EPF10K200SBI356-2

The EPF10K200SBI356-2 is an industrial-grade FLEX 10KS® field programmable gate array (FPGA) supplied in a 356-ball low-profile BGA (35×35) package for surface-mount applications. It delivers substantial programmable logic capacity, on-chip RAM, and a large I/O count for reconfigurable system integration in industrial and embedded designs.

Built on the FLEX 10K device family architecture, this device targets designs that need dense logic, on-chip memory, and broad peripheral connectivity while supporting reconfiguration and boundary-scan testability.

Key Features

• Logic Capacity — Provides 9,984 logic elements to implement complex combinational and sequential functions.
• On‑chip Memory — 98,304 total RAM bits of embedded memory (approximately 96 Kbits) to support buffering, FIFOs, and small data stores without external memory.
• I/O Density — 274 user I/O pins for substantial external interfacing and parallel connectivity.
• Gate Count — 513,000 total gates to accommodate sizable programmable systems.
• Power Supply — Specified supply range of 2.375 V to 2.625 V to match system power domains requiring this voltage window.
• Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for use in temperature‑sensitive industrial environments.
• Package & Mounting — 356‑LBGA (356‑BGA, 35×35) surface‑mount package for high I/O density in a compact board footprint.
• Reconfigurability & Test — As a member of the FLEX 10K family, supports in-circuit reconfigurability and includes JTAG boundary-scan circuitry for board-level test without consuming device logic (series feature).
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly and regulatory compliance.

Typical Applications

• Industrial Control — Implement custom control logic, state machines, and protocol bridging while meeting industrial temperature requirements.
• Data Aggregation & Buffering — Use the on-chip memory and logic elements for packet buffering, aggregation, and data formatting tasks in embedded systems.
• High‑I/O Interfaces — Leverage 274 I/O pins for systems requiring wide parallel buses, sensor arrays, or multiple peripheral connections.
• System Integration / Prototyping — Rapidly prototype system-level functions and integrate diverse logic blocks on a single reconfigurable device.

Unique Advantages

• Substantial Logic Resources: 9,984 logic elements provide headroom for complex custom logic and multiple concurrent functions.
• Embedded Memory for Local Storage: 98,304 bits of RAM reduce dependence on external memory and simplify board-level BOM.
• Extensive I/O Connectivity: 274 user I/O pins enable broad external device interfacing without additional multiplexing hardware.
• Industrial Reliability: −40 °C to 85 °C operating range and industrial grade classification support deployment in harsh environments.
• Compact, High‑Density Package: 356‑LBGA (35×35) minimizes PCB area while preserving high pin count for dense designs.
• Design & Test Support (Series Feature): FLEX 10K family features such as JTAG boundary-scan and in-circuit reconfigurability help accelerate development and manufacturing test.

Why Choose EPF10K200SBI356-2?

The EPF10K200SBI356-2 balances substantial programmable logic, meaningful on-chip RAM, and a high I/O count in a compact 356‑LBGA package designed for industrial applications. It is suited to engineers and procurement teams seeking a reconfigurable device that supports system-level integration while operating across a broad temperature range.

Choosing this FLEX 10KS® device helps simplify board design by consolidating logic and memory requirements, reducing external components, and leveraging family-level features such as JTAG testability and reconfigurability for iterative development and manufacturing efficiency.

Request a quote or submit an inquiry to receive pricing and availability for the EPF10K200SBI356-2 and to discuss how it can fit into your next industrial or embedded FPGA design.