EPF10K200SRC240-1X
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 182 98304 9984 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 223 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 182 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | 513000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200SRC240-1X – FLEX-10KS FPGA, 9,984 logic elements, 182 I/O, 240-BFQFP
The EPF10K200SRC240-1X is an Intel FLEX-10KS field programmable gate array (FPGA) in a 240-BFQFP exposed-pad package intended for commercial applications. It combines a logic array of 9,984 logic elements with substantial on-chip RAM and a high-density I/O complement to support configurable digital designs and system-on-a-programmable-chip integration.
Built on the FLEX 10K family architecture, the device is targeted at commercial embedded systems and electronic products that require board-level programmable logic, memory integration, and flexible I/O routing while operating within a 0 °C to 70 °C range.
Key Features
- Logic Capacity — 9,984 logic elements (LEs) and 513,000 gates provide a mid-range programmable logic resource for implementing custom digital functions.
- On-chip Memory — Total RAM bits: 98,304, providing approximately 0.098 Mbits of embedded memory for buffers, FIFOs, and state storage.
- I/O Density — 182 user I/O pins support a wide range of external interfaces and board-level connectivity.
- Power Supply — Operates from a specified voltage supply range of 2.375 V to 2.625 V.
- Package & Mounting — Surface-mount 240-BFQFP (exposed pad) package; supplier device package listed as 240-RQFP (32×32) for PCB footprint reference.
- Commercial Grade Operating Range — Rated for 0 °C to 70 °C ambient operation.
- Reconfigurability & Family Capabilities — As part of the FLEX 10K family, it leverages family-level features such as embedded arrays for megafunctions, FastTrack interconnect, dedicated carry and cascade chains, and JTAG boundary-scan support (family-level features described in the FLEX 10K documentation).
- Regulatory Compliance — RoHS compliant.
Typical Applications
- System Integration & Prototyping — Use the device for SOPC-style integration and rapid hardware prototyping where reconfigurable logic and embedded memory simplify board-level validation.
- I/O-Intensive Interfaces — Deploy in applications requiring numerous external connections; 182 I/O pins enable bridging between multiple peripherals or subsystems.
- Embedded Control & Glue Logic — Implement custom control logic, protocol translation, and glue logic for commercial electronic equipment within the specified temperature range.
- Memory-Backed Logic Functions — Utilize on-chip RAM for buffering, small packet storage, look-up tables, and state machines where embedded memory reduces external component count.
Unique Advantages
- Balanced Logic and Memory Mix: 9,984 logic elements combined with 98,304 bits of RAM provide a versatile resource set for mid-complexity designs.
- High I/O Count: 182 I/O pins support complex interfacing without immediate need for external I/O expanders, simplifying board layout.
- Commercial-Focused Specification: Commercial operating temperature (0 °C to 70 °C) and surface-mount package choices match typical commercial product development and manufacturing flows.
- Compact, Industry-Standard Packaging: 240-BFQFP exposed-pad package offers a standard SMT footprint for board-level density and thermal management options.
- RoHS Compliant: Meets RoHS requirements for lead-free assembly and commercial product deployment.
- Family-Level Feature Set: Draws on FLEX 10K family capabilities such as embedded arrays, dedicated arithmetic chains, and JTAG boundary-scan to ease implementation of common FPGA functions (as documented in the FLEX 10K family materials).
Why Choose EPF10K200SRC240-1X?
The EPF10K200SRC240-1X offers a practical combination of logic density, embedded memory, and I/O capacity in a commercial-grade FPGA package. Its specification set supports a broad range of mid-complexity programmable logic tasks where board-level reconfigurability, embedded RAM, and plentiful I/O are required.
This device is well-suited to design teams building commercial embedded systems, communications equipment, and consumer/business electronics that need a flexible, reprogrammable logic element with family-backed capabilities and RoHS compliance. The FLEX 10K family pedigree provides documented architecture and features that align with typical FPGA-based integration and prototyping workflows.
Request a quote or submit a pricing request for EPF10K200SRC240-1X to receive availability and ordering information tailored to your project needs.

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