EPF10K200EBI600-2

The EPF10K200EBI600-2 is a FLEX-10KE family field programmable gate array designed for high-density, reconfigurable logic and embedded system integration. It combines a large logic fabric with substantial on-chip RAM and a high pin-count I/O footprint to support complex digital functions and system-on-a-programmable-chip (SOPC) integration.

This device is targeted at industrial applications requiring robust ambient operation, large I/O counts, and flexible logic and memory resources for tasks such as custom protocol bridging, high-pin-count interface control, and embedded function implementation.

Key Features

• Logic Capacity  Approximately 9,984 logic elements, provided as an array suitable for implementing complex combinational and sequential logic functions; reported count of 1,248 LABs.
• Embedded Memory  Approximately 98,304 bits of on-chip RAM, enabling local data buffering and embedded megafunction implementations.
• High I/O Count  470 user I/O pins to support dense external connectivity and multiple bus/interface implementations.
• Gate Density  513,000 gates reported for substantial logic integration within a single device footprint.
• Low-Voltage Operation  Operates from a 2.3 V to 2.7 V supply, suitable for low-voltage system domains.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
• Package and Mounting  600-BGA (45 × 45 mm) FineLine BGA; surface-mount package for high-density PCB assembly.
• Test and Configuration Support  Includes series features such as JTAG boundary-scan test circuitry (IEEE Std. 1149.1), and support for in-circuit reconfigurability via external configuration devices or JTAG.
• RoHS Compliance  RoHS-compliant for regulatory and manufacturing compliance.

Typical Applications

• Industrial Control  Implements custom control logic, high-pin-count sensor and actuator interfaces, and embedded sequencing within industrial systems operating across −40 °C to 85 °C.
• Interface and Protocol Bridging  Handles multiple parallel or serialized interfaces using abundant I/O and on-chip logic to bridge heterogeneous subsystems.
• System Integration / SOPC  Enables consolidation of specialized logic blocks and embedded memory into a single device for compact system-on-a-programmable-chip designs.
• Prototyping and Custom Logic  Suitable for development and deployment of high-density custom logic where reconfigurability and large on-chip resources reduce external component count.

Unique Advantages

• High integration density: Combines nearly 10k logic elements with over 98kbits of embedded RAM to reduce external components and board complexity.
• Extensive I/O: 470 user I/Os enable direct connection to numerous peripherals and interfaces without intermediate multiplexing.
• Industrial-ready thermal range: Rated from −40 °C to 85 °C for reliable operation in industrial environments.
• Compact BGA package: 600-ball FineLine BGA (45×45 mm) maximizes board space efficiency for dense designs.
• Low-voltage compatibility: 2.3–2.7 V supply operation supports integration into low-voltage power domains.
• Built-in test and reconfiguration: JTAG boundary-scan support and in-circuit reconfigurability simplify debugging, production test, and field updates.

Why Choose EPF10K200EBI600-2?

The EPF10K200EBI600-2 offers a balanced combination of logic capacity, embedded memory, and a very high I/O count in a single 600-BGA package, making it well suited to industrial and high-density embedded designs that require reconfigurable logic and direct peripheral interfacing. Its industrial temperature rating, RoHS compliance, and built-in test/configuration features support robust productization and field maintenance.

Designers and procurement teams will find this device suitable for projects that need significant on-chip resources and flexible I/O routing while minimizing external components and preserving PCB area through a compact BGA footprint.

Request a quote or submit a parts inquiry to obtain pricing, availability, and lead-time information for the EPF10K200EBI600-2.