EPF10K200SBC600-2
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 600-BGA |
|---|---|
| Quantity | 210 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Altera |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 600-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 600-BGA | Number of I/O | 470 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200SBC600-2 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 600-BGA
The EPF10K200SBC600-2 is a field programmable gate array (FPGA) supplied in a 600-ball BGA package. It provides programmable logic resources, on-chip memory and a large number of user I/O to support complex digital designs in commercial applications.
With 9,984 logic elements, approximately 0.098 Mbits of embedded memory (98,304 bits) and 470 user I/O, this device targets designs that require moderate logic capacity, embedded RAM and high I/O density within a surface-mount 600-BGA (45×45) footprint.
Key Features
- Logic Capacity 9,984 logic elements to implement combinational and sequential logic functions.
- Embedded Memory Approximately 0.098 Mbits of on-chip RAM (98,304 bits) for temporary storage and buffering.
- High I/O Count 470 user I/O pins to support parallel interfaces, multiple peripherals and board-level connectivity.
- Package & Mounting 600-BGA (45×45) package in a surface-mount configuration for dense board integration.
- Power Supply Operates from a supply voltage range of 2.375 V to 2.625 V.
- Commercial Temperature Grade Rated for an operating temperature range of 0 °C to 70 °C.
- Compliance RoHS compliant for environmental regulatory requirements.
Unique Advantages
- Substantial Logic Density: 9,984 logic elements provide the capacity to implement sizable custom logic and state machines without external logic expansion.
- On‑chip RAM for Data Handling: Approximately 0.098 Mbits of embedded memory enables local buffering and small lookup tables, reducing external memory dependency.
- Large I/O Complement: 470 user I/Os allow flexible partitioning of interfaces and support for multiple parallel buses or peripheral groups.
- Compact BGA Package: 600-BGA (45×45) delivers high pin density in a compact surface-mount form factor suitable for space-constrained PCBs.
- Defined Commercial Use: Rated for 0 °C to 70 °C operation and labeled as commercial grade, making the device appropriate for a wide range of non-industrial applications.
- Regulatory Compliance: RoHS compliance helps streamline environmental conformance for product designs and procurement.
Why Choose EPF10K200SBC600-2?
The EPF10K200SBC600-2 balances logic capacity, embedded memory and extensive I/O in a single 600-BGA surface-mount package, making it suitable for commercial electronic designs that require moderate programmable logic and high connectivity. Its defined supply range and temperature rating allow straightforward integration into board designs with known commercial operating conditions.
This FPGA is a practical choice for design teams and procurement seeking a mid-range programmable device with clear, verifiable specifications for logic elements, on-chip RAM, I/O count, package type and regulatory compliance.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for the EPF10K200SBC600-2.

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