EPF10K200SFC484-1N

The EPF10K200SFC484-1N is a FLEX 10K family field programmable gate array (FPGA) IC from Intel, designed for embedded programmable-logic applications. It combines a logic array and embedded memory resources to implement custom logic, megafunctions and system-on-a-programmable-chip (SOPC) integration in a compact surface-mount 484-BBGA package.

This device targets applications that require substantial logic capacity, on-chip RAM and a high external I/O count while operating within a commercial temperature range and a defined supply voltage window.

Key Features

• Logic Capacity — 9,984 logic elements and 1,248 logic array blocks (LABs) provide the on-chip logic resource for implementing complex combinational and sequential designs.
• On-chip Memory — 98,304 bits of embedded RAM for buffering, FIFOs and small lookup tables, enabling megafunction and memory-centric implementations.
• I/O Density — 369 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level interconnect requirements.
• Gate Count — Approximately 513,000 gates of logic and RAM capacity for medium to high-density designs.
• Package & Mounting — 484-BBGA (supplier device package: 484-FBGA, 23×23); surface-mount mounting for compact PCB implementation.
• Power Supply — Specified supply range of 2.375 V to 2.625 V for core or device domain as provided in the device specifications.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 70 °C operation.
• Environmental Compliance — RoHS compliant as indicated in the product data.
• FLEX 10K Family Capabilities — Based on the FLEX 10K embedded programmable logic family, which includes embedded array capability, in-circuit reconfigurability and family-level features such as low-skew clock distribution and dedicated arithmetic/cascade chains (as described in the FLEX 10K family datasheet).

Typical Applications

• Embedded Systems — Implement SOPC-style integration and custom control logic using on-chip memory and logic array resources.
• Interface and Bridge Logic — High I/O count suits protocol bridging, bus interfacing and parallel data capture applications.
• Memory-Intensive Functions — On-chip embedded RAM supports FIFOs, buffers and lookup tables for packet processing or streaming data paths.
• Custom Megafunctions — Use the device’s logic and embedded array resources to implement specialized arithmetic, control or timing functions within a single programmable device.

Unique Advantages

• Substantial On-Chip Logic: 9,984 logic elements and ~513,000 gates allow implementation of complex logic without immediate need for external glue logic.
• Significant Embedded Memory: 98,304 bits of RAM enable internal buffering and state storage, reducing external memory requirements for many designs.
• High Pin Count in a Compact Package: 369 I/O in a 484-BBGA package provides large connectivity while conserving PCB space.
• Commercial Temperature and RoHS Compliance: Commercial grade operation (0 °C to 70 °C) and RoHS compliance support mainstream electronic product requirements.
• Family-Level Integration Options: Leverages FLEX 10K family features from the datasheet for embedded array and system-level integration, aiding faster design reuse across related devices.

Why Choose EPF10K200SFC484-1N?

The EPF10K200SFC484-1N positions itself as a flexible, medium-to-high density FPGA option within the FLEX 10K family, delivering a balance of logic elements, embedded RAM and I/O capacity in a serviceable commercial-grade package. Its combination of nearly 10k logic elements, substantial on-chip RAM and 369 user I/Os makes it well suited for embedded designs that require integrated memory and significant external connectivity.

Backed by Intel’s FLEX 10K family heritage and the device’s clear electrical and environmental specifications, the EPF10K200SFC484-1N is a practical choice for engineering teams seeking a programmable, RoHS-compliant solution with defined supply and temperature parameters.

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