EPF10K200SFC484-1X

IC FPGA 369 I/O 484FBGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA

Quantity 1,176 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O369Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SFC484-1X – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA

The EPF10K200SFC484-1X is a FLEX 10K family field programmable gate array (FPGA) device designed for system-level integration and embedded logic applications. It combines a dense logic fabric with on-chip RAM and a large I/O count to support complex programmable functions and megafunction implementation.

Targeted at commercial-grade designs, this surface-mount FPGA offers a compact 484-BBGA package and characteristics suited for System-on-a-Programmable-Chip (SOPC) integration, memory-rich logic tasks, and high-pin-count interfacing within a 0 °C to 70 °C operating range.

Key Features

  • Logic Capacity — 9,984 logic elements providing a foundation for implementing general logic functions and custom combinational/sequential logic.
  • Gate Count — 513,000 reported gates to describe the device’s effective logic resources for mapping larger designs.
  • Embedded Memory — 98,304 total RAM bits of on-chip memory (approximately 0.098 Mbits) for implementing buffers, FIFOs, and memory-based megafunctions.
  • I/O Density — 369 user I/O pins enabling extensive peripheral interfacing, parallel buses, and multi-channel connectivity.
  • Power Supply — Core voltage specified at 2.375 V to 2.625 V to match system power-rail requirements.
  • Package & Mounting — 484-BBGA (supplier device package listed as 484-FBGA, 23×23) in a surface-mount form factor for compact board integration.
  • Operating Conditions — Commercial-grade qualification with an operating temperature range of 0 °C to 70 °C.
  • RoHS Compliant — Conforms to RoHS standards for restricted substances.
  • Configurable Family Features — As a FLEX 10K family device, the series supports embedded array blocks and system-level features such as in-circuit reconfigurability and JTAG boundary-scan (series-level capabilities referenced from FLEX 10K documentation).

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) integration — Use the device’s logic and embedded memory to consolidate discrete functions into a single programmable component.
  • Memory-based megafunctions — Implement efficient on-chip buffers, FIFOs, and specialized memory logic using the device’s 98,304 RAM bits.
  • High-pin-count interfacing — Deploy the 369 I/O pins for parallel bus interfaces, multi-channel I/O, or complex peripheral connectivity.
  • Board-level prototyping and integration — Surface-mount 484-BBGA package supports compact board layouts where board area and I/O density are important.

Unique Advantages

  • Significant Logic Resources: 9,984 logic elements and 513,000 gates enable mapping of sizeable custom logic and control functions without immediately requiring external logic.
  • On-chip Memory for Megafunctions: 98,304 bits of embedded RAM let you implement local buffers and memory-based processing close to the logic, reducing external memory dependency.
  • Extensive I/O Capacity: 369 I/O pins provide flexibility for complex interfacing, allowing multiple peripherals or parallel channels to be handled directly by the FPGA.
  • Compact Surface-Mount Package: The 484-BBGA (484-FBGA, 23×23) package balances high pin count with a small board footprint for space-constrained designs.
  • Commercial-Grade Qualification: Rated for 0 °C to 70 °C operation, suitable for a wide range of commercial embedded systems.
  • Standards and Compliance: RoHS compliance supports environmentally conscious design and regulatory requirements.

Why Choose EPF10K200SFC484-1X?

The EPF10K200SFC484-1X positions itself as a commercial-grade, high-density programmable logic option within the FLEX 10K family, combining nearly 10,000 logic elements, substantial on-chip RAM, and a large I/O count in a compact BGA package. These characteristics make it well suited for designers consolidating logic and memory functions into a single programmable device while retaining flexibility for interface-rich applications.

This device is appropriate for teams building SOPC-style integrations, memory-centric logic, or complex board-level I/O solutions who require a commercially rated FPGA with verified RoHS compliance and support for FLEX 10K family features such as in-circuit reconfigurability and JTAG boundary-scan.

Request a quote or submit a procurement inquiry to receive pricing, availability, and additional technical support for the EPF10K200SFC484-1X.

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