EPF10K200SFI672-2B

The EPF10K200SFI672-2B is an industrial-grade FLEX 10K family field programmable gate array (FPGA) device in a 672-ball BGA package. It combines a dense logic array with dedicated embedded array blocks (EABs) and abundant I/O to support system-on-a-programmable-chip (SOPC) designs for communications, industrial control, and complex digital processing.

Designed for integration and flexibility, the device provides 9,984 logic elements, approximately 98,304 bits of embedded RAM, and up to 470 user I/O pins, enabling high I/O bandwidth, on-chip memory, and mid-range logic capacity in a single surface-mount package.

Key Features

• Logic Capacity — 9,984 logic elements (LEs) and up to 513,000 maximum system gates, suitable for complex control, glue-logic and medium-density SoC functions.
• Embedded Memory — Approximately 98,304 bits of on-chip RAM implemented across embedded array blocks (EABs) to support dual-port memory configurations and efficient megafunctions.
• I/O and Voltage — Up to 470 user I/O pins; MultiVolt I/O architecture supports interfacing with 2.5 V, 3.3 V, or 5.0 V devices as described in the FLEX 10KE family documentation. Device internal supply operates around 2.5 V (specified supply range: 2.375 V to 2.625 V).
• Clocking and Performance — Built-in low-skew clock distribution and support for multiple global clocks; bidirectional I/O timing performance described in the family data (I/O timing up to the documented family limits).
• Dedicated Arithmetic and Routing — Dedicated carry and cascade chains plus FastTrack interconnect structure to accelerate arithmetic operations and predictable routing for synthesis tools and megafunctions.
• System-Level Features — In-circuit reconfigurability via external configuration devices or JTAG, built-in IEEE 1149.1 JTAG boundary-scan test circuitry, pull-ups on I/O during configuration, and support for hot-socketing as described for the FLEX 10KE family.
• Package & Mounting — 672-ball BGA surface-mount package (supplier device package: 672-FBGA, 27 × 27 mm), offering a compact footprint for dense board designs.
• Industrial Temperature Grade & Compliance — Rated for operation from −40 °C to 85 °C and RoHS compliant for deployment in industrial environments.

Typical Applications

• Industrial Control — Implement complex control logic, deterministic I/O handling, and on-chip buffering for factory automation and motion control systems, leveraging the industrial temperature rating and abundant I/O.
• Communications Interfaces — Bridge and protocol logic, PHY interfacing and packet handling where multiple I/O standards and embedded RAM are required to buffer and process data streams.
• Embedded System Integration — System-on-a-programmable-chip (SOPC) use cases that combine custom logic, on-chip memory, and multiple clock domains for compact embedded controllers or appliance controllers.
• Prototyping and Board-Level Glue Logic — Mid-density programmable fabric for prototyping ASIC functions, consolidating discrete logic, and implementing wide fan-in/fan-out functions using dedicated cascade and carry chains.

Unique Advantages

• Balanced Logic and Memory — Nearly 10k logic elements paired with ~98kbits of embedded RAM enable mixed compute-and-buffer designs without sacrificing logic capacity.
• High I/O Count — Up to 470 user I/O pins allow broad connectivity for multi-channel interfaces, bus bridging, and dense peripheral integration.
• Industrial Reliability — −40 °C to 85 °C operating range and surface-mount BGA packaging make the device suitable for industrial deployment and long-term board-level integration.
• System-Level Testability — IEEE 1149.1 JTAG boundary-scan support simplifies board test and in-system programming without consuming user logic resources.
• Flexible Power and I/O Interfacing — 2.5 V internal supply operation with MultiVolt I/O capabilities described for the family eases mixed-voltage system design.
• Compact, High-Density Package — 672-ball BGA package offers a high pin-count solution in a compact footprint for space-constrained designs.

Why Choose EPF10K200SFI672-2B?

The EPF10K200SFI672-2B delivers a practical combination of mid-range logic density, substantial on-chip RAM, and a high pin count in an industrial-temperature, RoHS-compliant BGA package. It is positioned for engineers who need to integrate memory-intensive megafunctions, complex control logic, and high-bandwidth I/O within a single device footprint.

Choose this device when you require scalable FPGA resources with dedicated arithmetic and routing support, system-level testability via JTAG, and a package suitable for surface-mount manufacturing in industrial applications. The FLEX 10KE family design features documented in the device datasheet provide the architectural capabilities to streamline place-and-route and megafunction implementation.

Request a quote or submit a sales inquiry today to obtain pricing, availability, and lead-time information for the EPF10K200SFI672-2B.