EPF10K200SRC240-3

The EPF10K200SRC240-3 is a FLEX-10KS field programmable gate array (FPGA) IC providing 9,984 logic elements, approximately 98,304 bits of embedded RAM, and 182 user I/O pins in a 240‑BFQFP exposed-pad package. It is a surface-mount, commercial-grade device designed for reconfigurable logic and system integration.

Built for designs that require on-chip memory, plentiful logic resources, and flexible I/O, this device supports in-circuit reconfiguration and family-level features such as embedded arrays for megafunctions and JTAG boundary-scan test. Typical use cases include SOPC-style integration, custom peripheral interfacing, and on-board logic acceleration.

Key Features

• Core Logic  9,984 logic elements provide distributed programmable logic capacity suitable for mid-density custom logic and control functions.
• Embedded Memory  Approximately 98,304 bits of on-chip RAM to implement buffers, small data stores, or megafunction memory without consuming external memory components.
• I/O & Interfaces  182 user I/O pins enable flexible peripheral connectivity and board-level interfacing for dense mixed-signal and digital designs.
• Configuration & Test  Supports in-circuit reconfigurability and includes JTAG boundary-scan test capability for programming and board-level test access (family feature).
• Clocking & Interconnect  Family-level architecture includes dedicated routing resources and clock distribution features designed to simplify clocking and high-fan-in logic implementations.
• Power  Operates from a core supply range of 2.375 V to 2.625 V, allowing predictable power budgeting for the core domain.
• Package & Mounting  240-BFQFP exposed-pad package (supplier device package: 240‑RQFP, 32×32) in a surface-mount form factor for straightforward PCB assembly and thermal management.
• Operating Range  Commercial operating temperature range of 0 °C to 70 °C to match standard commercial electronics environments.
• Environmental Compliance  RoHS compliant for use in lead-free manufacturing processes.

Typical Applications

• System Integration / SOPC: Use the device’s embedded memory and programmable logic to consolidate multiple functions into a single reconfigurable chip for compact system designs.
• Peripheral / Interface Control: Implement custom interface logic, protocol bridges, and I/O conditioning across 182 available I/O pins to connect diverse peripherals.
• On-Board Acceleration: Offload dedicated control or data-path functions to on-chip logic and RAM to reduce external component count and improve system responsiveness.
• Prototyping & Development: Reconfigurable logic and JTAG support enable iterative hardware development and board-level testing without extensive redesign.

Unique Advantages

• Balanced Logic and Memory: Nearly 10,000 logic elements combined with ~98,304 bits of embedded RAM enable moderate-density logic plus local data storage without external memory.
• Ample I/O Density: 182 user I/O pins give designers flexibility to implement complex peripheral layouts and multiple interfaces on a single device.
• Compact, Serviceable Package: The 240‑BFQFP exposed-pad surface-mount package provides a compact footprint with an exposed pad for improved thermal conduction on populated boards.
• In-Circuit Reconfigurability: Family-level support for in-circuit reprogramming and JTAG test access simplifies field updates and manufacturing test flows.
• Regulatory and Manufacturing Ready: RoHS compliance aligns with modern, lead‑free assembly processes for commercial production.

Why Choose EPF10K200SRC240-3?

The EPF10K200SRC240-3 positions itself as a mid-density, commercially graded FLEX-10KS FPGA that combines roughly 9,984 logic elements, substantial on-chip RAM, and 182 I/O in a serviceable 240‑pin exposed-pad package. Its core voltage range and package choice make it suitable for designs that prioritize on-board integration and reconfigurability while keeping BOM complexity in check.

This device is well suited to development teams and production designs requiring compact programmable logic with embedded memory for system integration, interface control, or prototyping. Its family-level features—such as embedded array support for megafunctions and JTAG boundary-scan—help streamline board-level testing and in-field updates, providing long-term flexibility and maintainability for commercial electronic products.

Request a quote or submit an RFQ to evaluate the EPF10K200SRC240-3 for your next design project.