EPF10K20RI208-4N

IC FPGA 147 I/O 208RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 147 12288 1152 208-BFQFP Exposed Pad

Quantity 1,226 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-RQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O147Voltage4.5 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells1152
Number of Gates63000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits12288

Overview of EPF10K20RI208-4N – FLEX-10K® Field Programmable Gate Array (FPGA) IC, 1,152 LEs, 12,288 bits RAM, 147 I/O, 208-BFQFP

The EPF10K20RI208-4N is a FLEX 10K family embedded programmable logic device that combines a logic array and embedded memory to implement system-level functions. It targets embedded control, glue-logic and system integration tasks where a mid-density FPGA with on-chip RAM and a high I/O count is required.

Designed for industrial environments, this device provides 1,152 logic elements, 12,288 bits of embedded RAM, up to 147 user I/Os and a supply range centered on 5 V, enabling integration into legacy 5.0-V systems while supporting in-circuit reconfigurability and boundary-scan test.

Key Features

  • Core Capacity — 1,152 logic elements and 144 logic array blocks (LABs) delivering a flexible mid-range FPGA resource set for implementing control, state machines and glue logic.
  • Embedded Memory — 12,288 total RAM bits for on-chip buffering, small FIFOs and lookup tables to reduce external memory requirements.
  • I/O and Connectivity — 147 user I/O pins to support dense peripheral interfacing and board-level routing for mixed-signal and digital subsystems.
  • Gate Scale — Maximum system gates listed as 63,000, enabling implementation of sizeable combinational and sequential logic functions within the FLEX 10K architecture.
  • Power and Voltage — Supports a supply range of 4.5 V to 5.5 V appropriate for 5.0-V systems.
  • Package and Mounting — 208-BFQFP exposed pad package (supplier device package: 208-RQFP 28×28) with surface-mount capability for standard PCB assembly.
  • Temperature Rating — Industrial-grade operation from −40 °C to 85 °C for deployment in demanding ambient conditions.
  • Series-Level System Features — Built-in JTAG boundary-scan support, FastTrack interconnect, dedicated carry and cascade chains, and options such as ClockLock and ClockBoost available across the FLEX 10K series to assist predictable timing and high-speed arithmetic functions.
  • Compliance — RoHS-compliant.

Typical Applications

  • Industrial Control — Implement motor control logic, sensor interfacing and deterministic state machines that require industrial temperature operation and robust I/O counts.
  • Embedded System Integration — Act as a system-on-a-programmable-chip (SOPC) element to integrate peripheral logic, on-chip RAM-based buffers and glue between processors and external peripherals.
  • Peripheral and I/O Expansion — Provide protocol translation, multiplexing/demultiplexing and I/O expansion for legacy 5 V systems and mixed-voltage boards.
  • Prototyping and Low-to-Mid Density Logic — Rapidly implement and iterate digital designs that require modest logic density and on-chip memory without immediate external memory dependencies.

Unique Advantages

  • Balanced Resource Set: Mid-range logic (1,152 logic elements) with 12,288 bits of embedded RAM suits designs that need a mix of control logic and on-chip buffering without excess cost or board-level memory.
  • High I/O Count: 147 user I/Os enable direct interfacing to multiple peripherals and sensors, reducing the need for external I/O expanders.
  • Industrial Temperature Support: Rated for −40 °C to 85 °C, providing reliable operation in industrial and outdoor applications.
  • 5 V System Compatibility: A 4.5 V to 5.5 V supply range aligns the device with 5.0-V system architectures common in retrofit and legacy equipment.
  • Series-Level Design Tools and Features: FLEX 10K architectural features such as FastTrack routing, dedicated arithmetic chains and JTAG boundary-scan help accelerate design closure and testability.
  • Compact, Surface-Mount Package: 208-BFQFP exposed pad package provides a balance of pin count and board footprint for medium-density implementations.

Why Choose EPF10K20RI208-4N?

The EPF10K20RI208-4N positions itself as a mid-density FLEX 10K device that combines a practical mix of logic, embedded RAM and a high I/O count within a 208-pin BFQFP package. Its industrial temperature rating and 5 V-oriented supply make it suitable for retrofit, industrial control and embedded integration tasks where board-level simplicity and on-chip resources matter.

Engineers seeking a field-programmable solution with modest gate scale, built-in system features from the FLEX 10K family and straightforward surface-mount packaging will find this device appropriate for designs that prioritize integration, testability and I/O flexibility.

Request a quote or submit your project requirements to our sales team to begin evaluating the EPF10K20RI208-4N for your next design.

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