EPF10K20RC208-3N

The EPF10K20RC208-3N is a FLEX 10K family field programmable gate array (FPGA) from Intel intended for embedded programmable logic and system-on-a-programmable-chip (SOPC) integration. It provides a balance of logic capacity, on-chip memory, and I/O density for commercial embedded designs where in-circuit reconfigurability, board-level integration, and flexible I/O are required.

This device combines 1,152 logic elements, approximately 12,288 bits of embedded RAM, and 147 user I/Os in a 208-pin BFQFP exposed-pad surface-mount package, operating from a 4.75 V to 5.25 V supply and rated for commercial temperature ranges.

Key Features

• Core Logic  1,152 logic elements (LEs) providing general-purpose programmable logic capacity; datasheet family characteristics include dedicated carry and cascade chains for arithmetic and high-fan-in functions.
• Embedded Memory  Approximately 12,288 bits of on-chip RAM (embedded array blocks per family specification) for efficient local storage and megafunction implementation.
• I/O and Interface  147 user I/O pins with per-pin control options; family documentation notes MultiVolt I/O interface support and 5.0-V tolerant inputs on related devices.
• Package & Mounting  208-BFQFP exposed-pad package (supplier device package listed as 208-RQFP 28×28) in a surface-mount form factor that aids PCB thermal transfer and board-level assembly.
• Power & Temperature  Single-supply operation specified from 4.75 V to 5.25 V; commercial operating temperature range from 0 °C to 70 °C.
• Configurability & Test  FLEX 10K family devices include in-circuit reconfigurability options and built-in JTAG boundary-scan test circuitry (IEEE Std. 1149.1) as described in the series datasheet.
• Regulatory  RoHS compliant for lead-free application environments.

Typical Applications

• Embedded Systems & SOPC  Implement system-level integration and megafunctions where on-chip RAM and programmable logic simplify board design and consolidate discrete components.
• Peripheral Interfaces  Use as a programmable bridge or interface controller—family documentation indicates PCI Local Bus support for relevant FLEX 10K devices.
• Prototyping & Development  Evaluate and iterate on custom logic, memory-mapped functions, and I/O behavior with in-circuit reconfiguration and JTAG support for debug and testing.
• Control & Glue Logic  Replace complex discrete logic networks with compact, reprogrammable logic and embedded RAM to streamline BOM and accelerate design changes.

Unique Advantages

• Balance of Logic and Memory:  Combines 1,152 logic elements with ~12,288 bits of embedded RAM, enabling compact implementation of control logic plus local storage.
• High I/O Count in a Compact Package:  147 user I/Os in a 208-pin BFQFP exposed-pad package offer board-level density while providing a thermal path for surface-mount applications.
• Built-in Testability and Reconfigurability:  Family-level JTAG boundary-scan and in-circuit reconfiguration features simplify production test and field updates without consuming device logic.
• Commercial-Grade Reliability:  Specified for 0 °C to 70 °C operation and RoHS compliance, suitable for a wide range of commercial embedded applications.
• Simplified Integration:  Support for multi-voltage I/O interfaces and documented system-level features in the FLEX 10K family help reduce external components and integration effort.

Why Choose EPF10K20RC208-3N?

The EPF10K20RC208-3N offers a practical mix of logic density, embedded memory, and I/O capacity in a surface-mount 208-pin BFQFP exposed-pad package for commercial embedded designs. Its FLEX 10K family capabilities—such as in-circuit reconfigurability, JTAG boundary-scan, and dedicated interconnect features—provide engineering flexibility for SOPC-style integration and board-level consolidation.

This device is well suited for designers seeking a commercially graded FPGA with moderate logic and RAM resources, robust test and configuration options, and a high I/O count for peripheral interfacing and system integration.

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