-circuit reconfigurability streamline development, testing, and field updates.
• Compact, High-Density Package: 600-BGA (45 × 45) balances pin count with board footprint for space-constrained designs.
• RoHS Compliant: Environmentally compliant manufacturing reduces regulatory overhead for many commercial products.

Why Choose EPF10K200EBC600-2?

The EPF10K200EBC600-2 positions itself as a versatile commercial-grade FPGA for designs that need a combination of substantial logic capacity, abundant on-chip RAM, and high I/O density in a compact BGA package. Its placement in the FLEX-10K family brings series-level system features—such as JTAG and in-circuit reconfigurability—that support development efficiency and field maintainability.

This device is well suited to embedded systems engineers and procurement teams seeking a reprogrammable platform that reduces external component count while providing a robust set of integration and test features for mid-range complexity designs.

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