EPF10K200SFC484-3N

The EPF10K200SFC484-3N is a FLEX 10K family field programmable gate array (FPGA) in a compact 484-ball BGA package. It combines a high density of logic elements with substantial on-chip memory and a large I/O count to support system-level integration and programmable logic functions.

Designed for commercial-grade applications, this device provides embedded memory, in-circuit reconfigurability via JTAG/configuration devices, and a broad I/O complement for complex digital designs where integration and board-space efficiency matter.

Key Features

• Logic Capacity — 9,984 logic elements providing the programmable fabric for combinational and sequential logic.
• Embedded Memory — Approximately 98 kbits (98,304 bits) of on-chip RAM to support buffers, FIFOs, and small data tables without external memory.
• I/O Density — 369 user I/O pins to interface with multiple peripherals, sensors, and high-pin-count subsystems.
• Gate Count — 513,000 gates for mapping larger logic functions and system glue logic.
• Logic Array Blocks (LABs) — 1,248 LABs for structured logic partitioning and efficient place-and-route.
• In-Circuit Reconfigurability & JTAG — Supports in-circuit reconfiguration and includes JTAG boundary-scan for device programming and board-level testability.
• Package & Mounting — 484-BBGA package; supplier device package listed as 484-FBGA (23×23). Surface-mount mounting type for modern PCB assembly.
• Power — Core/operating supply range of 2.375 V to 2.625 V to match target system power domains.
• Operating Temperature — Commercial grade operation from 0 °C to 70 °C.
• Environmental Compliance — RoHS compliant for lead-free assembly and regulatory support.

Typical Applications

• System-on-a-Programmable-Chip (SOPC) — Integration of custom logic, on-chip memory, and high-density I/O for compact system-level designs.
• Prototyping and Development — Reconfigurable logic and JTAG support make the device suitable for iterative design and validation of digital subsystems.
• High-I/O Signal Glue and Interface Bridging — Large I/O count enables use as an interface bridge or glue logic between multiple peripherals and controllers.
• Embedded Control and Logic Acceleration — On-chip RAM and substantial logic resources support control tasks, state machines, and accelerators within commercial electronic products.

Unique Advantages

• High Logic Integration: Nearly 10,000 logic elements and 513,000 gates allow substantial integration of digital functions into a single device, reducing BOM count.
• On-Chip Memory: Approximately 98 kbits of embedded RAM supports local buffering and small data structures without external memory components.
• Extensive I/O: 369 user I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and peripheral connections.
• Compact, Surface-Mount BGA: 484-ball BGA packaging and surface-mount mounting enable dense board layouts and efficient use of PCB area.
• In-System Reconfiguration and Test: JTAG boundary-scan and in-circuit reconfigurability simplify programming, debug, and board-level test strategies.
• Regulatory Readiness: RoHS compliance supports modern assembly and regulatory needs for commercial products.

Why Choose EPF10K200SFC484-3N?

The EPF10K200SFC484-3N positions itself as a commercially graded, highly integrated FPGA option for designers who need a balance of logic capacity, embedded memory, and extensive I/O in a compact BGA package. Its combination of nearly 10,000 logic elements, substantial on-chip RAM, and 369 I/Os makes it suitable for mid-density programmable logic tasks and system integration where board space and flexibility are important.

For engineering teams building programmable control logic, interface bridging, or SOPC-style subsystems, this device delivers reconfigurability and testability (via JTAG) while meeting common commercial temperature and RoHS requirements—helping accelerate development and simplify BOMs.

Request a quote or submit a pricing inquiry to check availability and lead times for EPF10K200SFC484-3N. Our team can provide ordering information and assist with technical packaging or supply questions.