EPF10K20RI240-4
| Part Description |
FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1152 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 269 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 189 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 144 | Number of Logic Elements/Cells | 1152 | ||
| Number of Gates | 63000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 12288 |
Overview of EPF10K20RI240-4 – FLEX-10K FPGA, 1,152 Logic Elements, 12,288-bit RAM, 189 I/Os
The EPF10K20RI240-4 is an industrial-grade FLEX-10K field programmable gate array (FPGA) packaged in a 240-BFQFP exposed-pad surface-mount package. It combines a logic array and embedded memory resources to implement custom logic, megafunctions and system-level integration in industrial and embedded applications.
With 1,152 logic elements, approximately 12,288 bits of embedded RAM and 189 user I/O pins, this device targets I/O-rich designs that require on-chip memory and flexible logic resources while operating from a 4.5 V to 5.5 V supply over a –40 °C to 85 °C temperature range.
Key Features
- Logic Capacity 1,152 logic elements and 144 logic array blocks (LABs) provide the programmable fabric for custom logic and control functions.
- Embedded Memory Total on-chip RAM of 12,288 bits to implement buffers, small FIFOs or other embedded data storage without external memory.
- I/O Resources 189 user I/O pins support high pin-count interfaces and dense peripheral connectivity in a single device.
- Gate Count Maximum system gates: 63,000 (as designated for this device class), enabling substantial logic integration for mid-range FPGA designs.
- Power and Supply Designed to operate from a 4.5 V to 5.5 V supply rail to suit 5.0-V signaling environments.
- Package and Mounting 240-BFQFP exposed pad, surface-mount package (supplier package: 240-RQFP 32×32) for board-level thermal performance and manufacturability.
- Industrial Temperature Grade Specified operating range of –40 °C to 85 °C for deployment in industrial applications.
- Test and Configuration Support Includes built-in JTAG boundary-scan (IEEE 1149.1) test capability as described for the FLEX 10K family.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Custom control logic, sequencing, and I/O aggregation in industrial automation where industrial temperature operation and robust I/O are required.
- Embedded System Integration System-on-a-programmable-chip style integration to combine logic, glue logic, and modest embedded memory for compact system designs.
- High-Density I/O Interfaces I/O-rich front-end or peripheral interfaces that benefit from 189 user-accessible pins for sensor arrays, protocol bridging, or custom bus implementations.
- Prototyping and Functional Emulation Hardware prototyping of mid-range designs that require reconfigurable logic and on-chip RAM for iterative development and testing.
Unique Advantages
- Balanced Logic and Memory: 1,152 logic elements paired with 12,288 bits of embedded RAM allow efficient implementation of control logic alongside local data storage without immediate reliance on external memory.
- High I/O Count: 189 user I/Os let you consolidate multiple interfaces into a single device, reducing board-level complexity and BOM.
- Industrial Temperature Range: Rated for –40 °C to 85 °C, making the device suitable for a wide range of industrial environments.
- Surface-Mount Exposed-Pad Package: 240-BFQFP exposed pad aids board-level thermal management while maintaining a compact footprint for assembly.
- On-board Testability: Built-in JTAG boundary-scan support facilitates board-level test and in-circuit configuration checks.
- Regulatory Compliance: RoHS compliance simplifies design decisions for environmentally conscious manufacturing requirements.
Why Choose EPF10K20RI240-4?
The EPF10K20RI240-4 positions itself as a rugged, mid-range FLEX-10K FPGA option for designers who need a balance of programmable logic, embedded RAM, and a high I/O count in an industry-temperature-rated, surface-mount package. Its combination of 1,152 logic elements, approximately 12 kbits of embedded memory and 189 I/Os enables integration of control, interface and buffering functions that reduce external component count and simplify board design.
This device is well suited to engineers developing industrial controls, embedded systems, and I/O-dense applications that require proven boundary-scan testability, RoHS compliance, and compatibility with the FLEX 10K family design resources referenced in the device documentation.
Request a quote or submit an inquiry to receive pricing and availability information and start evaluating the EPF10K20RI240-4 for your next design.

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