EPF10K200SFC672-2X

The EPF10K200SFC672-2X is an Intel FLEX 10K family field programmable gate array (FPGA) offered in a 672‑ball BGA package. It combines a high logic element count with substantial embedded RAM and a large I/O complement to support system-level, reconfigurable digital designs.

Designed for embedded and system-integration use, the device is suited to applications that require dense programmable logic, on-chip memory, and high pin count connectivity while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity — 9,984 logic elements (LEs) and approximately 513,000 gates for implementation of medium- to high-density logic functions.
• Embedded Memory — 98,304 total RAM bits (approximately 0.098 Mbits) of on-chip memory for FIFOs, buffers, and local data storage.
• I/O and Package — 470 user I/O pins in a 672‑BBGA package (supplier package: 672‑FBGA, 27×27); surface-mount mounting for compact board integration.
• Power and Temperature — Device supply range 2.375 V to 2.625 V; rated for commercial operating temperature from 0 °C to 70 °C.
• Configuration and Test — Supports in-circuit reconfigurability and includes JTAG boundary-scan test capabilities as part of the FLEX 10K family feature set.
• Family-Level Architecture — FLEX 10K family features include embedded arrays for megafunctions, dedicated carry and cascade chains, low-skew clock distribution, and FastTrack interconnect for predictable routing performance.
• RoHS Compliance — Device is RoHS compliant for lead-free assembly environments.

Typical Applications

• System Integration and SOPC: Implement custom system-on-programmable-chip functions where embedded logic and memory reduce external components and simplify board design.
• High‑Pin I/O Interfaces: Use the 470 I/Os for dense parallel interfaces, protocol bridging, or multi-channel I/O aggregation on compact PCBs.
• Buffering and Data Path Logic: Leverage the on-chip RAM and logic elements for FIFOs, packet buffering, and intermediate data processing in communication or data-acquisition systems.

Unique Advantages

• High logic density: Nearly 10,000 logic elements provide substantial on-chip programmable logic to consolidate discrete logic and glue functions.
• Large I/O count in a compact BGA: 470 user I/Os in a 672‑ball package enable high connectivity without a large footprint.
• On‑chip memory for system tasks: 98,304 bits of embedded RAM reduce reliance on external memory for buffering and local storage.
• Reconfigurability and test support: In-circuit reconfigurability plus JTAG boundary-scan support eases development, manufacturing test, and field updates.
• Vendor ecosystem: Part of the FLEX 10K family with established development tool support and family-level features for predictable timing and routing.

Why Choose EPF10K200SFC672-2X?

The EPF10K200SFC672-2X delivers a balance of programmable logic capacity, meaningful on-chip memory, and a high I/O count in a surface-mount BGA package. Its specification set fits commercial embedded applications that require system-level integration, flexible I/O, and field reconfigurability.

Engineers and procurement teams looking to consolidate board-level components, implement custom data paths, or build reconfigurable interfaces will find the FLEX 10K architecture and Intel support resources advantageous for development and lifecycle management.

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