EPF10K200EGC599-1

The EPF10K200EGC599-1 is an Altera FLEX-10KE® Field Programmable Gate Array (FPGA) offered in a 599-BCPGA package. It provides a balance of logic density, on-chip memory, and high I/O count for commercial-grade digital designs.

With 9,984 logic elements, approximately 0.098 Mbits of embedded memory and 470 I/O pins, this FPGA targets applications that require substantial programmable logic, versatile interfacing and flexible supply operation within a commercial temperature range.

Key Features

• Logic Capacity  Offers 9,984 logic elements (LEs) and approximately 513,000 equivalent gates to implement complex custom logic and state machines.
• Embedded Memory  Includes approximately 0.098 Mbits (98,304 bits) of on-chip RAM to support buffering, lookup tables and small data storage needs.
• I/O and Connectivity  Provides 470 I/O pins to support dense external interfacing and multi-channel signal connections.
• Power  Operates from a core supply range of 2.375 V to 2.625 V, enabling designs that conform to that supply domain.
• Package & Mounting  Supplied in a 599-BCPGA package (supplier device package: 599-CPGA, 62.48 × 62.48 mm) with through-hole mounting for board assembly compatibility.
• Operating Conditions  Rated for commercial-grade use with an operating temperature range of 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• Custom Logic and Prototyping  Implement custom digital logic, prototypes and hardware-accelerated functions using the device's 9,984 logic elements and abundant I/O.
• Interface Bridging  Use the 470 I/O pins to implement interface conversion, protocol bridging and glue logic between multiple subsystems.
• Data Buffering and Control  Leverage the embedded RAM and logic resources for buffering, small FIFO implementations and control functions in embedded systems.

Unique Advantages

• High Logic Density: 9,984 logic elements deliver the capacity to implement sizable custom logic functions without immediate need for multiple devices.
• Generous I/O Count: 470 configurable I/O pins allow for extensive external connectivity and parallel interfaces.
• Integrated On-Chip RAM: Approximately 0.098 Mbits of embedded memory enables local data storage and buffering to reduce external memory dependence.
• Commercial Temperature Rating: Specified for 0 °C to 70 °C operation to match standard commercial electronic product requirements.
• Through-Hole 599-BCPGA Package: The 599-CPGA (62.48 × 62.48 mm) package with through-hole mounting simplifies handling and certain assembly flows.
• RoHS Compliant: Conforms to RoHS standards for reduced hazardous material content.

Why Choose EPF10K200EGC599-1?

The EPF10K200EGC599-1 positions itself as a capable commercial-grade FPGA that combines nearly 10k logic elements, substantial I/O, and on-chip RAM in a 599-BCPGA through-hole package. Its core voltage range and operating temperature make it suitable for a wide range of standard embedded and digital designs.

This device is well suited to engineering teams and procurement groups seeking a programmable, high-I/O solution for custom logic, interface bridging and control applications, while preserving environmental compliance and conventional mounting options.

Request a quote or submit a purchase inquiry for the EPF10K200EGC599-1 to obtain pricing, lead time and availability information.