EPF10K200SFC484-1X
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA |
|---|---|
| Quantity | 1,176 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 369 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | 513000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200SFC484-1X – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA
The EPF10K200SFC484-1X is a FLEX 10K family field programmable gate array (FPGA) device designed for system-level integration and embedded logic applications. It combines a dense logic fabric with on-chip RAM and a large I/O count to support complex programmable functions and megafunction implementation.
Targeted at commercial-grade designs, this surface-mount FPGA offers a compact 484-BBGA package and characteristics suited for System-on-a-Programmable-Chip (SOPC) integration, memory-rich logic tasks, and high-pin-count interfacing within a 0 °C to 70 °C operating range.
Key Features
- Logic Capacity — 9,984 logic elements providing a foundation for implementing general logic functions and custom combinational/sequential logic.
- Gate Count — 513,000 reported gates to describe the device’s effective logic resources for mapping larger designs.
- Embedded Memory — 98,304 total RAM bits of on-chip memory (approximately 0.098 Mbits) for implementing buffers, FIFOs, and memory-based megafunctions.
- I/O Density — 369 user I/O pins enabling extensive peripheral interfacing, parallel buses, and multi-channel connectivity.
- Power Supply — Core voltage specified at 2.375 V to 2.625 V to match system power-rail requirements.
- Package & Mounting — 484-BBGA (supplier device package listed as 484-FBGA, 23×23) in a surface-mount form factor for compact board integration.
- Operating Conditions — Commercial-grade qualification with an operating temperature range of 0 °C to 70 °C.
- RoHS Compliant — Conforms to RoHS standards for restricted substances.
- Configurable Family Features — As a FLEX 10K family device, the series supports embedded array blocks and system-level features such as in-circuit reconfigurability and JTAG boundary-scan (series-level capabilities referenced from FLEX 10K documentation).
Typical Applications
- System-on-a-Programmable-Chip (SOPC) integration — Use the device’s logic and embedded memory to consolidate discrete functions into a single programmable component.
- Memory-based megafunctions — Implement efficient on-chip buffers, FIFOs, and specialized memory logic using the device’s 98,304 RAM bits.
- High-pin-count interfacing — Deploy the 369 I/O pins for parallel bus interfaces, multi-channel I/O, or complex peripheral connectivity.
- Board-level prototyping and integration — Surface-mount 484-BBGA package supports compact board layouts where board area and I/O density are important.
Unique Advantages
- Significant Logic Resources: 9,984 logic elements and 513,000 gates enable mapping of sizeable custom logic and control functions without immediately requiring external logic.
- On-chip Memory for Megafunctions: 98,304 bits of embedded RAM let you implement local buffers and memory-based processing close to the logic, reducing external memory dependency.
- Extensive I/O Capacity: 369 I/O pins provide flexibility for complex interfacing, allowing multiple peripherals or parallel channels to be handled directly by the FPGA.
- Compact Surface-Mount Package: The 484-BBGA (484-FBGA, 23×23) package balances high pin count with a small board footprint for space-constrained designs.
- Commercial-Grade Qualification: Rated for 0 °C to 70 °C operation, suitable for a wide range of commercial embedded systems.
- Standards and Compliance: RoHS compliance supports environmentally conscious design and regulatory requirements.
Why Choose EPF10K200SFC484-1X?
The EPF10K200SFC484-1X positions itself as a commercial-grade, high-density programmable logic option within the FLEX 10K family, combining nearly 10,000 logic elements, substantial on-chip RAM, and a large I/O count in a compact BGA package. These characteristics make it well suited for designers consolidating logic and memory functions into a single programmable device while retaining flexibility for interface-rich applications.
This device is appropriate for teams building SOPC-style integrations, memory-centric logic, or complex board-level I/O solutions who require a commercially rated FPGA with verified RoHS compliance and support for FLEX 10K family features such as in-circuit reconfigurability and JTAG boundary-scan.
Request a quote or submit a procurement inquiry to receive pricing, availability, and additional technical support for the EPF10K200SFC484-1X.

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