EPF10K20RC240-4N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1152 240-BFQFP Exposed Pad

Quantity 1,884 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20RC240-4N – FLEX-10K FPGA, 1,152 Logic Elements, 189 I/O, 240-BFQFP

The EPF10K20RC240-4N is a FLEX‑10K family field programmable gate array (FPGA) designed for system-level programmable logic integration. This commercial‑grade, surface‑mount device combines a logic array with embedded memory resources to support System‑on‑a‑Programmable‑Chip (SOPC) style designs and custom logic functions.

With 1,152 logic elements, 12,288 bits of embedded RAM and up to 189 user I/O pins in a 240‑pin BFQFP package with exposed pad, the device targets embedded systems and application designs that require mid‑density programmable logic with 5 V supply operation and standard commercial temperature range.

Key Features

  • Core Logic 1,152 logic elements (LEs) and 144 logic array blocks (LABs) providing mid‑range programmable logic capacity and a typical gate count of 63,000.
  • Embedded Memory 12,288 bits of on‑chip RAM for small data buffers, state machines and local storage without external memory.
  • I/O and Interfaces Up to 189 user I/O pins to support a wide mix of external peripherals and parallel/serial interfaces, with individual programmable I/O control available at the FLEX 10K family level.
  • Power Single 5 V supply operation specified from 4.75 V to 5.25 V to support legacy 5 V systems and board designs.
  • Package and Mounting 240‑pin BFQFP with exposed pad (supplier package: 240‑RQFP 32×32) designed for surface‑mount assembly and thermal grounding through the exposed pad.
  • Temperature and Grade Commercial operating range 0 °C to 70 °C and commercial grade designation for mainstream embedded and consumer applications.
  • Standards and Testability Family datasheet notes include built‑in JTAG boundary‑scan test (IEEE 1149.1) available without consuming device logic (FLEX 10K family feature).

Typical Applications

  • Embedded Systems Used to implement control logic, glue logic and custom state machines where mid‑density programmable logic and on‑chip RAM reduce external components.
  • Peripheral Interface and Protocol Bridging Provides flexible I/O and logic resources for interfacing between MCUs, sensors and legacy 5 V peripherals.
  • Prototyping and Development Suitable for hardware validation and iterative development of custom logic functions in a commercial temperature environment.

Unique Advantages

  • Balanced Logic and Memory Combines 1,152 logic elements with 12,288 bits of embedded RAM to implement control logic and local data storage on a single device.
  • Generous I/O Count 189 user I/O pins enable broad connectivity for multi‑signal interfaces without immediate need for external I/O expanders.
  • 5 V Supply Compatibility Specified operation from 4.75 V to 5.25 V supports integration into existing 5 V system architectures.
  • Standard Surface‑Mount Package 240‑pin BFQFP with exposed pad provides a space‑efficient footprint and a grounded thermal pad for board thermal management.
  • Commercial‑Grade Availability Designed for commercial temperature operation (0 °C to 70 °C), making it suitable for consumer and general embedded product lines.
  • RoHS Compliant Meets RoHS requirements for lead‑free manufacturing processes.

Why Choose EPF10K20RC240-4N?

The EPF10K20RC240-4N delivers a practical combination of logic density, embedded RAM and I/O capacity in a single, commercial‑grade FLEX‑10K FPGA package. Its specification for 5 V supply operation, 189 I/Os and a 240‑pin BFQFP package make it a straightforward choice for mid‑range embedded designs that require programmable logic integration without the complexity of higher‑density devices.

This device is well suited for engineers and product teams building consumer and commercial embedded systems, prototype platforms, and interface bridging solutions who need reliable, mid‑density programmable logic with on‑chip memory and a flexible I/O count.

Request a quote or submit a pricing/availability inquiry to check stock and lead times for the EPF10K20RC240-4N.

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