EPF10K20RI208-4
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1152 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 679 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-RQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 147 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 144 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 63000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K20RI208-4 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1152 208-BFQFP Exposed Pad
The EPF10K20RI208-4 is an Intel FLEX-10K family field programmable gate array supplied in a 208-BFQFP package with exposed pad for thermal performance. As an embedded programmable logic device, it combines a dedicated logic array and embedded memory resources to implement custom logic, interface bridging, and system-level megafunctions.
Targeted for industrial applications, this surface-mount device provides 1,152 logic elements, approximately 12,288 bits of on-chip RAM and 147 user I/O pins, operating from a 4.5 V to 5.5 V supply and across an industrial temperature range of −40 °C to 85 °C.
Key Features
- Logic Capacity — 1,152 logic elements and 63,000 typical system gates provide space for mid-density combinational and sequential logic implementations.
- Embedded Memory — Approximately 12,288 bits of embedded RAM suitable for small FIFOs, state storage and megafunctions.
- I/O Resources — 147 user I/O pins for peripheral interfacing and board-level connectivity.
- Package & Mounting — 208-BFQFP with exposed pad (supplier package 208-RQFP, 28 × 28) designed for surface-mount PCB assembly and improved thermal conduction.
- Power and Temperature — Supply voltage range of 4.5 V to 5.5 V and industrial operating temperature from −40 °C to 85 °C.
- Reconfigurability & Test — Series-level FLEX 10K family features include in-circuit reconfigurability via external configuration device or JTAG and built-in JTAG boundary-scan test circuitry for board testability.
- Clocking and Arithmetic Support — FLEX 10K family architecture provides dedicated carry and cascade chains plus low-skew clock distribution to support arithmetic functions and multi-clock designs.
- Compliance — RoHS-compliant manufacturing.
Typical Applications
- Industrial Control — Implements custom control logic, state machines and peripheral glue logic for factory automation and process control equipment.
- Embedded Systems — Integrates on-chip RAM and programmable logic for system-on-a-programmable-chip (SOPC) style functions and specialized megafunctions.
- Interface & I/O Bridging — Provides flexible I/O resources and reconfigurable logic for protocol translation, bus interfacing and custom communication endpoints.
- Prototyping & Low- to Mid-density Designs — Suitable for development and deployment of mid-density FPGA-based designs that require reprogrammability and moderate logic/memory resources.
Unique Advantages
- Balanced integration: Combines 1,152 logic elements with embedded RAM and 147 I/O pins to consolidate multiple discrete functions into a single FPGA, reducing BOM and board complexity.
- Industrial temperature rating: Specified for −40 °C to 85 °C operation, enabling deployments in temperature-challenging environments.
- Exposed-pad BFQFP package: The 208-pin exposed-pad package supports effective PCB-level thermal management for sustained operation.
- Reconfigurability and testability: In-circuit reconfigurability and built-in JTAG boundary-scan improve development flexibility and simplify production test flows.
- Practical supply range: Operates from 4.5 V to 5.5 V, aligning with common 5 V system rails used in industrial and legacy designs.
- RoHS-compliant: Meets environmental and regulatory requirements for lead-free manufacturing processes.
Why Choose EPF10K20RI208-4?
The EPF10K20RI208-4 delivers a practical mid-density FPGA option within the FLEX 10K family for engineers who need on-chip RAM, flexible I/O and reconfigurable logic in a thermally-efficient BFQFP package. Its industrial temperature range, 5 V supply compatibility and built-in testability make it appropriate for embedded and control applications where reliability and board-level integration are important.
This device is well suited to teams designing industrial controllers, interface bridges, and SOPC-style embedded functions who require a proven programmable-logic architecture combined with manageable resource counts and straightforward thermal mounting.
Request a quote or submit an inquiry to receive pricing, availability and support information for EPF10K20RI208-4. Our team can provide lead times, ordering guidance and packaging details to help move your design forward.

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