EPF10K20RC240-3N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1152 240-BFQFP Exposed Pad

Quantity 1,584 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20RC240-3N – FLEX-10K Field Programmable Gate Array (FPGA) IC

The EPF10K20RC240-3N is a FLEX-10K family field programmable gate array designed for commercial embedded logic applications. It combines a mid-range logic array with embedded memory to deliver reprogrammable system integration in a 240-pin exposed-pad QFP package.

With 1,152 logic elements, 12,288 bits of on-chip RAM and up to 189 user I/Os, this device is suited to designs that require moderate gate density, significant I/O count and in-circuit reconfigurability. It operates from a 4.75 V to 5.25 V supply and is specified for commercial temperature ranges (0 °C to 70 °C).

Key Features

  • Logic Capacity — 1,152 logic elements and 144 logic array blocks provide the programmable resources for medium-complexity digital designs.
  • On-Chip Memory — 12,288 total RAM bits of embedded memory for implementing buffers, FIFOs and other megafunctions without external RAM.
  • I/O Density — Up to 189 user I/O pins to support multiple parallel interfaces, peripherals and external devices.
  • Gate Count — Typical/system gate capability up to 63,000 gates for combined logic and RAM usage.
  • Supply & Power — Designed for 4.75 V to 5.25 V operation, compatible with 5.0 V system domains.
  • Package & Mounting — 240-BFQFP package with exposed pad (supplier package: 240-RQFP, 32×32); surface-mount mounting for PCB assembly.
  • Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for general-purpose commercial electronics.
  • Reconfiguration & Test — Supports in-circuit reconfigurability via external configuration device or JTAG; built-in IEEE Std. 1149.1 JTAG boundary-scan test circuitry.
  • Advanced Interconnect & Arithmetic Support — Series-level features include dedicated carry and cascade chains, FastTrack interconnect for predictable routing, and global clock/clear resources to simplify high-performance arithmetic and clocking structures.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • System Integration / SOPC — Consolidate custom glue logic, peripheral interfaces and embedded memory into a single programmable device for prototype and production systems.
  • Interface and I/O Bridging — Use the 189 I/Os to implement parallel interface bridging, protocol conversion and multi-peripheral control on a single device.
  • Embedded Memory Functions — Implement on-chip FIFOs, small buffers and lookup tables using the 12,288 bits of embedded RAM to reduce external memory needs.
  • Mid-Range Digital Logic — Implement counters, state machines, arithmetic blocks and control logic within the 1,152 logic elements for moderate-complexity applications.

Unique Advantages

  • Balanced Logic and Memory: Combines 1,152 logic elements with 12,288 bits of RAM to deliver both programmable logic and embedded memory on one device, simplifying board-level design.
  • High I/O Count: Up to 189 user I/Os enable direct connection to multiple peripherals and external devices without extensive multiplexing.
  • Standard 5 V Supply: Operates from a 4.75 V to 5.25 V supply, making it straightforward to integrate into existing 5.0 V commercial systems.
  • In-Circuit Reconfigurability and Test: Supports external configuration and JTAG boundary-scan for flexible deployment and streamlined manufacturing test.
  • Surface-Mount QFP Package: 240-pin BFQFP with exposed pad provides a compact, manufacturable package option for dense PCB layouts.
  • Vendor Toolchain Support: Part of the FLEX 10K family with series-level tool support for design entry and automatic place-and-route, aiding development productivity.

Why Choose EPF10K20RC240-3N?

The EPF10K20RC240-3N positions itself as a mid-range FLEX-10K FPGA option for commercial embedded designs that need a mix of programmable logic, embedded RAM and substantial I/O in a compact QFP package. Its combination of 1,152 logic elements, 12,288 bits of on-chip RAM and 189 I/Os fits a wide range of applications where system integration and reconfigurability are priorities.

Delivered in a 240-pin exposed-pad surface-mount package and specified for 5 V systems and commercial temperature ranges, this device provides a practical, reprogrammable building block for designers focused on reducing board-level complexity while retaining the flexibility to iterate and reconfigure designs during development and production.

Request a quote or submit an RFQ to get pricing and availability for the EPF10K20RC240-3N.

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