EPF10K20TC144-3
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 102 12288 1152 144-LQFP |
|---|---|
| Quantity | 742 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 102 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 144 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 63000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K20TC144-3 – FLEX-10K® Field Programmable Gate Array (FPGA) IC 102 I/O • 12,288 RAM bits • 1,152 logic elements • 144-LQFP
The EPF10K20TC144-3 is a FLEX 10K family embedded programmable logic device from Intel. It combines a dedicated logic array and embedded memory to deliver a reconfigurable platform for system-level integration in commercial embedded designs.
With 1,152 logic elements, approximately 12,288 bits of embedded RAM, and 102 user I/O pins in a 144-pin LQFP surface-mount package, this device targets system-on-a-programmable-chip integration, glue-logic consolidation, and memory- or interface-heavy programmable functions where a 5.0 V supply and commercial temperature range are required.
Key Features
- Core Logic 1,152 logic elements and 144 logic array blocks (LABs) provide configurable logic resources for combinational and sequential functions.
- Gate Capacity Up to 63,000 system gates as indicated for this device class, enabling medium-density programmable implementations.
- Embedded Memory Approximately 12,288 bits of on-chip RAM distributed across embedded array blocks to support buffering, FIFOs, and small on-chip data storage.
- I/O and Interface 102 user I/O pins available for parallel interfaces, control signals, and peripheral connections; I/O features described for the FLEX 10K family include programmable output slew-rate, individual tri-state control, and open-drain options.
- Configurability and Test In-circuit reconfigurability via external configuration device or JTAG; built-in IEEE 1149.1 JTAG boundary-scan circuitry enables board-level test without consuming device logic.
- Clock and Performance Options Family features include low-skew clock distribution trees and optional ClockLock/ClockBoost features for reduced clock delay/skew and clock multiplication.
- Power and Supply Designed for a 5.0 V supply range (4.75 V to 5.25 V) to support legacy and 5 V-based systems.
- Package & Mounting 144-LQFP surface-mount package (supplier package: 144-TQFP, 20×20) for straightforward PCB assembly and moderate board density.
- Commercial Temperature & Compliance Commercial operating temperature range of 0 °C to 70 °C and RoHS compliant per supplied product data.
Typical Applications
- Embedded Control and SOPC Integration Use for system-on-a-programmable-chip designs that require integrated programmable logic and embedded memory for control and peripheral management.
- Interface Bridging and Glue Logic Consolidate multiple discrete interface components by implementing custom protocol bridging, bus interfacing, and timing adaptation.
- On-Board Memory and Buffering Implement small FIFOs, buffers, and temporary data storage using the device’s embedded RAM to reduce external memory needs.
- Prototyping and Functional Validation Medium-density logic resource set and JTAG support make this device suitable for prototype systems, functional validation, and development platforms.
Unique Advantages
- Medium-density integration: 1,152 logic elements and up to 63,000 system gates enable consolidation of glue logic and control functions into a single device, reducing BOM and board complexity.
- Embedded memory for compact designs: Approximately 12,288 bits of on-chip RAM support buffering and local data storage without adding external components.
- Flexible I/O in a compact package: 102 user I/O pins in a 144-LQFP surface-mount package provide a balance of I/O count and board-space efficiency for commercial designs.
- Configurable and testable: In-circuit reconfigurability and built-in JTAG boundary-scan simplify firmware updates and board-level testing, accelerating development and maintenance.
- 5 V system compatibility: Operates from 4.75 V to 5.25 V, making it suitable for legacy 5 V platforms and mixed-voltage environments that require a 5 V supply.
- Commercial-grade reliability: Rated for 0 °C to 70 °C operation and RoHS compliant, aligning with standard commercial embedded product requirements.
Why Choose EPF10K20TC144-3?
The EPF10K20TC144-3 delivers a balanced mix of configurable logic, embedded memory, and I/O in a compact 144-LQFP package—making it a practical choice for commercial embedded systems that need medium-density programmable logic and on-chip RAM. Its 5.0 V supply compatibility and JTAG-enabled reconfiguration support provide flexibility for legacy and in-field update scenarios.
This device is well suited to designers who need a reliable, reprogrammable platform for interface consolidation, control logic, buffering, and prototype development while maintaining straightforward supply and package choices. The FLEX 10K family features integrated clocking options and testability that help accelerate development and simplify system integration.
Request a quote or submit an inquiry to receive pricing, availability, and technical support information for EPF10K20TC144-3. Our team can provide details to help specify this device into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018