EPF10K200SFC484-2X

The EPF10K200SFC484-2X is a FLEX 10K family field programmable gate array (FPGA) manufactured by Intel. It combines a high-density logic array with embedded memory resources and a large I/O count to support system-level programmable logic integration.

Designed for applications that require substantial on-chip logic, embedded memory, and extensive I/O in a compact ball-grid array, this commercial-grade device supports System-on-a-Programmable-Chip (SOPC) style integration and series-level features such as embedded arrays for megafunctions and JTAG boundary-scan.

Key Features

• Logic Density – 9,984 logic elements and approximately 513,000 gates provide substantial on-chip logic capacity for complex combinational and sequential designs.
• Embedded Memory – 98,304 total RAM bits (approximately 98 Kbits) suitable for on-chip buffers, FIFOs, and other embedded memory functions.
• Logic Array Blocks (LABs) – 1,248 LABs enable organized logic clustering and predictable resource allocation across the device.
• I/O and Package – 369 user I/O pins in a 484‑BBGA package (supplier device package: 484‑FBGA, 23×23). Surface-mount mounting type supports compact board integration.
• Supply and Temperature – Specified supply voltage range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 70 °C.
• Series-Level System Features – FLEX 10K family features include embedded arrays for megafunctions, low-skew clock distribution, dedicated carry and cascade chains, and JTAG boundary-scan support for board-level testability.
• Compliance – RoHS‑compliant and specified as commercial grade.

Typical Applications

• System Integration & SOPC – Use the device’s embedded arrays and logic capacity to implement on-chip megafunctions and glue logic for system-level programmable integration.
• I/O-Intensive Interfaces – High I/O count (369 pins) makes the device suitable for designs requiring many parallel interfaces or mixed peripheral connections.
• Embedded Memory Functions – The on-chip RAM (98,304 bits) is well suited for small buffers, FIFOs, and temporary storage directly inside the FPGA fabric.
• Prototyping and Development – Dense logic and series-level support for JTAG boundary-scan and clock management ease hardware prototyping and board-level validation.

Unique Advantages

• High logic capacity in a compact package: Nearly 10k logic elements and over half a million gates packaged in a 484‑BBGA provide a balance of density and board-space efficiency.
• Substantial embedded memory: Approximately 98 Kbits of on-chip RAM minimizes external memory dependencies for many control and buffering tasks.
• Large I/O resources: 369 user I/O pins support complex interfacing and parallel signal routing without immediate need for external multiplexing.
• Designed for system-level functions: FLEX 10K family features such as embedded arrays for megafunctions and dedicated carry/cascade chains simplify implementation of arithmetic, memory, and glue logic.
• Testability and board validation: Series-level JTAG boundary-scan support aids board-level test and in-circuit reconfigurability workflows.
• Regulatory and assembly readiness: Surface-mount 484‑BBGA packaging and RoHS compliance align with modern PCB assembly and environmental requirements.

Why Choose EPF10K200SFC484-2X?

The EPF10K200SFC484-2X positions itself as a practical choice for designers who need a balance of logic density, embedded RAM, and extensive I/O in a compact, surface-mount BGA package. Its FLEX 10K family attributes—embedded arrays for megafunctions, dedicated arithmetic chains, and series-level clock and test features—support system-oriented designs that integrate multiple functions on programmable fabric.

This device is well suited to commercial-grade projects that require scalable logic resources and on-chip memory while maintaining board-space efficiency and manufacturability. It offers a clear upgrade path within the FLEX 10K family for designs needing broader capacity or additional system features.

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