EPF10K200SRC240-1N

IC FPGA 182 I/O 240RQFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 182 98304 9984 240-BFQFP Exposed Pad

Quantity 204 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O182Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SRC240-1N – FLEX-10KS Field Programmable Gate Array (FPGA), 9,984 logic elements, 98,304 bits RAM, 182 I/O, 240-BFQFP

The EPF10K200SRC240-1N is a commercial-grade FLEX-10KS field programmable gate array (FPGA) offered by Intel. It provides a balance of programmable logic, embedded memory, and I/O density suitable for a wide range of commercial embedded designs and product development projects.

Built on the FLEX 10K family architecture, the device combines approximately 9,984 logic elements with 98,304 bits of embedded RAM and 182 user I/O pins, enabling integration of custom glue-logic, interfaces, and on-chip memory without adding external components.

Key Features

  • Core Logic  Approximately 9,984 logic elements (LEs) and a reported 513,000 system gates provide a programmable fabric for control logic, state machines, and custom datapaths.
  • Embedded Memory  Approximately 98,304 bits of on-chip RAM support local buffering, FIFOs, and small lookup tables to reduce external memory requirements.
  • I/O Resources  182 user I/O pins enable dense connectivity for parallel buses, peripheral interfaces, and mixed-signal front ends in commercial designs.
  • Power  Device supply operation is specified between 2.375 V and 2.625 V, allowing designers to plan power distribution and level translation precisely for their system.
  • Package and Mounting  Surface-mount 240-BFQFP with exposed pad (supplier package 240-RQFP, 32×32) offers a compact footprint with thermal pad for PCB thermal management.
  • Operating Range & Compliance  Commercial operating temperature from 0 °C to 70 °C and RoHS compliance make the device suitable for standard commercial product environments.
  • FLEX 10K Family Capabilities  As part of the FLEX 10K family, the device inherits family-level features such as embedded arrays for implementing megafunctions, in-circuit reconfigurability options, and built-in JTAG boundary-scan test circuitry (family-level datasheet).

Typical Applications

  • Commercial Embedded Systems  Implement control logic, protocol bridging, and interface glue in compact commercial products where on-chip memory and moderate I/O count reduce BOM and board complexity.
  • Communications and Networking  Use the FPGA for custom packet handling, parallel bus interfacing, or timing-critical glue logic leveraging the available logic elements and I/O resources.
  • Prototyping and Product Development  Rapidly develop and iterate digital functions and system prototypes that require reprogrammable logic and embedded RAM for stateful behaviors.
  • Consumer and Industrial-Grade Commercial Devices  Integrate user interfaces, peripheral control, and data buffering in commercial products designed for 0 °C to 70 °C operation.

Unique Advantages

  • Balanced Logic and Memory:  Approximately 9,984 logic elements paired with ~98,304 bits of embedded RAM enable designers to implement both combinational and stateful functions on-chip.
  • High I/O Count:  182 user I/O pins provide the flexibility to interface multiple peripherals or parallel buses without external expanders.
  • Compact Surface-Mount Package:  The 240-BFQFP exposed pad package delivers a high pin count in a manageable PCB area while supporting thermal relief through the exposed pad.
  • Commercial Grade and RoHS Compliant:  Specified for 0 °C to 70 °C operation and RoHS compliance to meet common commercial product requirements.
  • Family-Level Reconfigurability:  As a FLEX 10K family device, it supports family features such as in-circuit reconfigurability and built-in JTAG boundary-scan for test and configuration workflows.

Why Choose EPF10K200SRC240-1N?

The EPF10K200SRC240-1N delivers a practical combination of programmable logic, embedded memory, and substantial I/O in a commercial-grade FPGA package. Its specification set is well suited to designers who need on-chip RAM, flexible I/O routing, and a reprogrammable platform for product development and commercial deployments.

Choose this part when your design requires moderate logic density with embedded memory, a compact 240-pin surface-mount package with thermal pad, and commercial temperature operation backed by the FLEX 10K family feature set.

Request a quote or submit a purchase inquiry to receive pricing and availability for EPF10K200SRC240-1N. Our team can provide lead-time and order support to help integrate this device into your next commercial design.

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