EPF10K200SRC240-2

IC FPGA 182 I/O 240RQFP
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 182 98304 9984 240-BFQFP Exposed Pad

Quantity 766 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O182Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SRC240-2 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC

The EPF10K200SRC240-2 is a FLEX-10KS family field programmable gate array (FPGA) optimized for commercial embedded logic applications. It provides reprogrammable logic, on-chip memory, and plentiful I/O for system-on-a-programmable-chip integration, enabling custom peripheral implementation, interface bridging, and control logic consolidation.

Key Features

  • Logic Capacity  Approximately 9,984 logic elements supporting complex custom logic implementations and combinational/sequential designs.
  • Gate Count  513,000 gates to support dense logic functions and moderate system integration on a single device.
  • Embedded Memory  98,304 total RAM bits (approximately 0.098 Mbits) for on-chip storage of state, buffers, and small lookup tables.
  • I/O and Interfaces  182 user I/O pins to support multiple parallel buses, peripheral interfaces, and signal-level partitioning.
  • Reconfigurability and Test  In-circuit reconfigurability via external configuration device or JTAG; includes JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990 for board-level diagnostics.
  • Flexible I/O Options  Datasheet family features such as programmable slew-rate control, tri-state control and open-drain options are available for flexible signal conditioning and interfacing.
  • Package and Mounting  Surface-mount 240-BFQFP with exposed pad (supplier package: 240-RQFP 32×32) for thermal performance and PCB assembly compatibility.
  • Power  Specified supply range 2.375 V to 2.625 V to match the system power domain requirements noted for this device.
  • Commercial Grade  Rated for 0 °C to 70 °C operation and specified as commercial grade for appropriate environments.
  • Compliance  RoHS compliant, supporting lead-free assembly processes.

Typical Applications

  • Embedded System Integration  Implement custom peripherals, glue logic, and SOPC-style functions where reprogrammable logic and on-chip memory reduce external parts.
  • Interface Bridging and Protocol Conversion  Use the device’s 182 I/O pins and flexible I/O control to bridge parallel and serial buses or adapt between voltage/pin configurations.
  • Prototyping and Development Platforms  Leverage reconfigurability and JTAG support for iterative hardware development and in-circuit debugging.
  • Control and Glue Logic  Replace multiple discrete components with consolidated programmable logic for motor control, timing, and custom state machines within commercial-temperature systems.

Unique Advantages

  • High Logic Density: The combination of ≈9,984 logic elements and 513,000 gates enables substantial functional integration on a single FPGA device, reducing board complexity.
  • On-Chip Memory: 98,304 bits of embedded RAM provide local storage for buffers, FIFOs, and lookup tables without adding external memory components.
  • Generous I/O Count: 182 user I/O pins accommodate multiple peripheral connections and parallel interfaces, simplifying board-level routing and partitioning.
  • Reconfiguration and Testability: In-circuit reconfigurability and IEEE 1149.1-compliant JTAG boundary-scan support streamline programming, updates, and board-level testing.
  • Commercial Temperature and RoHS Compliant: Commercial temperature rating (0 °C to 70 °C) and RoHS compliance align with modern lead-free assembly and commercial product deployment.
  • Compact, Assembly-Friendly Package: The 240-BFQFP exposed pad package (240-RQFP 32×32) supports surface-mount assembly with an exposed pad for improved thermal dissipation.

Why Choose EPF10K200SRC240-2?

EPF10K200SRC240-2 offers a balanced mix of logic density, embedded memory, and I/O capacity suitable for commercial embedded designs that require reprogrammable logic and in-system configurability. Its package and power specifications make it straightforward to integrate into compact PCBs while maintaining thermal and assembly compatibility.

This device is well suited for engineering teams developing custom peripherals, interface converters, and prototype platforms where on-chip memory, JTAG-based testability, and flexible I/O lower BOM count and accelerate development cycles. Datasheet-backed family features and design-tool support provide a predictable path from concept to deployed hardware.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the EPF10K200SRC240-2.

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