EPF10K20RC208-3

The EPF10K20RC208-3 is a FLEX-10K family field programmable gate array (FPGA) in a 208-BFQFP exposed-pad surface-mount package. It combines a moderate-density logic array with embedded memory to support System-on-a-Programmable-Chip (SOPC) integration and implementation of megafunctions such as efficient memory and specialized logic.

Designed for commercial embedded applications, this device provides 1,152 logic elements across 144 logic array blocks, approximately 12,288 bits of on-chip RAM, and 147 user I/Os—delivering flexible integration for control, interface, and logic-acceleration tasks while operating from a 4.75 V to 5.25 V supply.

Key Features

• Core Logic 1,152 logic elements organized into 144 logic array blocks (LABs), supporting complex programmable logic implementations.
• On-chip Memory Approximately 12,288 bits of total RAM for embedded data storage and buffering within logic designs.
• Logic Capacity Approximately 63,000 system gates (as specified), enabling mid-density integration of logic and memory functions.
• I/O and Power 147 user I/O pins and a specified voltage supply range of 4.75 V to 5.25 V for 5.0-V systems; individual I/O control features are provided at the family level.
• System-Level Features Family-level capabilities include support for SOPC integration, embedded arrays for megafunctions, JTAG boundary-scan (IEEE 1149.1) for in-circuit testing and configuration, and in-circuit reconfigurability options.
• Clock & Interconnect Family-level features include low-skew clock distribution and dedicated routing resources for arithmetic (carry) and high-fan-in (cascade) operations to support efficient timing and arithmetic functions.
• Package & Mounting Surface-mount 208-BFQFP exposed-pad package (supplier device package: 208-RQFP, 28×28) for PCB integration and robust board attachment.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 70 °C.
• RoHS Compliant Device is RoHS compliant.

Typical Applications

• Embedded Control Systems Use the EPF10K20RC208-3 to implement custom control logic, state machines, and peripheral interfaces in commercial embedded products.
• Memory and Buffering Functions Leverage the device’s embedded RAM blocks for temporary data storage, buffering, and FIFO implementations within larger systems.
• Interface Bridging and Glue Logic Deploy as protocol adaptation and glue logic between 5.0-V legacy peripherals and modern system logic using its 147 I/Os and 5 V supply compatibility.
• Prototyping and System Integration Implement SOPC-style megafunctions and combine specialized logic and memory to validate system architectures and accelerate development.

Unique Advantages

• Balanced Logic and Memory Combines 1,152 logic elements with approximately 12,288 bits of embedded RAM to support mixed logic-plus-data designs without external memory for some functions.
• Mid-density Gate Count Approximately 63,000 gates provides sufficient capacity for multi-function designs while keeping package and board complexity manageable.
• Comprehensive I/O 147 user I/Os deliver flexibility to connect multiple peripherals, buses, and sensors directly to the FPGA fabric.
• Commercial Temperature Suitability Rated for 0 °C to 70 °C operation and commercial-grade applications, making it suitable for consumer and general-purpose embedded designs.
• Proven Family-Level Features Benefits from FLEX 10K family capabilities such as JTAG boundary-scan and in-circuit reconfigurability to simplify board-level testing and configuration workflows.
• Compact Surface-Mount Package 208-BFQFP exposed-pad surface-mount package supports dense PCB layouts and reliable mounting for production deployments.

Why Choose EPF10K20RC208-3?

The EPF10K20RC208-3 positions itself as a practical mid-density FLEX-10K FPGA for commercial embedded designs that require a balance of programmable logic, embedded RAM, and plentiful I/O in a compact surface-mount package. Its combination of 1,152 logic elements, approximately 12,288 bits of on-chip memory, and 147 I/Os makes it well suited for glue logic, interface bridging, and embedded function consolidation in 5.0-V systems.

For engineering teams seeking scalable integration and family-level FPGA capabilities—such as JTAG boundary-scan and in-circuit reconfigurability—this device offers a tested platform with commercial-grade temperature range and RoHS compliance to support production designs.

Request a quote or submit an inquiry to get pricing and availability information for the EPF10K20RC208-3.