EPF10K20RC240-3

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1152 240-BFQFP Exposed Pad

Quantity 1,154 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20RC240-3 – FLEX-10K FPGA, 1,152 logic elements, 12,288 RAM bits, 189 I/O, 240-BFQFP

The EPF10K20RC240-3 is an Intel FLEX-10K family field programmable gate array (FPGA) in a 240-BFQFP exposed pad package. It pairs a dedicated logic array with embedded memory resources to implement programmable logic and megafunctions for commercial embedded designs.

With 1,152 logic elements, 12,288 bits of on-chip RAM and 189 user I/O pins, this device targets designs that require moderate logic density, significant on-chip memory and a high pin-count footprint while operating from a 5.0 V supply range.

Key Features

  • Embedded programmable logic architecture  System-on-a‑programmable‑chip (SOPC) family architecture with separate embedded array and logic array to implement megafunctions and general logic functions.
  • Logic capacity  1,152 logic elements (LEs) providing the programmable logic resource for mid-density designs.
  • On-chip memory  Approximately 12,288 bits of embedded RAM distributed across the device for efficient implementation of FIFOs, buffers and small data stores.
  • I/O and routing  189 user I/O pins to support complex interfacing; FastTrack® continuous routing structure and dedicated carry/cascade chains for predictable, high-speed logic paths (family feature).
  • Supply and thermal  Designed for 5.0 V operation with a specified voltage range of 4.75 V to 5.25 V and a commercial operating temperature range of 0 °C to 70 °C.
  • Package and mounting  240-BFQFP exposed pad surface-mount package (supplier package: 240-RQFP, 32×32) for dense PCB layout with thermal pad support.
  • Programming and test  Family features include in-circuit reconfigurability (ICR) via external configuration device or JTAG and IEEE 1149.1 boundary-scan test circuitry (family feature).
  • Regulatory and handling  RoHS compliant and supplied as a surface-mount commercial-grade device.

Typical Applications

  • Embedded system integration  Implement SOPC-style integration and custom control logic where moderate logic density and on-chip RAM are required.
  • Interface and I/O aggregation  Use the device’s 189 I/O pins to consolidate multiple peripheral interfaces or bridge between logic domains on a single chip.
  • Memory‑aware logic blocks  Deploy the 12,288 bits of embedded RAM for small buffering, lookup tables or temporary data storage within programmable logic.
  • Prototyping and commercial products  Commercial-grade designs that need field-programmable flexibility, reconfigurability and a high-pin-count packaged device.

Unique Advantages

  • Balanced logic and memory resources: 1,152 logic elements paired with 12,288 bits of embedded RAM enables combined logic-plus-memory megafunctions without external memory in many designs.
  • High I/O count: 189 user I/O pins support complex board-level integration and multiple peripheral connections from a single device.
  • 5.0 V supply compatibility: Specified 4.75 V to 5.25 V operation simplifies integration into 5 V commercial platforms.
  • In-system programmability and testability: Family-level support for in-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan test facilitates development and manufacturing test flows.
  • Thermal-friendly package: 240-BFQFP with exposed pad supports PCB thermal management while keeping a compact footprint.
  • RoHS compliant commercial part: Meets RoHS environmental requirements for commercial electronics production.

Why Choose EPF10K20RC240-3?

The EPF10K20RC240-3 delivers a mid-density FLEX-10K FPGA solution that combines 1,152 logic elements, substantial embedded RAM and an extensive I/O count in a 240-pin exposed-pad package. It is well suited for commercial embedded applications that require reconfigurable logic, on-chip memory and a high number of external interfaces while operating on a 5.0 V supply.

This device appeals to designers who need a programmable, testable and RoHS-compliant FPGA option for consolidating logic functions, implementing megafunctions and simplifying board-level integration with in-system reconfigurability and boundary-scan support.

Request a quote or submit a technical inquiry to receive pricing, availability and lead-time information for the EPF10K20RC240-3.

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