EPF10K200SFI672-2

The EPF10K200SFI672-2 is an Intel FLEX-10KS series field programmable gate array designed for high-density, reconfigurable logic applications. It combines an embedded programmable logic architecture with substantial on-chip memory and a large number of I/O pins to address system-level integration and complex interface requirements.

Targeted at industrial applications, this surface-mount device provides 9,984 logic elements, approximately 98,304 bits of embedded RAM, and 470 user I/O pins in a compact 672-BBGA package, enabling dense, high-I/O designs that require wide operating temperature and RoHS compliance.

Key Features

• Core Logic Density  9,984 logic elements and 1,248 LABs provide a scalable resource pool for implementing complex combinational and sequential logic.
• On‑Chip Memory  Approximately 98,304 bits of embedded RAM support data buffering, FIFOs, and small lookup tables without external memory.
• I/O Capacity  470 user I/O pins accommodate multiple high‑pin-count interfaces and dense connectivity requirements.
• System Gate Count  A device gate count of 513,000 supports large-scale logic integration on a single device.
• Package & Mounting  672-BBGA (672-FBGA 27×27) surface-mount package balances board area efficiency and thermal handling for compact system layouts.
• Power Supply  Operates from a core voltage range of 2.375 V to 2.625 V, suitable for systems targeting that supply domain.
• Temperature & Grade  Industrial grade with an operating temperature range of –40°C to 85°C for reliable field use.
• Test & Configuration  Family-level features include built-in JTAG boundary-scan support and in‑circuit reconfigurability options for board-level test and configuration (as documented for the FLEX 10K family).
• Compliance  RoHS compliant to support lead‑free manufacturing processes.

Typical Applications

• Industrial Control  Implement motor control logic, deterministic IO handling, and protocol bridging using abundant logic elements and I/O pins in an industrial temperature envelope.
• Communications & Networking  Use the device for packet buffering, protocol conversion, and interface aggregation where high pin count and embedded RAM are required.
• Test & Measurement  Deploy as a reconfigurable processing and I/O hub for instrumentation that needs flexible logic and on‑board memory for acquisition and preprocessing.
• Embedded System Integration  Integrate peripheral glue logic, custom accelerators, and memory-mapped functions to reduce BOM and consolidate functionality on a single FPGA.

Unique Advantages

• High logic and gate density: 9,984 logic elements and a 513,000-gate count let you consolidate functions that would otherwise require multiple devices.
• Large I/O complement: 470 user I/O pins simplify interfacing to multiple subsystems and reduce external buffering requirements.
• Embedded RAM for on‑chip buffering: Approximately 98 Kbits of RAM supports FIFOs, small frame buffers, and state storage without external memory.
• Industrial temperature range: Rated for –40°C to 85°C to meet demanding environmental requirements.
• Compact, manufacturable package: 672-BBGA surface-mount package offers high pin density while remaining RoHS compliant for modern production flows.
• Series-level design support: FLEX 10K family features and tool support (as documented for the family) enable established design flows, boundary-scan test, and in-circuit reconfiguration approaches.

Why Choose EPF10K200SFI672-2?

The EPF10K200SFI672-2 is positioned for engineers who need a high-density, I/O-rich programmable device in an industrial-grade package. Its combination of nearly 10k logic elements, substantial on-chip RAM, and 470 I/Os makes it well suited to consolidate interface logic, buffering, and mid‑level processing into a single, reconfigurable device.

For designs that prioritize integration, predictable board area, and deployment across a wide temperature range, this FLEX-10KS device offers a balance of resources and package density, backed by the FLEX 10K family feature set and design support documented for the series.

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