EPF10K200EFC672-1

The EPF10K200EFC672-1 is a FLEX-10KE family field programmable gate array (FPGA) IC from Intel. It combines a dedicated logic array with embedded memory resources and system-level features intended for integration of complex logic, megafunctions and interface functions on a single device.

Designed for commercial applications, this device delivers 9,984 logic elements, approximately 98 kbits of embedded RAM, and up to 470 user I/O pins in a 672-ball BGA package, offering a balance of integration density, I/O capacity and board-level space efficiency.

Key Features

• Logic Capacity — 9,984 logic elements enable implementation of substantial custom logic and control functions.
• Embedded Memory — Total on-chip RAM: 98,304 bits (approximately 98 kbits) for data buffering, FIFOs and small embedded storage.
• I/O and Connectivity — Up to 470 user I/Os provide broad external interfacing capability for parallel buses, multiple peripherals and high-pin-count designs.
• Gate Count — 513,000 gates reported for system-level resource planning and comparative sizing.
• Package and Mounting — 672-ball BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor to maximize board density.
• Power — Voltage supply range of 2.3 V to 2.7 V to match targeted system power rails.
• Operating Range — Commercial temperature grade with specified operating range 0 °C to 70 °C.
• In-system Configuration — Supports in-circuit reconfigurability via external configuration device, intelligent controller or JTAG port for field updates and iterative development.
• Built-in Test — JTAG boundary-scan (IEEE 1149.1) circuitry available without consuming device logic for board-level test and debug.
• Clock and Interconnect Features — Built-in low-skew clock distribution trees, ClockLock and ClockBoost options, and a FastTrack interconnect structure for predictable routing delays.
• Arithmetic and High-speed Logic Support — Dedicated carry and cascade chains for efficient implementation of adders, counters and high‑fan‑in logic.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• System Integration / SOPC — Integrate memory blocks and specialized logic to implement system-on-a-programmable-chip functionality and reduce external component count.
• High-pin-count Interface Control — Use the device’s up to 470 I/Os for wide parallel buses, multi‑lane interfaces or mixed-signal front-ends requiring many signal connections.
• Embedded Logic and Custom Acceleration — Implement custom datapaths, control logic and arithmetic accelerators using the device’s logic elements and dedicated carry/cascade chains.
• Board-level Test and In-field Updates — Leverage JTAG boundary-scan for manufacturing test and in-circuit reconfiguration for firmware/feature updates after deployment.

Unique Advantages

• Substantial on-chip resources: Nearly 10k logic elements and ~98 kbits of embedded RAM support complex logic and small embedded storage without external memory.
• High I/O density: Up to 470 user I/Os reduce the need for external interface components and simplify PCB routing for multi‑signal systems.
• Flexible configuration options: In-circuit reconfigurability and JTAG support streamline development cycles and enable field updates.
• Design predictability: FastTrack interconnect, dedicated carry/cascade chains, and low-skew clock networks help achieve repeatable timing and optimized arithmetic implementations.
• Space-efficient packaging: 672-BBGA (27×27) package delivers a compact footprint suitable for dense board designs.
• Regulatory and manufacturing readiness: RoHS compliance and surface-mount package facilitate modern manufacturing processes.

Why Choose EPF10K200EFC672-1?

The EPF10K200EFC672-1 offers a balance of logic density, embedded memory and extensive I/O in a compact BGA package suited for commercial embedded designs. Its family-level features—on-chip memory blocks, in-system reconfiguration, JTAG boundary-scan and dedicated arithmetic chains—enable designers to consolidate functions, shorten development cycles and reduce BOM complexity.

This device is a fit for engineering teams building medium-to-high complexity control, interface and custom-acceleration designs who need predictable routing, significant I/O capacity and the flexibility of in-field reprogramming backed by the FLEX 10K family feature set.

Request a quote or submit a procurement inquiry to evaluate EPF10K200EFC672-1 for your next design.