EPF10K20TC144-3

IC FPGA 102 I/O 144TQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 102 12288 1152 144-LQFP

Quantity 742 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20TC144-3 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 102 I/O • 12,288 RAM bits • 1,152 logic elements • 144-LQFP

The EPF10K20TC144-3 is a FLEX 10K family embedded programmable logic device from Intel. It combines a dedicated logic array and embedded memory to deliver a reconfigurable platform for system-level integration in commercial embedded designs.

With 1,152 logic elements, approximately 12,288 bits of embedded RAM, and 102 user I/O pins in a 144-pin LQFP surface-mount package, this device targets system-on-a-programmable-chip integration, glue-logic consolidation, and memory- or interface-heavy programmable functions where a 5.0 V supply and commercial temperature range are required.

Key Features

  • Core Logic 1,152 logic elements and 144 logic array blocks (LABs) provide configurable logic resources for combinational and sequential functions.
  • Gate Capacity Up to 63,000 system gates as indicated for this device class, enabling medium-density programmable implementations.
  • Embedded Memory Approximately 12,288 bits of on-chip RAM distributed across embedded array blocks to support buffering, FIFOs, and small on-chip data storage.
  • I/O and Interface 102 user I/O pins available for parallel interfaces, control signals, and peripheral connections; I/O features described for the FLEX 10K family include programmable output slew-rate, individual tri-state control, and open-drain options.
  • Configurability and Test In-circuit reconfigurability via external configuration device or JTAG; built-in IEEE 1149.1 JTAG boundary-scan circuitry enables board-level test without consuming device logic.
  • Clock and Performance Options Family features include low-skew clock distribution trees and optional ClockLock/ClockBoost features for reduced clock delay/skew and clock multiplication.
  • Power and Supply Designed for a 5.0 V supply range (4.75 V to 5.25 V) to support legacy and 5 V-based systems.
  • Package & Mounting 144-LQFP surface-mount package (supplier package: 144-TQFP, 20×20) for straightforward PCB assembly and moderate board density.
  • Commercial Temperature & Compliance Commercial operating temperature range of 0 °C to 70 °C and RoHS compliant per supplied product data.

Typical Applications

  • Embedded Control and SOPC Integration Use for system-on-a-programmable-chip designs that require integrated programmable logic and embedded memory for control and peripheral management.
  • Interface Bridging and Glue Logic Consolidate multiple discrete interface components by implementing custom protocol bridging, bus interfacing, and timing adaptation.
  • On-Board Memory and Buffering Implement small FIFOs, buffers, and temporary data storage using the device’s embedded RAM to reduce external memory needs.
  • Prototyping and Functional Validation Medium-density logic resource set and JTAG support make this device suitable for prototype systems, functional validation, and development platforms.

Unique Advantages

  • Medium-density integration: 1,152 logic elements and up to 63,000 system gates enable consolidation of glue logic and control functions into a single device, reducing BOM and board complexity.
  • Embedded memory for compact designs: Approximately 12,288 bits of on-chip RAM support buffering and local data storage without adding external components.
  • Flexible I/O in a compact package: 102 user I/O pins in a 144-LQFP surface-mount package provide a balance of I/O count and board-space efficiency for commercial designs.
  • Configurable and testable: In-circuit reconfigurability and built-in JTAG boundary-scan simplify firmware updates and board-level testing, accelerating development and maintenance.
  • 5 V system compatibility: Operates from 4.75 V to 5.25 V, making it suitable for legacy 5 V platforms and mixed-voltage environments that require a 5 V supply.
  • Commercial-grade reliability: Rated for 0 °C to 70 °C operation and RoHS compliant, aligning with standard commercial embedded product requirements.

Why Choose EPF10K20TC144-3?

The EPF10K20TC144-3 delivers a balanced mix of configurable logic, embedded memory, and I/O in a compact 144-LQFP package—making it a practical choice for commercial embedded systems that need medium-density programmable logic and on-chip RAM. Its 5.0 V supply compatibility and JTAG-enabled reconfiguration support provide flexibility for legacy and in-field update scenarios.

This device is well suited to designers who need a reliable, reprogrammable platform for interface consolidation, control logic, buffering, and prototype development while maintaining straightforward supply and package choices. The FLEX 10K family features integrated clocking options and testability that help accelerate development and simplify system integration.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for EPF10K20TC144-3. Our team can provide details to help specify this device into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up