EPF10K20RC240-4

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1152 240-BFQFP Exposed Pad

Quantity 1,644 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20RC240-4 – FLEX-10K® Field Programmable Gate Array (FPGA), 1,152 logic elements, 12,288 bits RAM, 189 I/O, 240-BFQFP

The EPF10K20RC240-4 is a FLEX 10K family field programmable gate array (embedded programmable logic device) designed for mid-range logic integration and system-level functionality. It combines 1,152 logic elements, 12,288 bits of embedded RAM, and up to 189 user I/O pins to address applications that require moderate logic density, on-chip memory and abundant I/O connectivity.

Built for commercial-grade applications with a 4.75 V to 5.25 V supply and an operating range of 0 °C to 70 °C, this surface-mount device in a 240-pin BFQFP package with exposed pad offers reconfigurable logic and embedded array resources for custom logic, interface bridging, and system integration tasks.

Key Features

  • Logic Capacity — 1,152 logic elements (LEs) and 144 logic array blocks (LABs) provide the programmable logic resources to implement custom combinational and sequential functions.
  • On-chip Memory — Approximately 12,288 bits of embedded RAM distributed across 6 embedded array blocks (EABs), enabling efficient implementation of buffers, FIFOs and small data stores without reducing logic capacity.
  • Gate Equivalence — Up to 63,000 maximum system gates for estimating integration level when combining logic and RAM.
  • I/O Density — 189 user I/O pins for extensive external interfacing and parallel connectivity in I/O-rich designs.
  • Power and Supply — Designed for a 4.75 V to 5.25 V supply range suited to 5.0-V systems.
  • Configuration and Test — Supports in-circuit reconfigurability via external configuration device, intelligent controller, or JTAG port; includes JTAG boundary-scan test (IEEE Std. 1149.1) without consuming device logic.
  • Interconnect and Arithmetic Support — Family-level features include dedicated carry and cascade chains and a FastTrack continuous routing interconnect structure for predictable routing behavior and high-fan-in arithmetic implementations.
  • Package and Mounting — Surface-mount 240-BFQFP with exposed pad (supplier package 240-RQFP 32×32) for PCB assembly and thermal path to the board.
  • Commercial Grade and Environmental — Commercial operating grade with a specified temperature range of 0 °C to 70 °C and RoHS-compliant material status.

Typical Applications

  • System Integration / SOPC — Use the embedded array blocks and logic elements to implement megafunctions and combine multiple system functions on a single programmable device.
  • Interface Bridge and Protocol Glue — High I/O count and reconfigurability make the device well suited for protocol conversion, bus interfacing and glue logic between subsystems.
  • Embedded Memory and Buffering — On-chip RAM resources support buffering, FIFOs and small data storage for peripherals and data-path designs.
  • Prototyping and Custom Logic — The combination of logic elements and reconfiguration options enables rapid prototyping of custom digital logic and iterative design cycles.

Unique Advantages

  • Balanced Logic and Memory — 1,152 logic elements paired with 12,288 bits of embedded RAM let you implement control logic and local data storage without external memory in many designs.
  • Rich External Connectivity — 189 user I/O pins support multiple parallel interfaces, sensors, and peripheral connections, reducing the need for external I/O expanders.
  • Reconfigurable Testability — JTAG boundary-scan and in-circuit reconfiguration simplify board-level testing and firmware updates without using user logic resources.
  • Predictable Integration Planning — Published gate equivalence (up to 63,000 system gates) and LAB/LE counts provide clear metrics for capacity planning and migration within the FLEX 10K family.
  • PCB-Friendly Package — 240-pin BFQFP with exposed pad supports standard surface-mount assembly and provides a thermal path for moderate power dissipation.

Why Choose EPF10K20RC240-4?

The EPF10K20RC240-4 positions itself as a practical mid-range FLEX 10K FPGA option for designers who need a balanced combination of programmable logic, embedded memory and substantial I/O in a single, reconfigurable device. Its documented logic element and RAM resources, along with family-level features such as dedicated arithmetic chains and JTAG-based testability, make it a dependable choice for custom-control, interface and system integration projects.

This device is suitable for commercial-temperature designs where on-chip memory and flexible I/O routing reduce external component count and simplify board-level design. The FLEX 10K family pedigree and documented specifications support straightforward capacity planning and design reuse within related device families.

Request a quote or submit a purchase inquiry for EPF10K20RC240-4 to check availability and pricing details for your design.

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