EPF10K20RI240-4N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 12288 1152 240-BFQFP Exposed Pad

Quantity 471 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20RI240-4N – FLEX-10K FPGA, 1,152 Logic Elements, 12,288-bit RAM, 240-BFQFP

The EPF10K20RI240-4N is a FLEX-10K field programmable gate array (FPGA) IC from Intel designed for industrial embedded and system-level applications. It combines a logic array and embedded memory to support System-on-a-Programmable-Chip (SOPC) integration, in-circuit reconfiguration, and boundary-scan testability for flexible hardware implementation and rapid design iteration.

Key Features

  • Logic Capacity — 1,152 logic elements providing programmable logic resources for glue logic, control paths, and custom datapaths.
  • Embedded Memory — 12,288 total RAM bits implemented across the device’s embedded array blocks for on-chip buffering and small memory structures.
  • Gate Density — 63,000 system gates supported, enabling medium-density integration of logic and RAM.
  • I/O and Voltage — 189 user I/O pins and a 4.5 V to 5.5 V supply window suitable for 5.0-V system domains listed for this device.
  • Configuration and Test — In-circuit reconfigurability (ICR) and IEEE 1149.1 JTAG boundary-scan for device programming, debug, and board-level test without consuming user logic.
  • High-performance Routing — FastTrack continuous routing structure with dedicated carry and cascade chains to support efficient arithmetic and wide-fan-in logic implementations.
  • Clocking Options — Built-in low-skew clock distribution with options including ClockLock and ClockBoost for reduced clock delay/skew and clock multiplication.
  • Package & Mounting — 240-BFQFP exposed pad, surface-mount package (supplier device package: 240-RQFP (32×32)) for board-level thermal and assembly considerations.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C to meet industrial application environments.
  • Low-power Standby — Datasheet notes low-power consumption in standby for typical FLEX 10K devices, enabling reduced power draw during idle states.

Typical Applications

  • Embedded Control & SOPC — Use as the programmable logic element in system-on-a-programmable-chip designs where on-chip memory and reconfigurable logic reduce external components.
  • Industrial Automation — Implement motor control sequencing, I/O aggregation, and custom control logic within the device’s industrial temperature range and 189 I/O pins.
  • Prototyping & Development — Rapid hardware prototyping and iterative logic refinement using in-circuit reconfiguration and JTAG boundary-scan.
  • Peripheral Glue Logic — Integrate interface translation, bus glue, and custom peripheral logic leveraging dedicated carry/cascade chains and abundant I/O.
  • PCI and Bus-based Systems — Support for legacy bus system integration as described for FLEX 10K devices in the family data, useful in system-level designs requiring bus interfaces.

Unique Advantages

  • Compact integration of logic and memory: 1,152 logic elements combined with 12,288 bits of embedded RAM reduce the need for external RAM and discrete logic ICs.
  • Robust industrial readiness: Surface-mount 240-BFQFP package with exposed pad and −40 °C to 85 °C operating range suited for industrial deployments.
  • Extensive I/O capability: 189 user I/O pins allow flexible interfacing to sensors, peripherals, and external buses without additional multiplexing hardware.
  • Configurable clock and routing infrastructure: Low-skew clock trees, ClockLock/ClockBoost options, and FastTrack interconnect enable predictable timing for synchronous designs.
  • Design, configuration, and test support: In-circuit reconfigurability plus IEEE 1149.1 JTAG boundary-scan facilitate programming, debugging, and board-level test without using user logic.
  • Dedicated arithmetic resources: Built-in carry and cascade chains accelerate implementation of adders, counters, and wide logic functions while streamlining place-and-route.

Why Choose EPF10K20RI240-4N?

The EPF10K20RI240-4N is positioned for designers who need a reconfigurable, medium-density FPGA with embedded memory and broad I/O capability in an industrial-grade package. Its combination of 1,152 logic elements, 12,288 bits of RAM, and 189 I/O pins makes it well suited for embedded systems, industrial control, and bus-interface applications where in-system programmability and testability are important.

Supported by the FLEX 10K family design ecosystem, this device offers software design support and automatic place-and-route tools to accelerate development and deployment. Choose the EPF10K20RI240-4N when you need a reliable, reconfigurable logic element that balances integration, configurability, and industrial temperature performance.

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