EPF10K200SBC356-1

IC FPGA 274 I/O 356BGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 274 98304 9984 356-LBGA

Quantity 1,735 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAltera
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package356-BGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case356-LBGANumber of I/O274Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SBC356-1 – FLEX-10KS Field Programmable Gate Array, 356-LBGA, 9984 Logic Elements

The EPF10K200SBC356-1 is a commercial-grade FLEX-10KS® field programmable gate array (FPGA) from Altera. It provides a reconfigurable logic fabric with 9,984 logic elements and approximately 0.098 Mbits of embedded memory, suited to compact, high-density programmable logic implementations.

With 274 I/O pins, a 356-ball low-profile BGA package, and a single-core FPGA architecture, this device targets commercial embedded designs that require flexible logic integration, moderate on-chip memory, and a high pin count for interfacing with peripheral systems.

Key Features

  • Logic Capacity 9,984 logic elements (LEs) and an estimated 513,000 equivalent gates provide substantial programmable logic resources for mid-range designs.
  • Embedded Memory Approximately 0.098 Mbits of on-chip RAM to support buffering, state machines, and small data storage functions.
  • I/O Density 274 I/O pins deliver extensive connectivity for parallel buses, memory interfaces, and multiple peripheral links.
  • Power and Supply Operates from a core voltage range of 2.375 V to 2.625 V to match compatible power-rail designs.
  • Package & Mounting 356-ball low-profile BGA package (356-BGA, 35×35) in a surface-mount format for space-efficient board layouts.
  • Operating Conditions Commercial temperature grade with an operating range of 0 °C to 70 °C and RoHS compliance for standard commercial product requirements.

Typical Applications

  • Consumer Electronics Use as a programmable logic engine for display controllers, peripheral bridging, and feature customization in commercial consumer devices.
  • Communications Equipment Implement protocol bridging, data alignment, and custom packet processing where high I/O count and reconfigurability are required.
  • Embedded Systems Integrate custom state machines, sensor interfacing, and I/O aggregation in compact embedded controller boards.
  • Prototyping and Development Provide a flexible hardware platform for algorithm validation and hardware/software partitioning during product development cycles.

Unique Advantages

  • Balanced Logic and Memory: Nearly 10k logic elements alongside embedded RAM allow mixed logic and buffering tasks without immediate external memory dependency.
  • High I/O Count: 274 I/O pins enable dense peripheral and bus interfacing, reducing the need for external I/O expanders.
  • Compact BGA Package: 356-ball BGA (35×35) provides a small board footprint while supporting the device’s pin density for space-constrained designs.
  • Commercial Temperature Rating: Rated for 0 °C to 70 °C operation, appropriate for a broad range of commercial product environments.
  • RoHS Compliant: Meets RoHS requirements for lead-free manufacturing and broader market acceptance.

Why Choose EPF10K200SBC356-1?

The EPF10K200SBC356-1 positions itself as a versatile, mid-range FPGA solution that combines significant programmable logic resources with a high I/O count in a compact BGA package. Its specifications suit commercial product designers and development teams that need reconfigurable logic, moderate on-chip memory, and flexible interfacing options without moving to a larger device family.

Designed and manufactured by Altera, this device is appropriate for teams developing consumer and communications products, embedded controllers, and prototypes where field programmability and pin density translate directly into faster time-to-market and simplified board-level integration.

Request a quote or submit an inquiry to receive pricing and availability information for the EPF10K200SBC356-1.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up